2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)最新文献

{"title":"Air Leakage Impact on System Thermal Behavior in 3U Chassis","authors":"Feng Qi, Biber Catherina, Ming Zhang, Casey Winkle","doi":"10.1109/iTherm54085.2022.9899593","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899593","url":null,"abstract":"This paper discussed the air leakage impact on a 3U system thermal behavior and provide reference to system that do not have independent cooling zone. The system is a 3U server with 2U compute bay and 1U storage bay. It is a high-density system to meet customers' requirements on both high-performance computing and storage. There is pressure difference between compute bay and storage bay with cable and busbar passthrough openings. The air leakage through these openings leads to thermal challenges in the compute bay and front HDD in storage bay. Both simulation models and experimental data showed the significant impact of air leakage. The compute bay air flow decreased 18% when leakage area open ratio increased from 10% to 80%. Wind tunnel test data also aligned with simulation data. Thermal validation data showed that the front HDD temperature improved 25C with design reduction in leakage area. With enhanced mechanical solution, the leakage can be significantly improved by 40.5% and 63.1% for different storage configuration.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117141185","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Accelerated Life Cycling of Additively Printed Flexible Linear Charging Circuits and its Effect on Evolution of Line Resistance and Charging Current","authors":"P. Lall, Ved Soni, Scott Miller","doi":"10.1109/iTherm54085.2022.9899687","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899687","url":null,"abstract":"The rising demand and consumer interest in wearable devices, fitness accessories, foldable smartphones, and biomedical equipment has led to a research impetus in the field of flexible electronics. Apart from the feature of device flexibility, incorporation of flexible electronics in a device also leads to weight and bulk reduction resulting in more sleek and thin devices. Thus, in the past few years, there have been studies focusing on the inclusion of traditional electronics components like resistors, capacitors, LEDs, sensors, etc. on flexible substrates like polyimide. In our previous study, we also demonstrated the lamination of thin-flexible Li-ion batteries, which are an integral component of modern consumer electronics products. However, apart from just the battery, the battery charging circuit is also an important component, which needs to be transferred from the rigid PCB format to the flexible format. This study focuses on printing of a battery charging circuit on a flexible polyimide substrate using electrically conductive ink. Electronically conductive adhesives (ECAs) will be used for component attachment to the circuit. Two distinct electronics printing technologies will be used and compared for this task, namely aerosol jet printing and direct ink write printing. A linear battery charging topology will be used to develop the additively printed charging circuit. After its preparation, the flexible charging circuit will be subjected to accelerated life cycling for 50 charging cycles to study its effect on the line resistance of the circuit and the change in battery charging current. To study the effect of the constant current (CC) charge current of the battery on the degradation in circuit line resistance, circuits with varying sense resistors have been fabricated to provide two different CC charge currents, i.e. 1C and 2C. Finally, the reliability of the additively printed charging circuit will be compared with that of an identical circuit printed on a rigid PCB and subjected to the same accelerated life-cycling test.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"25 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123502284","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Novel Cost-Efficient High-Performance Aluminum Cold Plate Solution for Liquid Cooling System","authors":"Xianguang Tan, Li Su, Hongmei Liu, Jiajun Zhang, Jun Zhang, Lijuan Feng, Wenbin Tian, Allen Liang, Hang Cheng, N. Ahuja, Qing Qiao","doi":"10.1109/iTherm54085.2022.9899554","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899554","url":null,"abstract":"As cloud computing and Artificial Intelligence (AI) applications are evolving with high performance computing, CPU’s power and heat flux are both rising along. Traditional air-cooling solution is running into serious heat dissipation challenge and is becoming a bottleneck of system thermal solution. Thus, liquid cooling cold plate design emerges and gradually becomes one of the mainstream heat dissipation solutions due its excellent cooling performance. However, since legacy cold plates are based on copper material, cold plate designs are not widely adopted due to its high cost and heavy weight. In this paper, a novel aluminum liquid cooling cold plate is introduced, it adopts innovative internal structure design and effectively improves heat dissipation performance of aluminum cold plate. In the meantime, compatibility between aluminum cold plate and coolant is researched. An accelerated test model is proposed and verified by experiments. Test result shows that the new aluminum liquid cooling cold plate can support Graphics Processing Unit (GPU) with up to 700W Thermal Design Power (TDP), with thermal resistance below 0.033 ℃ / w @ 2lpm and longtime reliably. Moreover, cost of the aluminum cold plate is 30% lower comparing to legacy copper cold plate design with comparable performance.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123560995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High Performance Pulsating Heat Pipe for Electronics Cooling","authors":"Haris Constantinou, S. Lani, Gautier Rouaze, J. R. Thome","doi":"10.1109/iTherm54085.2022.9899533","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899533","url":null,"abstract":"The purpose of this study was to explore the capabilities and limitations of additive manufacturing technology when it comes to printing a PHP system with an integrated water-cooled condenser. A flat plate PHP with an overall size of 80mm´38mm was designed to be heated on one side of the evaporator section by a resistor contacting a surface area of 899mm2. At the opposite end, a water-cooled condenser was integrated onto both faces with a surface area of 2280mm2. The PHP serpentine consisted of 48 rectangular channels with the following dimensions: 0.6mm wide and 1.7mm tall. Selective laser melting (SLM), a powder bed fusion technology, was used to manufacture the PHP. Some of the main challenges overcome in this study were powder evacuation from the serpentine, eliminating printing defects and respecting tolerances of the interface. An experimental investigation was then undertaken to analyze the performance characteristics of the printed PHPs by varying water inlet temperature, water flow rate, resistive power, and inclination angle. A leak-tight flat plate PHP was printed and successfully de-powdered and post-processed. An external wall thickness of 0.45mm and a channel spacing thickness of 0.15mm was achieved. The total thermal resistance of the device was about 0.15K/W in all orientations including inverted. The thermal resistance of the PHP was around 0.11K/W from a start-up power of 2W to a maximum of 440W. An overall heat flux of 49W/cm2 was achieved with a hot spot heat flux of 190W/cm2. The PHP demonstrated very good thermal performance to deal with high-power electronics and densely packed multi-core microprocessors.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123701886","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal analysis of boiling pot with single coil induction cooker","authors":"Chia-Wei Lin, Hsueh-Che Liu, Yu-Lun Chang, Yu Lin, Ying-Yuan Chen, Chun-Wei Lin, Ming-Shi Huang, H. Hsu","doi":"10.1109/iTherm54085.2022.9899633","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899633","url":null,"abstract":"In this work, a thermal analysis of water boiling using the induction cooking system has been performed. The boiling pot on induction cooker has been simulated by computational fluid dynamics (CFD) with experimental validations. For experimental part, the pot is filled with water and heated by the induction cooker. The temperature of coil, pot, and water is monitored with time varying. For computational part, the multiphase fluid field and solid conduction have been both studied. The heat transfer efficiency of this induction cooking system is estimated as 83.6%. Comparing with experiments, the maximum errors of the bottom pot and coil are 6.1% and 7.9% respectively. The numerical simulation results demonstrate good agreement with experiments. This work offers a better understanding of induction cooking system related dynamics which greatly benefits the practical industry applications.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126720400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Deep Learning Neural Network Approach for Correlation between Print Parameters and Realized Electrical Performance and Geometry on Ink-Jet Platform","authors":"P. Lall, Tony Thomas, Kartik Goyal, Scott Miller","doi":"10.1109/iTherm54085.2022.9899526","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899526","url":null,"abstract":"The use of printed electronics is increasing rapidly and replacing the traditional manufacturing techniques, especially in the consumer electronics sector. In this paper, a closed-loop deep learning approach for correlation of the print parameters with realized electrical performance and geometry estimations on an ink-jet platform is modeled. To print reliable and very fine conductive traces, an estimation of the changes in the print parameters and the realized print dimension is necessary. The inks used for this analysis are both particle and particle-free silver inks, and the comparison of the same is also studied. A closed-loop control algorithm is used to attain the desired electrical and geometrical values by changing the print parameters without any user intervention. This is achieved by an automatic print parameter sensing system using a camera that captures the print to identify the geometry and dimension of the same. Once the realized print parameters are identified, a deep learning neural network regression model based on these parameters is used to predict the desired input print parameters which are used to achieve the desired geometry and dimension of the print. These new parameter values are passed on to the printing software to optimize the print and attain the desired geometry and printing characteristics. This closed-loop system employs a print characteristics sensing system using a camera, a deep learning neural network regression model to predict the new print parameters, and an auto-update system that changes the values in the printing software. These combinations of the system are used to correlate the print parameters with the realized electrical performance and geometry of the print on an ink-jet printing platform.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114109491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal Management of Two-Sided Heat Load on a Cold Plate Considering the Friction Stir Welding Process","authors":"Murat Parlak, E. Örs, V. Yağcı","doi":"10.1109/iTherm54085.2022.9899552","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899552","url":null,"abstract":"Friction Stir Welding (FSW), known as solid-state welding, is a suitable cost-efficient production technique as the number of cold plates is high and the time allocated for the mass production is limited. After it is discovered in 1991 by The Welding Institute (TWI) of the United Kingdom, Friction Stir Welding (FWS) in general, is the mostly preferred production technique as the heat loads are located on one side of the plate and the shape of the channel is usually simple. However, the two-sided heat sources case became a very common application in electronic cooling to obtain compact design especially for Active Phased Array Radar Antenna in aviation platform resulting in a complex cold plate design. In this study, some thermal and structural problems with identical two-sided high heat flux on a cold plate are discussed with the application of both FSW and Vacuum Brazing (VBR) techniques. In addition, solution alternatives are evaluated and supported with CFD analysis. Since the size, weight, and power (SWaP) are essential to have a compact and efficient solution, it is crucial to make an optimization depending on the Re number to keep the pressure drop as low as possible providing efficient cooling as well. The present study focuses on different heat sink designs and positioning affecting the cold plate overall design and discusses the advantages and disadvantages by considering the cooling requirement and mechanical design as the product is made with FSW.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"192 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121108808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Control of a Hybrid Thermal Management System: A Heuristic Strategy for Charging and Discharging a Latent Thermal Energy Storage Device","authors":"Michael Shanks, Neera Jain","doi":"10.1109/iTherm54085.2022.9899546","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899546","url":null,"abstract":"The use of a real-time controller for managing the recharging and discharging strategy of the thermal energy storage (TES) device in a hybrid thermal management system (TMS) is critical to realizing the intended performance benefits of such systems. For systems involving rapid cooling of power electronics, such as increasingly electrified air vehicles, new control strategies are needed that can accommodate (1) faster timescales associated with the TES dynamics and (2) limited knowledge of upcoming heat loads. This paper considers a hybrid TMS consisting of a single-phase cooling loop and a phase change material-based TES device. Unlike the model predictive control (MPC) and other optimal methods commonly used to control such systems, this paper implements a heuristic logic-based controller leveraging a higher-order TES model to gain additional knowledge of the internal temperature distribution of the TES. The controller regulates the temperature of the surface of a cold plate attached to a heat source that produces a transient heat load disturbance signal. Additionally, with no knowledge of upcoming disturbances, the controller must manage and conserve the state of charge of the TES device, specifically determining when it is possible to recharge and discharging only when necessary. A simulated case study demonstrates that the controller successfully maintains the cold plate temperature below a critical upper limit of 45°C during a 250 second simulation, with the exception of a 2 second period during the largest heat pulse (6 kW) when the upper limit is exceeded. Furthermore, it is shown that in order for a conventional TMS without TES to maintain the cold plate temperature below the same upper limit, the conventional TMS needs both a heat exchanger and fluid tank volume four times the size of those included in the hybrid TMS. During the same 250 second simulation, the oversized conventional TMS also exceeds the upper limit temperature during the 6 kW heat pulse, albeit for 5 seconds instead of 2; this is due to the slower dynamics of the heat exchanger as compared to those of the TES.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"503 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116697181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Impact of Improved Ducting and Chassis Re-design for Air-Cooled Servers in a Data Center","authors":"Himanshu Modi, Uschas Chowdhury, D. Agonafer","doi":"10.1109/iTherm54085.2022.9899625","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899625","url":null,"abstract":"In recent years, there has been a phenomenal increase in cloud computing, networking, virtualization, and storage, leading to the rise in demand for data centers. There is a need for the latest computing nodes to meet this demand, which causes an increase in power consumption. The cooling system occupies almost 30%-40% portion of the total energy consumption. Per ASHRAE TC 9.9, IT equipment needs to operate within recommended and allowable temperatures (18-27°C) and humidity zone based on the cooling classes (A1-A4). As the inlet air temperature increases, fan power consumption increases. The Central Processing Units (CPUs) and high heat-generating components inside each server must operate at their respective reliable operating temperatures. In most cases, air cooling is used in a data center, and it becomes difficult to maintain lower component temperatures at lower airflow rates with increase in Thermal Design Power (TDP). A chassis design optimization is performed over the chassis structure of the air-cooled server to provide better airflow for the cooling of the main components. Vent openings are provided on the sides of the server to bypass the front placed hard drives and provide additional airflow paths. Parametrization was performed for the hole diameters, area of perforation, and operating speed for fans while considering Electromagnetic Interference (EMI) best practices and following guidelines to avoid stress concentration on mounting rail and chassis situated in a rack. An improved duct is proposed and implemented inside a 1U server (Cisco C220 M3) to find a sweet spot between the trade-off of an increase in pressure drop across the server and junction temperature of components. Overall, the study evaluates the new duct and the redesigned chassis with side vents by showcasing the simulated results showing the reduction in the fan speeds by 38% and thus increasing the savings of fan power consumption by 72%, achieving a maximum of 16% drop in component temperatures.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126987978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Novel Outdoor Edge Server Design with Hybrid Air Cooling and Refrigeration","authors":"Liwen Guo, Tzuchun Hung, Cheng-Hua Huang, Minghua Duan, Chiming Jao, Vinson Lin, R. Yuan, Dechao Kong, Hai Du, Xiaojin Fan, Dong Xun, Jun Zhang, Min Wu, Wenqing Lv, Carrie Chen, Candy He, N. Ahuja, Qing Qiao","doi":"10.1109/iTherm54085.2022.9899539","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899539","url":null,"abstract":"Edge servers are trending up to 24% of total global server deployment in 2024. Several emerging applications are required to deploy with edge servers in harsh outdoor edge environments where special system design is required to address the challenges of extended temperature, waterproof ratings of IP65 or above, corrosion resistance, lightening protection, antifreeze and so on, compared with data center server. In parallel, as more AI services extended to edge from datacenter, high TDP CPUs and GPUs deployed in data center have been relocated in footprint constraint, -40~55+℃ extended temperature edge environments which calls for advanced thermal solutions with air cooling optimal techniques, heat exchangers, and refrigeration. This paper introduces a novel outdoor Xeon Scalable Processor edge server design with hybrid cooling solution of two-layer air cooling by the inner and outer circulations mechanism, companioned with refrigeration techniques. This hybrid cooling solution optimal for energy efficiency and edge server reliability, efficiently addressed the challenges of redeployment from datacenter to extended temperature edge environments for IT devices or components whose working temperature is limited within 5~35℃ data center or 5~45℃ High Temperature Ambient (HTA) data center level. Engineering design artwork results include thermal simulation, validation test data as well as filed deployment cases are also summarized in this paper.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133626428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}