一种新型混合空气冷却和制冷的室外边缘服务器设计

Liwen Guo, Tzuchun Hung, Cheng-Hua Huang, Minghua Duan, Chiming Jao, Vinson Lin, R. Yuan, Dechao Kong, Hai Du, Xiaojin Fan, Dong Xun, Jun Zhang, Min Wu, Wenqing Lv, Carrie Chen, Candy He, N. Ahuja, Qing Qiao
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引用次数: 0

摘要

到2024年,边缘服务器将占全球服务器部署总量的24%。一些新兴应用需要在恶劣的室外边缘环境中部署边缘服务器,与数据中心服务器相比,需要特殊的系统设计来应对扩展温度、防水等级IP65或以上、耐腐蚀、防雷、防冻等挑战。与此同时,随着越来越多的人工智能服务从数据中心扩展到边缘,部署在数据中心的高TDP cpu和gpu已被重新安置在占地面积有限的-40~55+℃扩展温度边缘环境中,这需要先进的热解决方案,包括空气冷却优化技术、热交换器和制冷。本文介绍了一种新型的室外Xeon可扩展处理器边缘服务器的设计方案,该方案采用内外循环机制的双层空气冷却混合冷却方案,并结合制冷技术。这种混合冷却解决方案可优化能源效率和边缘服务器可靠性,有效地解决了IT设备或组件从数据中心重新部署到扩展温度边缘环境的挑战,这些设备或组件的工作温度限制在5~35℃数据中心或5~45℃高温环境(HTA)数据中心级别。工程设计成果包括热模拟、验证试验数据以及现场部署案例。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel Outdoor Edge Server Design with Hybrid Air Cooling and Refrigeration
Edge servers are trending up to 24% of total global server deployment in 2024. Several emerging applications are required to deploy with edge servers in harsh outdoor edge environments where special system design is required to address the challenges of extended temperature, waterproof ratings of IP65 or above, corrosion resistance, lightening protection, antifreeze and so on, compared with data center server. In parallel, as more AI services extended to edge from datacenter, high TDP CPUs and GPUs deployed in data center have been relocated in footprint constraint, -40~55+℃ extended temperature edge environments which calls for advanced thermal solutions with air cooling optimal techniques, heat exchangers, and refrigeration. This paper introduces a novel outdoor Xeon Scalable Processor edge server design with hybrid cooling solution of two-layer air cooling by the inner and outer circulations mechanism, companioned with refrigeration techniques. This hybrid cooling solution optimal for energy efficiency and edge server reliability, efficiently addressed the challenges of redeployment from datacenter to extended temperature edge environments for IT devices or components whose working temperature is limited within 5~35℃ data center or 5~45℃ High Temperature Ambient (HTA) data center level. Engineering design artwork results include thermal simulation, validation test data as well as filed deployment cases are also summarized in this paper.
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