Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Abstract

In this work, the solder joint reliability of QFN components is experimentally tested in thermal cycling and four-point bending cycling conditions, and this for three different solder materials: standard SAC305, low Ag SAC alloy and a new low melting temperature SnBi based alloy LMPA-Q. The outcome of the study is to evaluate if these new SnBi based solder material perform similar, worse or better than the more standard lead-free solders.