2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)最新文献_第4页

Deep-Ultraviolet Thermoreflectance Thermal Imaging of GaN High Electron Mobility Transistors 氮化镓高电子迁移率晶体管的深紫外热反射热成像

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899680

Daniel C. Shoemaker, A. Karim, D. Kendig, Hyungtak Kim, Sukwon Choi

{"title":"Deep-Ultraviolet Thermoreflectance Thermal Imaging of GaN High Electron Mobility Transistors","authors":"Daniel C. Shoemaker, A. Karim, D. Kendig, Hyungtak Kim, Sukwon Choi","doi":"10.1109/iTherm54085.2022.9899680","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899680","url":null,"abstract":"Featuring broadband operation and high efficiency, gallium nitride (GaN)-based radio frequency (RF) power amplifiers are key components to realize the next generation mobile network. However, to fully implement GaN high electron mobility transistors (HEMT) for such applications, it is necessary to overcome thermal reliability concerns stemming from localized extreme temperature gradients that form under high voltage and power operation. In this work, we developed a deep-ultraviolet thermoreflectance thermal imaging capability, which can potentially offer the highest spatial resolution among diffraction-limited far-field optical thermography techniques. Experiments were performed to compare device channel temperatures obtained from near-ultraviolet and deep-ultraviolet wavelength illumination sources for the proof of concept of the new characterization method. Deep-ultraviolet thermoreflectance imaging will facilitate the study of device self-heating within transistors based on GaN and emerging ultra-wide bandgap semiconductors (e.g., β-Ga2O3, AlxGa1-xN, and diamond) subjected to simultaneous extreme electric field and heat flux conditions.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132112670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

The study of Thermosyphon solution for high performance switch 高性能开关用热虹吸溶液的研究

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899522

Yaoyin Fan, Peng Xiao, Wei Liu

{"title":"The study of Thermosyphon solution for high performance switch","authors":"Yaoyin Fan, Peng Xiao, Wei Liu","doi":"10.1109/iTherm54085.2022.9899522","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899522","url":null,"abstract":"Thermal is becoming more and more challenging for Data center switch in recent years along with increased switching bandwidth demand. For next generation 800G switching technology, TDP of 25.6T ASIC chipset called Tomahawk 4 (TH4)-112G from Broadcom is up to 580W, which is 60% power increase than TH3 of previous generation 12.8T. The required thermal performance for heat sink represented by Rca should be within 0.043°C/W based on 105°C junction limit at 45°C ambient temperature, which farther beyond thermal performance that traditional heat sink can achieved refer to 0.09°C/W of thermal performance achieved with vapor chamber-based heat sink in 1U 400G belly-to-belly chassis.In this paper, thermosyphon solution as an alternative solution of traditional heat pipe or vapor chamber-based heat sink in air cooling space is studied to identify thermal feasibility for 25.6T ASIC chipset in 1U form factor chassis. Experiment result presents that thermal performance of thermosyphon prototype is 0.077°C/W under 312.8W power consumption in a 1U 400G switch. Furthermore, thermal correlation analysis between experiment and simulation result is conducted to calibrate thermal modeling of thermosyphon, which will be used for further study on thermosyphon solution as a viable candidate for high-power chipset cooling.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"305 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114004071","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Flow Optimization for the Thermal Management of Heavy-Duty Batteries Using Viscoelastic Coolants 粘弹性冷却剂用于重型电池热管理的流动优化

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899543

Tamal Roy, R. Miguel, David Taylor, D. Poulikakos

{"title":"Flow Optimization for the Thermal Management of Heavy-Duty Batteries Using Viscoelastic Coolants","authors":"Tamal Roy, R. Miguel, David Taylor, D. Poulikakos","doi":"10.1109/iTherm54085.2022.9899543","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899543","url":null,"abstract":"An efficient thermal management system is crucial for the best performance of heavy-duty electric vehicle (EV) battery packs. The requirement of high heat removal necessitates the use of liquid coolants leading to higher heat transfer coefficient as compared to the conventional air-cooled systems. However, higher viscosity of the liquid coolants increases the pumping power and reduces mixing in the thermal boundary layer (TBL), hence reducing the coefficient of performance (COP, ratio of the heat transfer rate to the pumping power) of the cooling system. We demonstrate a novel immersion cooling strategy, which uses shear-thinning viscoelastic fluids with millimetric structures on the heat transfer surface. The shear-thinning property reduces the pumping power, while the viscoelastic properties generate elastic instabilities on carefully designed surface structures and thereby promote mixing in the TBL. We optimize the shape of the surface structures and properties of the cooling liquids to achieve maximum COP using computational fluid dynamics (CFD) simulation in OpenFOAM. The viscoelastic model liquids are made of solvents and polymers with known relaxation times. We explore the parameter range including solvent and polymer viscosities, relaxation time of the polymers and shape of the surface structures, which provide the initial design guidelines for an experimental setup. Our method is expected to enhance the performance of heavy-duty battery thermal management systems as compared to that of the state-of-the-art solutions.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"250 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115234679","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Building reliable FE simulation models for a better behavior prediction of power electronic systems 为更好地预测电力电子系统的性能，建立可靠的有限元仿真模型

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899589

Heiner Möller, R. Dudek, A. Otto, S. Rzepka

引用次数: 0

In-slot Cooling for High Power Density Electric Motor with Encapsulation Channels 带封装通道的高功率密度电动机槽内冷却

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899559

Zhaoxi Yao, R. Mandel, F. McCluskey

{"title":"In-slot Cooling for High Power Density Electric Motor with Encapsulation Channels","authors":"Zhaoxi Yao, R. Mandel, F. McCluskey","doi":"10.1109/iTherm54085.2022.9899559","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899559","url":null,"abstract":"The desire to reduce carbon emissions, noise, and fuel consumption is driving recent research on electrification of traditional combustion power units. High power density motors are essential for large-scale, heavy-duty applications. To achieve high power density, thermal management systems are critical as, at elevated temperatures, electric motors are susceptible to reduced performance or even catastrophic failure.The stator winding is the primary heat source in high power motors and is the major challenge in cooling system design. Not only is controlling the temperature important for safe operation, but also the resistance of the winding increases with higher temperature, lowering the motor efficiency. As there is a high thermal conductive resistance between the windings and traditional cooling structures built on the outer surface of the motor, direct in-slot cooling is required to achieve the needed thermal management. In this paper, a novel in-slot cooling approach is discussed for a permanent magnet motor with power density higher than 22 kW/kg, based on active mass. In this approach, the stator slot, including the winding within, is encapsulated with high thermal conductivity potting material. Fluid channels are built directly into the winding turns by an investment casting process, reducing the thermal resistance between the winding and the coolant. A manufacturing process is proposed, and five different configurations are simulated and compared.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117130739","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Design and Thermal Performance Testing of a Vapor Chamber Containing a Wettability Patterned Condenser for High-Heat Flux Applications 高热流密度应用中含有润湿性图案冷凝器的蒸汽室的设计和热性能测试

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899506

A. Yadav, N. D. Patil

{"title":"Design and Thermal Performance Testing of a Vapor Chamber Containing a Wettability Patterned Condenser for High-Heat Flux Applications","authors":"A. Yadav, N. D. Patil","doi":"10.1109/iTherm54085.2022.9899506","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899506","url":null,"abstract":"Vapor chambers with wettability patterned surfaces have shown a significant reduction in thermal spreading resistance and have a superior overall heat transfer coefficient. The thermal performance of the vapor chamber is limited by the evaporation and condensation process inside it. Due to the increasing power density of electronic devices, an opportunity to improve the performance of the condenser side of VC needs to be explored. Vapor Chamber utilizes the principle of a two-phase heat transfer process to spread and dissipate heat, and the introduction of wettability patterns on the condenser can improve the condensation process and liquid mobility by providing a more exposed surface for the condensation process. In such type of study, the thermal resistance network of the system plays a substantial role in thermal performance. Thus, in this paper, one-dimensional modeling of the vapor chamber considering thermal resistance network containing a wettability patterned condenser surface has been carried out to investigate the effect of biphilic patterns and their arrangement on the condensation process and fluid mobility. Arrays of flower-shaped hydrophilic patches are made on the hydrophobic condenser surface of a VC and the one-dimensional model was made, which accounts for the phase core pressure, and liquid mobility.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124677158","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Study on cooling system for SR motors by pumpless forced convection boiling equipment with liquid dielectric coolant 含液体介质冷却剂的无泵强制对流沸腾装置对SR电机冷却系统的研究

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899642

Hirotsugu Aoyama, Shohei Ohashi, Qian Yu, K. Matsuda

{"title":"Study on cooling system for SR motors by pumpless forced convection boiling equipment with liquid dielectric coolant","authors":"Hirotsugu Aoyama, Shohei Ohashi, Qian Yu, K. Matsuda","doi":"10.1109/iTherm54085.2022.9899642","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899642","url":null,"abstract":"A forced convection boiling system with liquid dielectric coolant is proposed as a new cooling system for SR motors (switched reluctance motors) for electric vehicles. In a previous study, the superiority of cooling by liquid dielectric coolant was confirmed compared to conventional cooling by epoxy resin. We have improved the cooling method using this liquid dielectric coolant and devised a method to cool the coils by forced convection boiling of the liquid dielectric coolant inside the motor. The liquid dielectric coolant is divided into a \"heating room\" that is directly heated by coils and a \"cooling room\" that is cooled by external cooling water, and the liquid dielectric coolant is circulated in the two rooms. This system is named the \"Boiling Immersion Cooling System\". However, if boiling cannot be controlled, the coils are exposed from the liquid surface and the cooling capacity is lost. In this experiment, this cooling system was verified by experiment. In addition, to reduce the cost of performance estimation and model improvement, a thermo-fluid analysis method was established to reproduce the boiling phenomenon of liquid dielectric coolant in the simulation. Thermo-fluid analysis and experiments confirmed that thermal runaway due to coil exposure does not occur even when the heat generated by the coil is assumed to be 19 kW at the motor's steady-state output.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123610908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Parametric Study of The Geometry Design of Through-silicon Via in Silicon Interposer 硅中间体中通硅孔几何设计的参数化研究

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899623

K. Pan, Yangyang Lai, Jiefeng Xu, Pengcheng Yin, J. Ha, Chongyang Cai, Junbo Yang, Seungbae Park

{"title":"Parametric Study of The Geometry Design of Through-silicon Via in Silicon Interposer","authors":"K. Pan, Yangyang Lai, Jiefeng Xu, Pengcheng Yin, J. Ha, Chongyang Cai, Junbo Yang, Seungbae Park","doi":"10.1109/iTherm54085.2022.9899623","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899623","url":null,"abstract":"Silicon interposer has been widely used in advanced IC packages as the interconnection to achieve heterogeneous integration and higher packaging density. However, thermomechanical reliability concerns of silicon interposers induced by the CTE mismatch between the silicon and the through-silicon vias (copper) need to be well understood. This study investigates the reliability of silicon interposers with different combinations of design parameters including the diameter and the pitch of the vias, and the thickness of the silicon substrate during the thermal cycling. The temperature profile is from room temperature (RT) 23°C to 400°C and then cooled to RT. Based on the numerical simulation, the protrusion of the copper via and the in-plane deformation of the silicon during thermal cycling are obtained. Unrecoverable copper protrusions are observed because of the creep behavior of the copper at high temperatures. The max. principal stress of the silicon substrate during thermal cycling is utilized to assess the reliability of the silicon for potential cracking failure. Furthermore, a machine learning model based on an artificial neural network (ANN) is developed, which reduces the computational time from 1.5 hours to 10 seconds. This well-trained ANN model can be used in the design stage of the silicon interposer to obtain the optimum design parameters.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125096068","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Si3N4 Manifold Microchannels Cooling System for High Heat Flux Electronic Applications 用于高热流密度电子应用的Si3N4流形微通道冷却系统

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899560

Yue Qiu, Chirag R. Kharangate, Jennifer L. W. Carter, J. McGuffin-Cawley

{"title":"Si3N4 Manifold Microchannels Cooling System for High Heat Flux Electronic Applications","authors":"Yue Qiu, Chirag R. Kharangate, Jennifer L. W. Carter, J. McGuffin-Cawley","doi":"10.1109/iTherm54085.2022.9899560","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899560","url":null,"abstract":"The increasing energy dissipation in more compact and powerful electronic systems has led to extreme high heat fluxes which call for more effective thermal management solutions. [1] One innovative cooling strategy to meet the dissipation demand is two-phase cooling utilizing manifold-microchannels, it can achieve high heat transfer while maintaining low pressure drops in comparison to conventional two-phase microchannels. For electronics cooling in extreme environment, Si3N4-based ceramic is an ideal substrate due to its high thermal conductivity, low elastic modulus, and sufficient strength and toughness. In this study, a reduced order thermal-fluidic analysis of Si3N4 manifold-microchannel for two-phase boiling flows is conducted for dissipating up to 1 kW of heat from a 1 cm2 heated area on a compact Si3N4 sample. The effect of manifold-microchannel geometry parameters on pressure drop and heat resistance are investigated. The performances of different type of working fluids are also compared, including R134a, R1234yf, R1234ze(E), R245fa, and R1233zd, FC72, and HFE7100. The proposed manifold-microchannels with R134a as the working fluid can achieve low pressure drop ~20 kPa and low thermal resistance ~0.06 K/W with a mass flow rate requirement of 9~ 13 g/s for a heat flux of 1 kW/cm2.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124988789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IT Equipment Cooling Assessement and Metrics IT设备冷却评估和度量

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899612

J. Vangilder, W. Tian, M. Condor

{"title":"IT Equipment Cooling Assessement and Metrics","authors":"J. Vangilder, W. Tian, M. Condor","doi":"10.1109/iTherm54085.2022.9899612","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899612","url":null,"abstract":"The primary goal of data center cooling is to ensure that the temperature of the airflow supplied to the inlets of IT equipment does not exceed a threshold specified by industry guidelines or IT vendors. We stress that the critical temperature is the inlet of the IT equipment (inside the rack) and not inlet (i.e., front door) of the rack itself. However, because it is the airflow patterns inside and outside the rack that dictate the temperature of the air that ultimately reaches IT inlets, IT inlet temperature alone is an insufficient metric for optimizing cooling and identifying the root cause of issues like hot spots. We propose that data center designers and operators performing CFD simulation focus on the key airflow patterns inside and outside the rack – which can be quantified by existing capture index metrics. We discuss the key airflow patterns and metrics and provide an example of how they can be used in practice. Finally, as rack inlet and IT inlet temperatures are sometimes (incorrectly) used interchangeably by the data center community, we quantify the difference between the two through the CFD analysis of a real data center; differences are found to be significant even under conditions which tend to minimize internal-rack recirculation.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121920464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0