Optimizing FCCSP design with Cu-pillar bump in high sensitivity fingerprint sensor

Abstract

Fingerprint identification system has caught people's eyes because personal mobile device is getting development rapidly recent years. Similar to the principle of touch screen panel device, but a fingerprint identification IC needs the design with higher sensitivity and more accurate design to sense the tiny variations on a fingerprint. So that it could be qualified and adopted at verifications of identifications, even for mobile payment in the future. The first section of this paper simply introduces to the principle of capacitive fingerprint sensor chip and the relation with its package design. The second part shows the package structure and each factor of package design which effects capacitive fingerprint sensor performance. Then, the simulation results are summarized and concluded all design factors to the performance. Of course, the best design rule is able to be found out. Later, JMP is participated in order to analyze more factors and advanced improve the sensitivity of package design. Final is the conclusion.