A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints

Abstract

In this paper, we propose a metamodel called generalized polynomial chaos (gPC) to investigate the stochastic response of a ball grid array (PBGA) package under thermal cycle excitation. The shear strain is extracted in the presence of uncertain material and boundary condition parameters. A non-linear thermo-mechanical using Anand viscoplastic law was studied.