Soldering & Surface Mount Technology最新文献_第2页

Drop and impact reliability investigation of BGA and LGA interconnects BGA和LGA互连的跌落和冲击可靠性研究

Soldering & Surface Mount Technology Pub Date : 2023-05-11 DOI: 10.1108/ssmt-03-2023-0012

Mohammad A. Gharaibeh, J. Pitarresi

{"title":"Drop and impact reliability investigation of BGA and LGA interconnects","authors":"Mohammad A. Gharaibeh, J. Pitarresi","doi":"10.1108/ssmt-03-2023-0012","DOIUrl":"https://doi.org/10.1108/ssmt-03-2023-0012","url":null,"abstract":"\u0000Purpose\u0000Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices over the traditional ball grid array (BGA) packages. This study aims to investigate the mechanical shock and impact reliability of various solder alloys and BGA/LGA interconnect configurations.\u0000\u0000\u0000Design/methodology/approach\u0000Therefore, this paper uses drop testing experiments and numerical finite element simulations to evaluate and compare the reliability performance of both LGA and BGA components when exposed to drop and impact loadings. Additionally, three common solder alloys, including 63Sn37Pb, SAC305 and Innolot, are discussed.\u0000\u0000\u0000Findings\u0000The results of this study showed that electronic packages’ drop and impact reliability is strongly driven by the solder configuration and the alloy type. Particularly, the combination of stiff solder alloy and shorter joint, LGA’s assembled with SAC305, results in highly improved drop reliability. Moreover, the BGA packages’ performance can be considerably enhanced by using ductile and compliant solder alloys, that is, 63Sn37Pb. Finally, this paper discussed the failure mode of the various solder configurations and used simulation results to explain the crack and failure situations.\u0000\u0000\u0000Originality/value\u0000In literature, there is a lack of published work on the drop and impact reliability evaluation and comparison of LGA and BGA solders. This paper provides quantitative analysis on the reliability of lead-based and lead-free solders when assembled with LGA and BGA interconnects.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131997147","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering Cu含量对激光焊接Sn-xCu/ENIG界面力学性能的影响

Soldering & Surface Mount Technology Pub Date : 2023-05-04 DOI: 10.1108/ssmt-08-2022-0054

Muhammad Asyraf Abdullah, S. R. A. Idris

{"title":"Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering","authors":"Muhammad Asyraf Abdullah, S. R. A. Idris","doi":"10.1108/ssmt-08-2022-0054","DOIUrl":"https://doi.org/10.1108/ssmt-08-2022-0054","url":null,"abstract":"\u0000Purpose\u0000Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most extensively used in the electronics industry. The Ag3Sn, which forms during isothermal ageing, can significantly degrade solder joint reliability. Sn–Ag–Cu solder’s high price further hindered its use in the electronics industry. This paper aims to investigate different copper percentages into Sn–xCu solder alloy to improve its microstructure and strength performance.\u0000\u0000\u0000Design/methodology/approach\u0000The solder alloys used in this work were Sn–xCu, where x = 0.0, 0.3, 0.5, 0.7, 1.0 Wt.%, which was soldered onto electroless nickel immersion gold (ENIG) substrate using carbon dioxide (CO2) gas laser. Then these samples were subjected to isothermal aging for 0, 200, 500, 1,000 and 2,000 h. The Sn–xCu solder alloy was fabricated through a powder metallurgy process.\u0000\u0000\u0000Findings\u0000Microstructure characterization showed that Cu addition resulted in fine and rounded shape of Cu–Sn–Ni particles. Shear strength of Sn–xCu solder joints was increased with increasing Cu content, but at aging duration of 1,000 h, it dropped slightly. It is believed that the strength improved due to the increment of diffusion rate during isothermal aging.\u0000\u0000\u0000Practical implications\u0000In a Cu–Sn solder, the recommended amount is 1.0 Wt.% of Cu. In extensive aging procedures, it was discovered that Sn1.0Cu solder improved the reliability of solder joints. The findings indicated that the innovative solder alloys might satisfy the needs of high-reliability applications.\u0000\u0000\u0000Originality/value\u0000The study shows that the right amount of Cu enhances the solidification of Sn–Cu solder, increasing the shear force of the Cu–Sn solder joint. The Sn1.0Cu exhibits a ductile fracture on the top microstructure, improving the joint’s average shear strength.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129578968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact 引入非线性断裂力学在倒装芯片组件在跌落冲击下的建模

Soldering & Surface Mount Technology Pub Date : 2023-02-20 DOI: 10.1108/ssmt-12-2022-0063

S. Belhenini, Imad El Fatmi, C. Richard, A. Tougui

{"title":"Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact","authors":"S. Belhenini, Imad El Fatmi, C. Richard, A. Tougui","doi":"10.1108/ssmt-12-2022-0063","DOIUrl":"https://doi.org/10.1108/ssmt-12-2022-0063","url":null,"abstract":"\u0000Purpose\u0000This study aims to contribute to the numerical modelling of drop impact on a flip-chip component assembled on printed circuit boards using solder micro-bumps. This contribution is based on the introduction of non-linear fracture mechanics in the numerical approach.\u0000\u0000\u0000Design/methodology/approach\u0000The integration of non-linear fracture mechanics into the numerical approach requires the proposal and validation of several simplifying assumptions. Initially, a dynamic 3D model was simplified to a dynamic 2D model. Subsequently, the dynamic 2D model is replaced with an equivalent static 2D model. The equivalent static 2D model was used to perform calculations considering the non-linear fracture mechanics. A crack was modelled in the critical bump. The J-integral was used as a comparative parameter to study the effects of crack length, crack position and chip thickness on the fracture toughness of the solder bump.\u0000\u0000\u0000Findings\u0000The different simplifying assumptions were validated by comparing the results obtained by the various models. Numerical results showed a high risk of failure at the critical solder bump in a zone close to the intermetallic layer. The obtained results were in agreement with the post-test observations using the “Dye and Pry” methods.\u0000\u0000\u0000Originality/value\u0000The originality of this study lies in the introduction of non-linear fracture mechanics to model the mechanical response of solder bumps during drop impact. This study led to some interesting conclusions, highlighting the advantage of introducing non-linear fracture mechanics into the numerical simulations of microelectronic components during a drop impact.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131593723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted 超声辅助下键合温度对Cu/(SAC混合粉末)/Al接头性能的影响

Soldering & Surface Mount Technology Pub Date : 2023-01-24 DOI: 10.1108/ssmt-07-2022-0047

Gui-Sheng Gan, Shi-Qi Chen, Liujie Jiang, Cong Liu, P. Ma, Tian Huang, Dayong Cheng, Xin Liu

{"title":"Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted","authors":"Gui-Sheng Gan, Shi-Qi Chen, Liujie Jiang, Cong Liu, P. Ma, Tian Huang, Dayong Cheng, Xin Liu","doi":"10.1108/ssmt-07-2022-0047","DOIUrl":"https://doi.org/10.1108/ssmt-07-2022-0047","url":null,"abstract":"\u0000Purpose\u0000This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.\u0000\u0000\u0000Design/methodology/approach\u0000A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the joint and successfully achieved micro-joining of Cu/Al under ultrasonic-assisted.\u0000\u0000\u0000Findings\u0000The results indicated that when the bonding temperature was 180°C, there was only one layer of CuZn5 intermetallic compounds (IMCs) at the Cu interface. However, when the bonding temperature was 190°C, 200°C and 210°C, the Cu interface IMCs had two layers: for one layer, the IMCs near the Cu substrate were Cu5Zn8 and for another layer, the IMCs near the solder were CuZn5. In addition, the thickness of the Cu interfacial IMCs increased with the bonding temperature. In particular, the thickness of IMCs at the Cu interface of the Cu/Al joints soldered at 210°C was 4.6 µm, which increased by 139.6% compared with that of the Cu/Al joints soldered at 180°C. However, there was no IMC layer at the Al interface, but there might be a Zn–Al solid solution layer. The shear strength of Cu/Al joints soldered at 180°C was only 15.01 MPa, but as the soldering temperature continued to increase, the shear strength of the Cu/Al joints increased rapidly. When the soldering temperature was 200°C, the shear strength of the Cu/Al joints reached the maximum of 38.07 MPa, which was 153.6% higher than that at 180°C. When the soldering temperature was 180°C, the fracture of Cu/Al joints was mainly on the Al side. However, when soldering temperature was 190°C, 200°C and 210°C, the fracture of Cu/Al joints was mainly broken in the Zn particles layer.\u0000\u0000\u0000Originality/value\u0000A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the Cu/Al joint at 210°C.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127020508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A review: effect of copper percentage solder alloy after laser soldering 综述:激光焊接对铜含量的影响

Soldering & Surface Mount Technology Pub Date : 2022-12-01 DOI: 10.1108/ssmt-03-2022-0022

Asyraf Abdullah, Siti Rabiatull Aisha Idris

{"title":"A review: effect of copper percentage solder alloy after laser soldering","authors":"Asyraf Abdullah, Siti Rabiatull Aisha Idris","doi":"10.1108/ssmt-03-2022-0022","DOIUrl":"https://doi.org/10.1108/ssmt-03-2022-0022","url":null,"abstract":"\u0000Purpose\u0000This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering.\u0000\u0000\u0000Design/methodology/approach\u0000This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed.\u0000\u0000\u0000Findings\u0000This paper presents a comprehensive overview of the composition of tin-copper (Sn-Cu) solders with a potential to enhance their microstructure, mechanical characteristics and wettability by varying the Cu percentage. The study found that the best Cu content in the Sn-xCu solder alloy was 0.6–0.7 Wt.%; this composition provided high shear strength, vibration fracture life value and ideal IMC thickness. A method of solder alloy preparation was also found through powder metallurgy and laser soldering to improve the solder joint reliability.\u0000\u0000\u0000Research limitations/implications\u0000This study focuses on interfacial reactions at the solder joint interface, solder joint morphology, modelling simulation of joint strength and the theory on characterising the formation and growth of IMC.\u0000\u0000\u0000Originality/value\u0000The paper comprehensively summarises the useful findings of the Sn-Cu series. This information will be important for future trends in laser soldering on solder joint formation.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124581558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature 低温时效温度对超声辅助焊接Cu/(SAC0307粉末+ zn颗粒)/Al接头性能的影响

Soldering & Surface Mount Technology Pub Date : 2022-10-25 DOI: 10.1108/ssmt-04-2022-0027

Gui-Sheng Gan, Shi-Qi Chen, Liujie Jiang, Qianzhu Xu, Tian Huang, Dayong Cheng, Xin Liu

{"title":"Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature","authors":"Gui-Sheng Gan, Shi-Qi Chen, Liujie Jiang, Qianzhu Xu, Tian Huang, Dayong Cheng, Xin Liu","doi":"10.1108/ssmt-04-2022-0027","DOIUrl":"https://doi.org/10.1108/ssmt-04-2022-0027","url":null,"abstract":"\u0000Purpose\u0000This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Al joints.\u0000\u0000\u0000Design/methodology/approach\u0000A new method in which 1 µm Zn-particles and SAC0307 with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Al under ultrasonic-assisted at 200°C, and then, the effect of aging temperature on the properties of Cu/Al joints at different aging times was researched.\u0000\u0000\u0000Findings\u0000The results showed that the Cu interface intermetallic compounds (IMCs) had the same composition and had two layers with Cu5Zn8 near the Cu substrate and CuZn5 near the solder. As the aging time increased, CuZn5 gradually transformed to Cu5Zn8, and the thickness of the CuZn5 layer gradually decreased until CuZn5 disappeared completely. There was a Sn–Zn solid solution at the Al interface, and the composition of the Al interface of the Cu/Al joints did not change with changing temperature. The IMC thickness at the Cu interface of the joints continued to increase, and the shear strength of the Cu/Al joints decreased with increasing aging temperature and time. Compared with the as-received samples, the IMC thickness of the Cu interface of joints increased by 371.8% and the shear strength of the Cu/Al joints was reduced by 83.2% when the joints were aged at 150°C for 24 h. With an increase in aging temperature, the fracture mode of the Cu/Al joints changed from being between solder balls and Zn particles to between Zn particles.\u0000\u0000\u0000Originality/value\u0000With increasing aging temperature, the shear strengths of the Cu/SACZ/Al joints decreased at the same aging time, the shear strength of Cu/SACZ/Al joints at 150°C for 24h decreased by 83.2% compared with that of the as-received joints.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117303058","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process 多层陶瓷电容器热回流过程中分层现象的数值模拟

Soldering & Surface Mount Technology Pub Date : 2022-10-20 DOI: 10.1108/ssmt-03-2022-0017

Fei Chong Ng, A. Abas, Mohamad Riduwan Ramli, Mohamad Fikri Mohd Sharif, F. Che Ani

{"title":"Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process","authors":"Fei Chong Ng, A. Abas, Mohamad Riduwan Ramli, Mohamad Fikri Mohd Sharif, F. Che Ani","doi":"10.1108/ssmt-03-2022-0017","DOIUrl":"https://doi.org/10.1108/ssmt-03-2022-0017","url":null,"abstract":"\u0000Purpose\u0000This paper aims to study the interfacial delamination found in the boundary of the copper/copper-epoxy layers of a multi-layer ceramic capacitor.\u0000\u0000\u0000Design/methodology/approach\u0000The thermal reflow process of the capacitor assembly and the crack propagation from the initial micro voids presented in the boundary, and later manifested into delamination, were numerically simulated. Besides, the cross section of the capacitor assembly was inspected for delamination cracks and voids using a scanning electronic microscope.\u0000\u0000\u0000Findings\u0000Interfacial delamination in the boundary of copper/copper-epoxy layers was caused by the thermal mismatch and growth of micro voids during the thermal reflow process. The maximum deformation on the capacitor during reflow was 2.370 µm. It was found that a larger void would induce higher vicinity stress, mode I stress intensity factor, and crack elongation rate. Moreover, the crack extension increased with the exerted deformation until 0.3 µm, before saturating at the peak crack extension of around 0.078 µm.\u0000\u0000\u0000Practical implications\u0000The root cause of interfacial delamination issues in capacitors due to thermal reflow has been identified, and viable solutions proposed. These can eliminate the additional manufacturing cost and lead time incurred in identifying and tackling the issues; as well as benefit end-users, by promoting the electronic device reliability and performance.\u0000\u0000\u0000Originality/value\u0000To the best of the authors’ knowledge, the mechanism of delamination occurrence in a capacitor during has not been reported to date. The parametric variation analysis of the void size and deformation on the crack growth has never been conducted.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121353544","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

IC solder joint inspection via adaptive statistical modeling 基于自适应统计建模的IC焊点检测

Soldering & Surface Mount Technology Pub Date : 2022-10-14 DOI: 10.1108/ssmt-12-2021-0069

Meng Xiao, Nian Cai, Zhuokun Mo, Shule Yan, Nili Tian, Jing Ma, Han Wang

{"title":"IC solder joint inspection via adaptive statistical modeling","authors":"Meng Xiao, Nian Cai, Zhuokun Mo, Shule Yan, Nili Tian, Jing Ma, Han Wang","doi":"10.1108/ssmt-12-2021-0069","DOIUrl":"https://doi.org/10.1108/ssmt-12-2021-0069","url":null,"abstract":"\u0000Purpose\u0000Statistical modeling has been successfully applied to integrated circuit (IC) solder joint inspection. However, there are some inherent problems in previous statistical modeling methods. This paper aims to propose an adaptive statistical modeling method to further improve the inspection performance for IC solder joints.\u0000\u0000\u0000Design/methodology/approach\u0000First, different pixels in the IC solder joint image were modeled by different templates, each of which was composed of the hue value of the pixel and a proposed template significance factor. Then, the potential defect image was obtained by adaptive template matching and the potential defect threshold for each pixel. It was noted that the number of templates, matching distance threshold, potential defect threshold and updating rate were adaptively updated during model training. Finally, the trained statistical model was used to inspect the IC solder joints by means of defect degree.\u0000\u0000\u0000Findings\u0000Experimental results indicated that the proposed adaptive schemes greatly contributed to the inspection performance of statistical modeling. Also, the proposed inspection method achieved better performance compared with some state-of-the-art inspection methods.\u0000\u0000\u0000Originality/value\u0000The proposed method offers a promising approach for IC solder joint inspection, which establishes different numbers of templates constructed by pixel values and template significance factors for different pixels. Also, some important parameters were adaptively updated with the updating of the model, which contributed to the inspection performance of the model.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"31 8","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113970454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted 超声辅助下Cu/SAC0307混合焊料球/不同锌颗粒含量Cu接头的低温性能

Soldering & Surface Mount Technology Pub Date : 2022-09-30 DOI: 10.1108/ssmt-07-2022-0046

Gui-Sheng Gan, Shi-Qi Chen, Liujie Jiang, Cong Liu, Tian Huang, P. Ma, Dayong Cheng, Xin Liu

{"title":"Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted","authors":"Gui-Sheng Gan, Shi-Qi Chen, Liujie Jiang, Cong Liu, Tian Huang, P. Ma, Dayong Cheng, Xin Liu","doi":"10.1108/ssmt-07-2022-0046","DOIUrl":"https://doi.org/10.1108/ssmt-07-2022-0046","url":null,"abstract":"\u0000Purpose\u0000This study aims to research properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted.\u0000\u0000\u0000Design/methodology/approach\u0000A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted at low temperature.\u0000\u0000\u0000Findings\u0000The results showed that with a continuous increase in the Zn-particle content, the interfacial intermetallic compounds (IMCs) of the upper and lower interfaces of joints gradually changed from scallop-shaped Cu6Sn5 to wavy-shaped Cu5Zn8. Moreover, the IMC thickness of the upper/lower interface of joints first decreased and then increased with increasing Zn-particle content. The shear strengths of joints increased with Zn-particle content, the shear strength of joints went to a maximum of 29.76 MPa when the Zn-particle content was 40%, an increase of 62.6% compared to joints without Zn particles. However, as the Zn-particle content continued to increase, the shear strengths of the joints decreased. Additionally, when the Zn content increased to 50%, because the oxidation degree of Zn particles increased, the joints were mainly broken among Zn particles.\u0000\u0000\u0000Originality/value\u0000A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the Cu/Cu joint at 180°C.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132271106","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder ZnO纳米粒子及其组分对共晶SAC355无铅焊料结构、热、力学和电学性能的影响

Soldering & Surface Mount Technology Pub Date : 2022-09-23 DOI: 10.1108/ssmt-06-2022-0045

Hamed Al-sorory, Mohammed S. Gumaan, R. Shalaby

{"title":"ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder","authors":"Hamed Al-sorory, Mohammed S. Gumaan, R. Shalaby","doi":"10.1108/ssmt-06-2022-0045","DOIUrl":"https://doi.org/10.1108/ssmt-06-2022-0045","url":null,"abstract":"\u0000Purpose\u0000This paper aims to summarise the effects of ZnO nanoparticles (0.1, 0.3, 0.5, 0.7 and 1.0 Wt.%) on the structure, mechanical, electrical and thermal stability of Sn–3.5Ag–0.5Cu (SAC355) solder alloys for high-performance applications.\u0000\u0000\u0000Design/methodology/approach\u0000The phase identification and morphology of the solders were studied using X-ray diffraction and scanning electron microscopy. Thermal parameters were investigated using differential scanning calorimetry. The elastic parameters such as Young's modulus (E) and internal friction (Q−1) were investigated using the dynamic resonance technique, whereas the Vickers hardness (Hv) and creep indentation (n) were examined using a Vickers microhardness tester.\u0000\u0000\u0000Findings\u0000Microstructural analysis revealed that ZnO nanoparticles (NPs) were distributed uniformly throughout the Sn matrix. Furthermore, addition of 0.1, 0.3 and 0.7 Wt.% of ZnO NPs to the eutectic (SAC355) prevented crystallite size reduction, which increased the strength of the solder alloy. Mechanical parameters such as Young's modulus improved significantly at 0.1, 0.3 and 0.7 Wt.% ZnO NP contents compared to the ZnO-free alloy. This variation can be understood by considering the plastic deformation. The Vickers hardness value (Hv) increased to its maximum as the ZnO NP content increased to 0.5. A stress exponent value (n) of approximately two in most composite solder alloys suggested that grain boundary sliding was the dominant mechanism in this system. The electrical resistance (ρ) increased its maximum value at 0.5 Wt.% ZnO NPs content. The addition of ZnO NPs to plain (SAC355) solder alloys increased the melting temperature (Tm) by a few degrees.\u0000\u0000\u0000Originality/value\u0000Development of eutectic (SAC355) lead-free solder doped with ZnO NPs use for electronic packaging.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126815524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Soldering &amp; Surface Mount Technology最新文献

Soldering & Surface Mount Technology最新文献