Data-driven electronic packaging structure inverse design with an adaptive surrogate model

S. Liu, Song Xue, Peiyuan Lian, Jianlun Huang, Zhihai Wang, Lihao Ping, Congsi Wang
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Abstract

Purpose The conventional design method relies on a priori knowledge, which limits the rapid and efficient development of electronic packaging structures. The purpose of this study is to propose a hybrid method of data-driven inverse design, which couples adaptive surrogate model technology with optimization algorithm to to enable an efficient and accurate inverse design of electronic packaging structures. Design/methodology/approach The multisurrogate accumulative local error-based ensemble forward prediction model is proposed to predict the performance properties of the packaging structure. As the forward prediction model is adaptive, it can identify respond to sensitive regions of design space and sample more design points in those regions, getting the trade-off between accuracy and computation resources. In addition, the forward prediction model uses the average ensemble method to mitigate the accuracy degradation caused by poor individual surrogate performance. The Particle Swarm Optimization algorithm is then coupled with the forward prediction model for the inverse design of the electronic packaging structure. Findings Benchmark testing demonstrated the superior approximate performance of the proposed ensemble model. Two engineering cases have shown that using the proposed method for inverse design has significant computational savings while ensuring design accuracy. In addition, the proposed method is capable of outputting multiple structure parameters according to the expected performance and can design the packaging structure based on its extreme performance. Originality/value Because of its data-driven nature, the inverse design method proposed also has potential applications in other scientific fields related to optimization and inverse design.
数据驱动的电子封装结构反设计与自适应代理模型
目的传统的设计方法依赖于先验知识,限制了电子封装结构的快速高效发展。本研究的目的是提出一种数据驱动的混合反设计方法,将自适应代理模型技术与优化算法相结合,实现高效、准确的电子封装结构反设计。设计/方法/方法提出了基于多代理累积局部误差的集成前向预测模型来预测封装结构的性能。由于前向预测模型具有较强的自适应能力,可以识别设计空间的敏感区域,并在这些敏感区域内选取更多的设计点,从而在精度和计算资源之间取得平衡。此外,前向预测模型采用平均集成方法,以减轻个体代理性能差造成的精度下降。将粒子群优化算法与正演预测模型相结合,进行电子封装结构的反设计。结果:基准测试证明了所提出的集成模型具有优越的近似性能。两个工程实例表明,在保证设计精度的前提下,采用本文提出的方法进行逆向设计可以显著节省计算量。此外,该方法能够根据期望性能输出多个结构参数,并可以根据其极限性能设计封装结构。独创性/价值由于其数据驱动的性质,所提出的反设计方法在与优化和反设计相关的其他科学领域也有潜在的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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