High Power Terminal Vibrational Analysis in Response to Experimental Qualification Results

Abstract

A simulation driven study is presented relating to the reliability of high power semiconductor module busbars under vibrational loading. Unexpected mechanical failure presented under qualification testing leading to an in depth study of the geometry through the simulation tool. The simulation tool provided an in depth analysis into the effects of multiple aspects of the vibration qualification test, as well as directly leading to the discovery of an unforeseen manufacturing defect. Further simulation based analysis of the newly discovered defect led to its removal from the manufacturing process and the cessation of busbar failure under vibration qualification.