2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

A SPICE-based Transient Thermal-Electronic Model for LEDs 基于spice的led瞬态热电子模型

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724555

Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang

引用次数: 2

Online prognostication of remaining useful life for random discharge lithium-ion batteries using a gamma process model 利用伽马过程模型在线预测随机放电锂离子电池剩余使用寿命

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724567

Zeyu Wu, Zili Wang, C. Qian, Bo Sun, Yi Ren, Qiang Feng, Dezhen Yang

{"title":"Online prognostication of remaining useful life for random discharge lithium-ion batteries using a gamma process model","authors":"Zeyu Wu, Zili Wang, C. Qian, Bo Sun, Yi Ren, Qiang Feng, Dezhen Yang","doi":"10.1109/EUROSIME.2019.8724567","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724567","url":null,"abstract":"The prediction of remaining useful life (RUL) of lithium-ion batteries is an essential part of the prognostics and health management (PHM) for electric vehicles (EVs). The conventional method to estimate the RUL of batteries based on offline laboratory experiment data may give rise to a considerable amount of error by ignoring the uncertainties occurred in random charge-discharge cycles under operation. To overcome this problem, an online prognostic method based on a gamma process model was presented, and verified by using the experimental data from a set of four batteries test with random discharge recorded by National Aeronautics and Space Administration (NASA). In addition, the probability density function (PDF) and the reliability curve of the batteries were established along with the 0.95 confidence interval to reveal the statistical profile of predicted RULs. Compared to the conventional RUL prediction methods, the proposed method merely requires a small quantity of training data to achieve accurate RUL prediction for randomized usage batteries on EVs.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134140076","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Electromigration Effects in Corroded BGA 腐蚀BGA中的电迁移效应

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724522

K. Weide-Zaage, A. Guédon-Gracia, H. Frémont

引用次数: 0

Simulation-Based Design of an Electrostatically Driven Micro-Actuator for Fluid Transport in Mobile Applications 基于仿真的移动流体输送用静电驱动微致动器设计

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724561

M. Seidl, M. Gehring, U. Krumbein, G. Schrag

{"title":"Simulation-Based Design of an Electrostatically Driven Micro-Actuator for Fluid Transport in Mobile Applications","authors":"M. Seidl, M. Gehring, U. Krumbein, G. Schrag","doi":"10.1109/EUROSIME.2019.8724561","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724561","url":null,"abstract":"The emerging lab-on-chip technology for in-situ medical use and environmental surveillance brought with it the demand for new, micro-scale actuator designs specialized in energy-efficient fluid transport, supporting the development of lightweight and mobile systems. In this work, we present the simulation-based design of a novel, integrated micro-fluidic actuator intended for mobile applications. The design is laid-out to be compatible with standard semiconductor manufacturing processes in order to enable mass-production at low cost per unit. The development of the device is supported and accelerated by a dedicated fully energy-coupled finite element model (FEM). The FE model takes into account the fluid-solid interaction in addition to the electro-mechanical interrelations, therefore reproducing the full device behavior in reaction to electrical input signals. In the end, we discuss several design parameters exhibiting space for improvement compared to the chosen standard values, as identified by the FEM simulations.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130149704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load 热机械负载下SiC-MOSFET功率模块的聚合物封装与陶瓷封装仿真比较

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724587

F. Wagner, Y. Maniar, M. Rittner, S. Kaessner, M. Guyenot, Lukas Lang, B. Wunderle

{"title":"Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load","authors":"F. Wagner, Y. Maniar, M. Rittner, S. Kaessner, M. Guyenot, Lukas Lang, B. Wunderle","doi":"10.1109/EUROSIME.2019.8724587","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724587","url":null,"abstract":"The need for small, high efficient (98%) and high temperature capable $(200^{circ}{rm{C}})$ power electronics lead to the development of SiC-power modules, which can satisfy these advanced requirements. Power electronics have often to resist harsh environments and provide high reliability. A typical way to fulfill these demands is the application of silicone gels and mold compounds, which can be used up to $200^{circ}{rm{C}}$. In order to protect power electronics for application at higher temperature up to $250^{circ}{rm{C}}$ and overcome the low thermal conductivity of polymer encapsulates new ceramic compounds were developed. Hence they are new to the market, there are less experiences using this compounds to increase reliability of SiC power modules. The aim of this study is to compare the effect of organic mold compounds and ceramic compound encapsulates onto a single chip SiC power module with finite element modeling (FEM) of power cycling loads. With the used assembly and interconnection technologies (AIT) such as active metal brazed (AMB) ceramics, silver sintering and Al|Cu-ribbon bond hybrids, the expected failure is a ribbon bond-lift off. The focus is therefore on the elastic and plastic deformation in the ribbon bond foots. As the stiffness of the encapsulate increases, the strain in the ribbon bonds can be reduced significantly. This allows a significant increase in reliability and lifetime, if the encapsulation does not introduce new failure mechanism. Through a comparison of FEM-results to experimental tested samples, the simulations are validated and a lifetime prediction is made.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121075962","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Modeling of Thermal Processes in Thin-Film BAW Resonators 薄膜BAW谐振器中热过程的建模

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724556

A. Kozlov

{"title":"Modeling of Thermal Processes in Thin-Film BAW Resonators","authors":"A. Kozlov","doi":"10.1109/EUROSIME.2019.8724556","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724556","url":null,"abstract":"Thermal processes in three type of thin-film bulk acoustic wave resonator, such as a resonator with an air gap, a membrane-type resonator and a resonator with a Bragg acoustic reflector, are considered. In the structures of the resonators the 2D domains of modeling are marked out. For the resonator with an air gap and the membrane-type resonator the 2D domain of modeling is in the plane of its piezoelectric transducer. For the resonator with a Bragg acoustic reflector the 2D domain of modeling is in the plane perpendicular to that of the piezoelectric transducer. The domains of modeling of the resonators are divided into the regions. For each region, the stationary heat deferential equation and the boundary conditions are defined and then this equation is solved using eigenfunction method. The heat flux densities between the regions included in the solution are presented as the sums of orthogonal functions with unknown weighting coefficients. These coefficients are found using the adjoint boundary conditions. The presented approach was used to analyze the thermal processes in the above mentioned three types of the thin-film bulk acoustic wave resonators with piezoelectric transducers based on aluminum nitride. The overheating temperature distribution in the piezoelectric transducer of each resonator and the dependence of the weighted average overheating temperature of this transducer on the dissipated power are determined.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128783944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints 球栅阵列焊点稳健性热力学分析的概率方法

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724553

Ayda Halouani, A. Cherouat, M. Chaabane, M. Haddar

引用次数: 0

Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances 二硫化钼薄膜晶体管的电学和光学特性及应变对其性能的影响

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724549

Z. Qu, Hongyu Tang, H. Ye, Xuejun Fan, Guoqi Zhang

引用次数: 0

Automatic assembly of multiscale models and its application to a family of homogenized models of wave propagation through interfaces having a periodic structure 多尺度模型的自动装配及其在波通过具有周期结构的界面的均匀化模型中的应用

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724563

M. Lenczner, W. Belkhir, N. Ratier, N. Trinh, B. Cavallier

引用次数: 0

Effect of material properties on PCB frequencies in electronic control unit 电子控制单元中材料特性对PCB频率的影响

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI: 10.1109/EUROSIME.2019.8724577

Mahdi Sadeghinia, Chalukya Chincholi, A. Udyansky, A. Fischer

{"title":"Effect of material properties on PCB frequencies in electronic control unit","authors":"Mahdi Sadeghinia, Chalukya Chincholi, A. Udyansky, A. Fischer","doi":"10.1109/EUROSIME.2019.8724577","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724577","url":null,"abstract":"With advancement in Artificial intelligence, Internet of things and next generation of mobility going towards autonomous driving, the electronic control units used for power steering need to be redundant, highly reliable and intelligent. The above challenge forces design engineers to smartly enhance the electronic components with use of multiple PCB stacked one above another. PCB is one of the main parts of the control unit on whichSMD components are populated. Therefore, comprehensive knowledge of PCB dynamic behavior is important for fatigue evaluation of SMD and other electronic components.This paper discusses the mechanical dynamic responses of PCBs using different material properties, e.g. isotropic, orthotropic and PCB homogenizing properties. Simulations are carried out in Ansys to predict the PCB frequencies and mode shapes. In order to validate the simulation results, measurements are also performed to predict PCB frequencies, mode shapes and frequency response funsctions. Measurements are carried out with PSV-400 scanning laser vibrometer from Polytech and post processing of measurement data is done with help of Polytech for visualization of mode shapes.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116948303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0