IEEE CPMT Symposium Japan 2014最新文献

{"title":"Highly heat-resistant bio-based nanofiber substrate for flexible electronics","authors":"M. Hsieh, H. Koga, M. Nogi, K. Suganuma","doi":"10.1109/ICSJ.2014.7009641","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009641","url":null,"abstract":"Silver nanoparticle lines are fabricated on flexible and highly heat-resistant nanopaper substrates made from densely packed 15 to 60 nm cellulose nanofibers. The conductivity of the lines is enhanced to the level of bulk silver.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134206630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development of combined surface activated bonding (SAB) method for hydrophilic wafer bonding","authors":"Ran He, M. Fujino, T. Suga, A. Yamauchi","doi":"10.1109/ICSJ.2014.7009611","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009611","url":null,"abstract":"A new combined surface activated bonding (SAB) technique has been developed for hydrophilic wafer bonding in vacuum. Relative humidity in the bonding environment is not necessary in this novel hydrophilic bonding approach.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123856861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Positive-tone photodefinable polyimide for low temperature cure","authors":"Daisaku Matsukawa, T. Enomoto, Kei Ono, M. Ohe","doi":"10.1109/ICSJ.2014.7009603","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009603","url":null,"abstract":"Photodefinable Polyimides (PI) and polybenz-oxazoles (PBO) which have been widely used for various electronic applications such as buffer coating, interlayer dielectric and protection layer usually need high temperature cure condition over 300 °C to complete the cyclization and achieve good film properties. In addition, PI and PBO are also utilized recently for re-distribution layer of wafer level package. In this application, lower temperature curability is strongly required in order to prevent the thermal damage of the semi-conductor device and the other packaging material. Then, to meet this requirement, we focused on pre-cyclized polyimide with phenolic hydroxyl groups since this polymer showed the good solubility to aqueous TMAH and there was no need to apply high temperature cure condition. As a result of our study, the positive-tone photodefinable material could be obtained by using DNQ and combination of epoxy cross-linker enabled to enhance the chemical and PCT resistance of the cured film made even at 170 °C. Furthermore, the adhesion to copper was improved probably due to secondary hydroxyl groups which were generated from reacted epoxide groups. In this report, we introduce our concept of novel photodefinable positive-tone polyimide for low temperature cure.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121765383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optimizing FCCSP design with Cu-pillar bump in high sensitivity fingerprint sensor","authors":"Chih-Yi Huang, Cheng-Yu Tsai, Tsai-Yun Hsieh, C. Chiu, C. Hung, Chen-Chao Wang","doi":"10.1109/ICSJ.2014.7009631","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009631","url":null,"abstract":"Fingerprint identification system has caught people's eyes because personal mobile device is getting development rapidly recent years. Similar to the principle of touch screen panel device, but a fingerprint identification IC needs the design with higher sensitivity and more accurate design to sense the tiny variations on a fingerprint. So that it could be qualified and adopted at verifications of identifications, even for mobile payment in the future. The first section of this paper simply introduces to the principle of capacitive fingerprint sensor chip and the relation with its package design. The second part shows the package structure and each factor of package design which effects capacitive fingerprint sensor performance. Then, the simulation results are summarized and concluded all design factors to the performance. Of course, the best design rule is able to be found out. Later, JMP is participated in order to analyze more factors and advanced improve the sensitivity of package design. Final is the conclusion.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134199753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Simulation of differential skew considering fiber kink effects","authors":"T. Fukumori, Hideaki Nagaoka, D. Mizutani, M. Tani","doi":"10.1109/ICSJ.2014.7009605","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009605","url":null,"abstract":"As a result of increasing signal transmission rates to as high band levels as several tens of Gbps, skew induced by the difference in dielectric constant between the glass-cloth and the resin is posing a huge problem. However, due to the extremely difficult comparison of this skew between actual measurements and simulations, few studies on such comparison have been reported to date. We developed a new analysis technique to clarify the transmission delay time difference (skew) in differential signal transmission lines, depending on the positional relationship between the glass-threads and the conductor lines in a circuit board. This analysis technique has the following four characteristics. The first is that the angle of the lines to the glass-cloth is expressed by cascade connections of multiple analytical models that are different in the positional relationship between the glass-cloth and the lines. The second is that analytical models are combined in cascade connection assuming that the positional relationship between the lines and the glass-cloth appears randomly and is distributed uniformly. The third is that analytical models are prepared assuming that the angle between the lines and the glass-cloth is distributed uniformly within a certain range due to fiber kink effects. The fourth is that the assumption that skew in stripline structure, which has two glass-cloth insulating layers right above and below the lines, can be calculated by the sum of two sets of the skew induced by one glass-cloth-containing insulating layer. As a result of comparison between analysis and actual measurement results, it was confirmed that this analysis technique could reproduce skew distributions observed in real circuit boards with a high degree of accuracy.As a result of comparison between analysis and actual measurement results, it was confirmed that this analysis technique could reproduce skew distributions observed in real circuit boards with a high degree of accuracy.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129203123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design for PMT connector (polymer waveguides connected with MT connector)","authors":"Motohito Takezaki, R. Nagase","doi":"10.1109/ICSJ.2014.7009637","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009637","url":null,"abstract":"We report the result of our study of a PMT connector used for optical circuit boards. We confirmed that PMT connectors can be handled in the same manner as MT connectors when connecting polymer waveguides to multi-fiber ribbons.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123252101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Highly moisture resistant IGZO films with a barrier layer for flexible transparent conductive substrates","authors":"K. Nagamoto, Tsutomu Hara, H. Sakuma, K. Ishii","doi":"10.1109/ICSJ.2014.7009601","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009601","url":null,"abstract":"Structural, electrical and moisture resistant properties of highly transparent conductive polycrystalline Ga and In co-doped ZnO (IGZO) films deposited on high gas barrier plastic substrates and alkali-free glass at below 100 °C by DC magnetron sputtering method were investigated. All the IGZO films in the Ga2O3 concentration is 5.7 wt% (ceramic target) and In2O3 concentration changed from 0 to 20 wt % (ceramic target). We have been studying for the effect of additional In2O3 on moisture resistant of IGZO films. Moisture resistant results showed that when the In2O3 concentration was 10 wt % (ceramic target) was drastically improved compared to GZO films. In addition, the IGZO film applied to the flexible high gas barrier plastic substrate. This plastic flexible IGZO films also showed the excellent moisture resistant. The moisture resistant IGZO film deposited on plastic flexible gas barrier substrates have great potential for use as electrode of flexible sensors, display, lighting and solar cells.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123481588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Assembly process for high bandwidth density organic optical MCM","authors":"M. Tokunari, S. Nakagawa","doi":"10.1109/ICSJ.2014.7009619","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009619","url":null,"abstract":"We develop a high-bandwidth density organic optical multi-chip module (MCM). A high packaging density is achieved by integrating bare optical chips, developing compact fiber connectors that connect perpendicularly to the surface of the module, and manufacturing total internal reflection mirrors by a precise laser ablation technique. An assembly procedure for the optical MCM is established. It is verified that the organic MCM is resistant to heat of reflow processes and that mirror quality does not degrade due to the lens array assembly process.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"171 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121615037","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A feasibility study of novel packaging technology for low cost and high performance systems","authors":"D. Iguchi, H. Umekawa","doi":"10.1109/ICSJ.2014.7009624","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009624","url":null,"abstract":"We have introduced a packaging technology utilizing high-dielectric ultra thin film between power and ground planes not as an embedded capacitor but a low impedance power distribution route directly connected to the chip. In this study the Power Distribution Network (PDN) characteristics of this structure were analyzed in detail using 3-d electromagnetic modeling in order to evaluate the feasibility of this technology. The calculated PDN impedance of the interposer used in the previous study shows good agreement with the measured impedance. Then we introduce a generic modeling technique of PDN for large scale System on Chips (SoCs) and extensive parametric study was done to determine the optimized structure and parameters for power distribution of actual SoCs.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"262 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121308320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Stretchable and deformable electronic systems in thermoplastic matrix materials","authors":"T. Loher, A. Ostmann, M. Seckel","doi":"10.1109/ICSJ.2014.7009639","DOIUrl":"https://doi.org/10.1109/ICSJ.2014.7009639","url":null,"abstract":"Deformable of electronic systems consisting of laterally distributed electronic components (typically sensors, actuators or LEDs) has attracted considerable attention during the last decade. By using different technology approaches considerable elasticity, repeated stretchability and conformability of such systems has been shown by number of research groups. Contrary to the expression of interest by many potential industrial manufactures of stretchable electronics, the adaptation of related technologies into industrial fabrication environments is lagging. Among the reasons for the reluctance to industrialize are concerns with respect to material used in deformable electronics (silicones), reliability issues (repeated stretchability), and (initial) cost. In this paper an approach for “single cycle deformable”-electronic systems and some of its application scenarios will be presented, which is very close to established printed circuit board technologies. Based on a previously developed technology for repeatedly stretchable electronics -using thermoplastic polyurethane as the matrix material, see figure 1- an approach for three dimensionally deformable electronic systems is formed. In order to fabricate a stable self-supported structure the stretchable system is attached to a thermoplastic polymer sheet (typically polycarbonate or a polycarbonate/Acrylonitrile butadiene styrene blend) with a thickness between 200 and 800 μm prior to being 3D-deformed by thermo-compression. Potential applications are any kind of products (consumer electronics, automotive, household appliances), where a need to integrate sensors and actuators into ergonomically or aesthetically 3D-shaped surfaces is identified. The fabrication of deformable electronics is a process fully compatible with a typical printed circuit board manufacturing and electronics assembly line. Also the used materials are well compliant with wet chemical processes used during the processing. Rather complex electronic systems with a number of components like distributed sensors or actuators can be assembled in a conventional way on a flat electronic panel. The low temperature solder SnBi is used for the electronics assembly. Mounted components are typically fixed additionally by a under filler, so that during the thermoforming process when the solder eventually melts components are not released from the contact pads. The stretchable electronics is subsequently fixed to a stiff thermoplasitc support sheet prior to being 3D-deformed by a thermoforming process. Manufacturing aspects and results will be discussed in the presentation.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"184 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122570681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}