2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第3页

Air-Coupled Array of Pmuts at 100 kHz with PZT Active Layer: Multiphysics Model and Experiments 带有PZT有源层的100 kHz Pmuts空气耦合阵列:多物理场模型和实验

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724514

G. Massimino, A. Colombo, R. Ardito, F. Quaglia, F. Foncellino, A. Corigliano

{"title":"Air-Coupled Array of Pmuts at 100 kHz with PZT Active Layer: Multiphysics Model and Experiments","authors":"G. Massimino, A. Colombo, R. Ardito, F. Quaglia, F. Foncellino, A. Corigliano","doi":"10.1109/EUROSIME.2019.8724514","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724514","url":null,"abstract":"This work is focused on the multi-physics modelling via the finite element method (FEM) of an air-coupled array of Piezoelectric Micromachined Ultrasonic Transducers (PMUTs) and its preliminary experimental validation in the time domain for the mechanical and acoustic behaviour.Two numerical models are used to simulate the complete performance of the system based on the response of the diaphragm.In the former, the electro-mechanical-acoustic (EMA) problem for the single PMUT is solved, exploiting the axial symmetry of the system, with the following features: the presence of the fabrication induced residual stresses, which determine a non-linear initial deformed configuration and a substantial linearized fundamental mode frequency shift of the piezo-plate; the multiple couplings between different physics, namely piezoelectric coupling in the active layer and acoustic-structural interaction for the waves propagation in the surrounding fluid. When the non-linearities are activated in the dynamic response, by the involved large displacements, the system shows an initial beating behaviour with small steady state amplitude increment as the voltage input increases.In the latter model, the full set of PMUTs belonging to the silicon die in a 4 × 4 array configuration is considered in which the vibrating plates are modelled as equivalent oscillating rigid plane circular pistons, with reduced imposed acceleration amplitude, on a rigid baffle represented by the remaining part of the surface die.The results of the numerical simulations are compared with the experimental ones in terms of the initial static pre-deflection and pressure at 15 cm from the centre of the diaphragm, on the vertical direction along its own acoustic axis, in the case of the TX test with a single actuated transducer for different voltage amplitudes.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130212892","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder 焊料选择对焊接堆热力学性能影响的比较

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724590

Ramiro S. Vargas C, V. Gonda

{"title":"Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder","authors":"Ramiro S. Vargas C, V. Gonda","doi":"10.1109/EUROSIME.2019.8724590","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724590","url":null,"abstract":"Thermal cycling causes deformations in electronic packaging structures, which may result in severe loads of solder connections. Prediction of stresses and strains in the solder connections is a critical step in design for the reliability of interconnected parts. Leaded soldering materials have been broadly used for electronic interconnects in the past due to their favorable electric, mechanical and thermal properties. Presently many different lead-free solder materials are applied as a suitable replacement for the hazardous eutectic SnPb solder. Lead-free solders are frequently Sn-based alloys with silver (Ag) and copper (Cu), resulting in a higher melting temperature. In an electronic package, the thermal-mechanical integrity of a soldered structure is of high importance for the reliability of the assembly. Hence, its mechanical properties and consequently mechanical behavior should be analyzed to probe the reliability of unleaded solders.In this work, a fundamental finite element model was created for an electronic assembly, on which cyclic thermal and mechanical load was applied. For the interconnecting solder, three types: Sn-3.5Ag, SAC305, and SAC387 were employed in the different models and the integrity of the package were evaluated.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"174 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133695079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

New Method to Determine the Local Joule Heat Distribution in Fast Switching Devices 确定快速开关器件局部焦耳热分布的新方法

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724527

Christian Römelsberger, M. Hanke

引用次数: 0

Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests 通过内聚区有限元模拟和非破坏性试验验证货包的坚固性预测

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724551

R. Pufall, D. May, B. Wunderle, G. M. Reuther, N. Pflügler, Dominik Udiljak

{"title":"Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests","authors":"R. Pufall, D. May, B. Wunderle, G. M. Reuther, N. Pflügler, Dominik Udiljak","doi":"10.1109/EUROSIME.2019.8724551","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724551","url":null,"abstract":"Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remain a major concern for the reliability of semiconductor components. Over the last decade a lot of effort was spent to find solutions to avoid delamination in packages by increasing adhesion. Cohesive zone element simulation allows predicting delamination behaviour and the location of critical areas which are prone to unstable crack propagation. During failure analyses, scanning acoustic microscopy (SAM) is often the method of choice for the detection of delaminated interfaces. Exposed pad packages demand a more sophisticated method to detect lead frame side wall cracks and delamination as well. To fulfil the requirements for future exposed pad packages for automotive applications, we introduce a simulation based approach for estimating how much adhesion is necessary to avoid delamination at critical locations. Partly released elastic energy stored at critical interfaces (limited delamination) can help to avoid unstable crack propagation and, thus, increase the robustness of these packages under cyclic loading. Helpful would be a method (preferable non-destructive) to verify the amount of delaminated side wall area (lead frame, die paddle, and moulding compound) to identify the critical delamination temperature for the exposed pad packages.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130116814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q 采用低熔点SnBi基锡膏LMPA-Q提高QFN热循环可靠性

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724511

B. Vandevelde, R. Labie, R. Lauwaert, Daniel Werkhoven, D. Vanderstraeten, E. Blansaer, Jonas Lannoo, D. Pissoort

引用次数: 4

Smart textiles: how electronics merge into our clothing 智能纺织品:电子产品如何融入我们的服装

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724586

K. Jansen

引用次数: 9

BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses 由于制造引入残余应力导致的BEoL开裂风险

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724589

J. Auersperg, E. Auerswald, D. Vogel, S. Rzepka

{"title":"BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses","authors":"J. Auersperg, E. Auerswald, D. Vogel, S. Rzepka","doi":"10.1109/EUROSIME.2019.8724589","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724589","url":null,"abstract":"Progressive miniaturization and functional integration in the field of BEoL structures of modern CMOS components call for the use of new materials (porous or nanoparticles filled) in connection with completely new manufacturing technologies. Residual stresses generated in thin layers during several manufacturing processes can lead to delamination and cracking before and because of the stress under CPI (during lead-free reflow soldering and further chip handling, in particular). Challenges for the improvement of thermos-mechanical reliability exist from two sides: the higher thermo-mechanical loads as well as the partly lower damage and fracture resistance of those new materials and interfaces. Therefore, the question of the residual stresses and their influence on the risk of damage and fracture become an important factor. This fact also has an impact on the application of fracture mechanics analysis using simulative numerical methods as a reliable method for process and design optimization [1]. In this paper, the part of residual stresses of different layers for the formation and propagation of cracks in BEoL structures have been investigated by experiment (FIB based residual stress estimation) and simulation (XFEM delivering crack initiation and propagation).","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123647396","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

High Power Terminal Vibrational Analysis in Response to Experimental Qualification Results 基于实验验证结果的大功率终端振动分析

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724521

M. Packwood, Daohui Li, Xiang Li, P. Mumby-Croft

引用次数: 0

Computational Mechanics for Flexible and Wearable Electronics 柔性和可穿戴电子产品的计算力学

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/eurosime.2019.8724576

Zhuangjian Liu

引用次数: 0

Lifetime Prediction of Ultraviolet Light-emitting Diodes with Accelerated Wiener Degradation Process 加速维纳降解的紫外发光二极管寿命预测

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-01 DOI: 10.1109/EUROSIME.2019.8724571

Zhou Jing, M. Ibrahim, Jiajie Fan, Xuejun Fan, Guoqi Zhang

{"title":"Lifetime Prediction of Ultraviolet Light-emitting Diodes with Accelerated Wiener Degradation Process","authors":"Zhou Jing, M. Ibrahim, Jiajie Fan, Xuejun Fan, Guoqi Zhang","doi":"10.1109/EUROSIME.2019.8724571","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724571","url":null,"abstract":"The estimation of lifetime for highly reliable products including Ultraviolet Light-emitting Diodes (UV LEDs) has been challenging based on traditional lifetime tests that records time to failure. Recently constant stress and step stress degradation tests are used to gather degradation path data and modeling the degradation of performance characteristics has been applied. In this paper, a step stress accelerated degradation test (SSADT) designed to capture the degradation path and study the lifetime of UV LEDs. The radiation power degradation path was analyzed based on the IES TM-21 least square regression (LSR) and Wiener process approach. With its advantage of requiring smaller sample size and shorter test time, the SSADT provides a degradation path suitable for the proposed Wiener process modeling. The lifetime estimation for UV LEDs based on the proposed wiener process approach shows better prediction accuracy compared to the TM-21 LSR approach. By using this method, dynamic changes and degradation of the UV LEDs can be easily studied, and it can effectively estimate their remaining useful lifetimes.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133717910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5