考虑纤维扭结效应的差分斜度模拟

T. Fukumori, Hideaki Nagaoka, D. Mizutani, M. Tani
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引用次数: 4

摘要

由于将信号传输速率提高到数十Gbps的高频带水平,玻璃布和树脂之间介电常数的差异引起的偏斜是一个巨大的问题。然而,由于这种偏差在实际测量和模拟之间的比较非常困难,迄今为止很少有关于这种比较的研究报道。我们开发了一种新的分析技术来澄清差分信号传输线的传输延迟时间差(偏差),这取决于电路板中玻璃线与导体线之间的位置关系。这种分析技术有以下四个特点。首先,线与玻璃布的夹角由多个分析模型的级联关系表示,这些模型与玻璃布的位置关系不同。二是假设线与玻璃布的位置关系随机出现且均匀分布,以级联方式组合分析模型。三是假设线与玻璃布的夹角由于纤维扭结效应在一定范围内均匀分布,建立了分析模型。第四,假设在线的正上方和正下方有两层玻璃布绝缘层的带状线结构中,斜度可以由一层含玻璃布的绝缘层引起的两组斜度之和来计算。通过分析结果与实际测量结果的对比,证实了该分析技术能够以较高的精度再现实际电路板中观察到的偏态分布。通过分析结果与实际测量结果的对比,证实了该分析技术能够以较高的精度再现实际电路板中观察到的偏态分布。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation of differential skew considering fiber kink effects
As a result of increasing signal transmission rates to as high band levels as several tens of Gbps, skew induced by the difference in dielectric constant between the glass-cloth and the resin is posing a huge problem. However, due to the extremely difficult comparison of this skew between actual measurements and simulations, few studies on such comparison have been reported to date. We developed a new analysis technique to clarify the transmission delay time difference (skew) in differential signal transmission lines, depending on the positional relationship between the glass-threads and the conductor lines in a circuit board. This analysis technique has the following four characteristics. The first is that the angle of the lines to the glass-cloth is expressed by cascade connections of multiple analytical models that are different in the positional relationship between the glass-cloth and the lines. The second is that analytical models are combined in cascade connection assuming that the positional relationship between the lines and the glass-cloth appears randomly and is distributed uniformly. The third is that analytical models are prepared assuming that the angle between the lines and the glass-cloth is distributed uniformly within a certain range due to fiber kink effects. The fourth is that the assumption that skew in stripline structure, which has two glass-cloth insulating layers right above and below the lines, can be calculated by the sum of two sets of the skew induced by one glass-cloth-containing insulating layer. As a result of comparison between analysis and actual measurement results, it was confirmed that this analysis technique could reproduce skew distributions observed in real circuit boards with a high degree of accuracy.As a result of comparison between analysis and actual measurement results, it was confirmed that this analysis technique could reproduce skew distributions observed in real circuit boards with a high degree of accuracy.
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