Building reliable FE simulation models for a better behavior prediction of power electronic systems

Abstract

In this paper, an approach for linking experimental data from active power cycling tests and FE model based results is discussed. An exemplary numerical study of a TO-220 diode as typical discrete power device was conducted with a sliced and an intact specimen. During two electro-thermal DoE analyses several parameters were varied and the model behavior depending on material properties and boundary conditions was investigated. This approach enabled the identification of the most influential parameters and derivation of behavioral models. During a following calibration it was possible to improve the prognostic abilities of the built FE models significantly. Maximum and minimum junction temperatures as well as infrared images were used for a comparison of the thermal results. Additionally thermo-mechanical analyses of the sliced model were compared with microscopic images from the cutting surface. In general, a good match for the temperature and deformation results was determined.