球栅阵列焊点稳健性热力学分析的概率方法

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2019-03-24 DOI:10.1109/EUROSIME.2019.8724553

Ayda Halouani, A. Cherouat, M. Chaabane, M. Haddar

{"title":"球栅阵列焊点稳健性热力学分析的概率方法","authors":"Ayda Halouani, A. Cherouat, M. Chaabane, M. Haddar","doi":"10.1109/EUROSIME.2019.8724553","DOIUrl":null,"url":null,"abstract":"In this paper, we propose a metamodel called generalized polynomial chaos (gPC) to investigate the stochastic response of a ball grid array (PBGA) package under thermal cycle excitation. The shear strain is extracted in the presence of uncertain material and boundary condition parameters. A non-linear thermo-mechanical using Anand viscoplastic law was studied.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints\",\"authors\":\"Ayda Halouani, A. Cherouat, M. Chaabane, M. Haddar\",\"doi\":\"10.1109/EUROSIME.2019.8724553\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we propose a metamodel called generalized polynomial chaos (gPC) to investigate the stochastic response of a ball grid array (PBGA) package under thermal cycle excitation. The shear strain is extracted in the presence of uncertain material and boundary condition parameters. A non-linear thermo-mechanical using Anand viscoplastic law was studied.\",\"PeriodicalId\":357224,\"journal\":{\"name\":\"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-03-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2019.8724553\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2019.8724553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文提出了一个广义多项式混沌(gPC)元模型来研究热循环激励下球栅阵列(PBGA)封装的随机响应。在存在不确定材料和边界条件参数的情况下，提取剪切应变。利用Anand粘塑性规律研究了非线性热-力学问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints

In this paper, we propose a metamodel called generalized polynomial chaos (gPC) to investigate the stochastic response of a ball grid array (PBGA) package under thermal cycle excitation. The shear strain is extracted in the presence of uncertain material and boundary condition parameters. A non-linear thermo-mechanical using Anand viscoplastic law was studied.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

自引率

0.00%

发文量