2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)最新文献_第2页

Analysis of thermal management strategies for packaging high power fiber optic waveguides 高功率光纤波导封装热管理策略分析

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899500

Adam A. Wilson, M. Fish, R. Hoffman, D. Sharar

{"title":"Analysis of thermal management strategies for packaging high power fiber optic waveguides","authors":"Adam A. Wilson, M. Fish, R. Hoffman, D. Sharar","doi":"10.1109/iTherm54085.2022.9899500","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899500","url":null,"abstract":"High power fiber optic waveguides are emerging as a critical component in high energy laser systems, optical relay of electrical power, and optoelectronic devices. To make use of the advantages of higher power density in these systems, a thorough understanding of the heat dissipation characteristics and thermal management strategies must be developed. With this aim in mind, we report a parametric multi-physics analysis to guide in the materials selection and design of thermal management strategies that would enable operation at previously unobtainable powers and wavelengths. We offer practical design considerations for packaging materials, heat sink design, and containment geometries, and offer insights into how to increase thermally limited power output beyond commercially available state of the art strategies. The results of this parametric analysis suggest that substrate/containment material thermal conductivity should exceed 100 Wm-1K-1, and that under that condition, both heat sink cooling strategy and filler thermal conductivity substantially affect peak temperature. High filler thermal conductivity and high heat sink convective coefficient are required to the point that cutting-edge strategies for conductivity and convective enhancements may be required to allow operation under the desired parameters.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124650412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

SSD Thermal Throttling Profile Prediction Using Neural Network 基于神经网络的SSD热节流剖面预测

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899566

Chaolun Zheng, Hedan Zhang, Steve Chi, Ning Ye

{"title":"SSD Thermal Throttling Profile Prediction Using Neural Network","authors":"Chaolun Zheng, Hedan Zhang, Steve Chi, Ning Ye","doi":"10.1109/iTherm54085.2022.9899566","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899566","url":null,"abstract":"In the past decades, the growing capacity and performance of Solid-State Drives (SSDs) have resulted in higher power consumption and increasing thermal challenges. Thermal throttling has been widely adopted in SSD products to keep critical component temperatures within limits. While thermal throttling profiles are essential for SSD performance in firmware developments, using the traditional Computational Fluid Dynamics (CFD) approach to simulate thermal throttling profiles can be time-consuming. In this paper, a fast-prediction method using a neural network approach is proposed for predicting the thermal throttling profiles under different workloads. The Long Short-Term Memory (LSTM) neural network framework has been adopted in this method. The neural network will learn from the testing data of a single workload to model the thermal performance and hence predict thermal throttling profiles for various workloads. Results have shown that the predicted thermal throttling profiles for various workloads align with experimental test data with good accuracy. Prediction time is significantly reduced to a few minutes. This work has demonstrated that machine learning can be effectively applied to SSD thermal test data to model thermal performances with different test parameters, including power, ambient temperature, and throttling temperature limits.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124726131","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal analysis of advanced back-end-of-line structures and the impact of design parameters 先进后端结构的热分析及设计参数的影响

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899564

Xinyue Chang, H. Oprins, M. Lofrano, B. Vermeersch, I. Ciofi, O. Pedreira, Z. Tokei, I. De Wolf

{"title":"Thermal analysis of advanced back-end-of-line structures and the impact of design parameters","authors":"Xinyue Chang, H. Oprins, M. Lofrano, B. Vermeersch, I. Ciofi, O. Pedreira, Z. Tokei, I. De Wolf","doi":"10.1109/iTherm54085.2022.9899564","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899564","url":null,"abstract":"In this paper, we present a thermal analysis of advanced back-end of line (BEOL) structures. This analysis includes an assessment of the equivalent out-of-plane thermal conductivity of the BEOL stack, the Joule heating of metal lines inside the BEOL stack, and a benchmark study of the impact of different design parameters, material properties, via layout, and an evaluation of the specific impact of barriers. The thermal analysis is conducted with 3D finite element models of two BEOL stack examples. The comprehensive sensitivity analysis of material properties shows that the dielectric thermal conductivity strongly impacts the BEOL thermal performance, and that the metal electrical resistivity has the strongest impact on Joule heating. In addition, the metal thermal conductivity and the barriers' electrical resistivity also give significant contributions. The via density DOE shows dramatic changes in BEOL thermal conductivity. The thermal impact of the barrier is also studied for different prototypical hybrid interconnect structures.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123808311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Natural Convection Heat Transfer Enhancement using Functionalized Nanodiamonds in Transformer Oil 利用功能化纳米金刚石增强变压器油自然对流换热

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899613

V. Prabhu, Ethan Languri, J. Davidson, D. Kerns, L. Costa, Glenn Wilson

{"title":"Natural Convection Heat Transfer Enhancement using Functionalized Nanodiamonds in Transformer Oil","authors":"V. Prabhu, Ethan Languri, J. Davidson, D. Kerns, L. Costa, Glenn Wilson","doi":"10.1109/iTherm54085.2022.9899613","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899613","url":null,"abstract":"Efficient transformer cooling is an important factor in increasing the lifetime of transformer and reducing the associated maintenance costs. It has been reported that the lifetime of the transformer is increased by 10% with 1 °C decrease in the core temperature. The transformer oil which is a typically a mineral oil, used commonly in cooling of transformers has an inherent disadvantage of low thermal conductivity. This limits the amount of heat transfer from the core of the transformer to the surroundings. This research discusses the improvement of thermal conductivity of transformer oil by using functionalized nanodiamond (fND) particles in transformer oil. In this study, enhancement in natural convection heat transfer is studied by using two different concentrations (0.2 wt.% and 0.4 wt.%) of fND in transformer oil and compared with the base transformer oil. A tall container insulated from all sides and heated from one side is considered for the experiment's geometry. The natural convection is observed in the container and the experimental results are validated with the theoretical model. The observed enhancement in heat transfer coefficient for 0.2 wt.% sample was 41.7% and for 0.4 wt.% sample was 82.5%.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123924615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Development of a numerical simulation model for predicting the temperature of a flip-chip package during the laser-assisted bonding (LAB) process 建立了激光辅助键合(LAB)过程中倒装封装温度的数值模拟模型

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899659

J. Lee, S. Kim, B. Kim

{"title":"Development of a numerical simulation model for predicting the temperature of a flip-chip package during the laser-assisted bonding (LAB) process","authors":"J. Lee, S. Kim, B. Kim","doi":"10.1109/iTherm54085.2022.9899659","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899659","url":null,"abstract":"The Laser-assisted bonding (LAB) method has recently been developed as a next-generation technology. It is a very important factor for the quality of bonding whether the temperature of solder rises above the melting point and maintains enough to melt. However, by the existing measurement method, only the temperature of the silicon chip can be measured so the temperature of solder is still unclear. Therefore, to predict the temperature of the whole flip-chip package including the solder bumps during the LAB process, a numerical simulation model is developed. Governing equations for transient heat conduction are solved using the Finite Volume Method(FVM). The absorbed laser in each layer is analyzed based on the optical characteristics of the laser, which contributes to the heat generation rate of governing equation. Based on the increasing contact area of solder bump during the melting process, point-contact to area-contact, the melting process of solder bumps is replaced by introducing the effective thermal conductivity according to the contact area between solder bump and substrate. Through the simulation model developed in this study, the transient temperature profile during the LAB process is obtained. The temperature of the silicon chip obtained by the simulation model is compared to that measured by IR thermometry to validate the simulation model. It is confirmed that the melting process is well reflected through the fact that inflection points of temperature profile are shown in both simulation results and IR thermometry. Furthermore, it is expected that the warpage problem and optimized process conditions can be analyzed using the numerical simulation developed in this study.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121743913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Crystal Plasticity Finite Element Modeling to Explain the Effects of β-Sn Crystal Orientation on SAC305 Solder Ball Deformation 用晶体塑性有限元模型解释β-Sn晶体取向对SAC305钎料球变形的影响

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899548

D. Mondal, J. Suhling, P. Lall

{"title":"A Crystal Plasticity Finite Element Modeling to Explain the Effects of β-Sn Crystal Orientation on SAC305 Solder Ball Deformation","authors":"D. Mondal, J. Suhling, P. Lall","doi":"10.1109/iTherm54085.2022.9899548","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899548","url":null,"abstract":"SAC305 solder alloy is one of the most widely used lead-free materials to fabricate solder joints in electronic packaging industries. Almost 97% weight percentage is β-Sn which is a highly directional material in terms of elastic modulus (E) and coefficient of thermal expansion (CTE). Since β-Sn is a crystalline material, deformation beyond the elastic limit is described by various atomic planes and directions, which are termed as slip systems together. Ten different slip families have been recognized in literatures for β-Sn body-centered tetragonal (BCT) crystals. When external load is applied on solder balls, plastic deformation is dictated by the movement of dislocations and direction of deformation is defined by slip properties.In this study, a physics-based crystal plasticity finite element (CPFE) model has been used to explain the mesoscale deformation behavior of solder joints that have dimensions in the sub-millimeter range. A crystal plasticity theory-based subroutine was implemented in ABAQUS finite element (FE) software to forecast the effects of β-Sn crystal orientations on overall deformation behavior of SAC305 BGA solder joints. Since the crystal c-axis is the strongest axis in terms of elastic modulus, a number of finite element models were developed and run with varying c-axis orientation in the x-y plane to assess the effects of various slip systems on the deformation patterns.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131447305","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Characterization of Constitutive Equation of Sn-Bi by Studying Creep Behavior of Flip Chip Solder Joints 用倒装片焊点蠕变行为表征Sn-Bi的本构方程

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899670

Chongyang Cai, K. Pan, K. Deo, Yangyang Lai, Junbo Yang, Jing Wang, Seungbae Park

{"title":"Characterization of Constitutive Equation of Sn-Bi by Studying Creep Behavior of Flip Chip Solder Joints","authors":"Chongyang Cai, K. Pan, K. Deo, Yangyang Lai, Junbo Yang, Jing Wang, Seungbae Park","doi":"10.1109/iTherm54085.2022.9899670","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899670","url":null,"abstract":"With the development of lead-free solder, Sn-Bi solder is becoming more widely used in industry due to its unique properties. One of the advantages of the Sn-Bi solder is that the low melting temperature of the eutectic Sn-Bi solder will reduce the reflow cost. Moreover, the coefficient of thermal expansion of Sn-Bi solder is around 15 ppm/C, which is close to the substrate material and will help improve the board level reliability during thermal cycling. In the study of board level reliability, the constitutive equation of solder is used to describe the nonlinear behavior of solder joints during creep. However, limited datasheet is provided for the material properties of Sn-Bi solder. One of the methods is to extract the creep testing data results and obtain the constants in governing equation by curve fitting. However, this method requires mathematical simplification and previous studies are mostly focused on bulk samples. In this study, the eutectic Sn42Bi58 solder balls are tested under different constant loadings. Using 2D digital image correlation (DIC) technique, the displacement data as well as the creep rates can be obtained. As a result, the constitutive equation of Sn-Bi solder is obtained in the form of Garofalo model by nonlinear regression of the experimental data. Finite element modeling is performed based on the acquired constants, the good agreement with experimental data validates the fitted results in the constitutive equation.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133775869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Evolution of Fatigue Reliability of UF-Substrate Interfaces under High Temperature Exposure 高温下uf -基板界面疲劳可靠性演化

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899542

P. Lall, Padmanava Choudhury

{"title":"Evolution of Fatigue Reliability of UF-Substrate Interfaces under High Temperature Exposure","authors":"P. Lall, Padmanava Choudhury","doi":"10.1109/iTherm54085.2022.9899542","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899542","url":null,"abstract":"Automotive electronics increasingly requires the use of high I/O packaging owing to applications requiring advanced computing in safety critical functions such as lane-departure warning, collision-avoidance systems, driver-alertness monitoring, adaptive cruise-control, and semi-autonomous navigation. Most electronics are present in front of the firewall in automotive underhood, hence subjected to high temperatures in the range of 100°C-200°C for sustained periods of vehicle use-life. Underfills needed to reinforce interconnects in FCBGAs have been shown to fail at the interface under thermal cycling prior to solder joint failure. Underfill-substrate interface reliability is not well understood. In this study underfills-substrates have been subjected to high temperature 100°C for a sustained period of upto 90 days. The samples have been subjected to cyclic loading till catastrophic failures with 4-point bend. Stress Intensity Factor (SIFs) and number of cycles (Nf) to failure has been measured to characterize fatigue crack growth delamination. The evolution of Paris power law fatigue constants has been studied over the aging period to understand the degradation of the underfills under sustained high temperature operation reflective of automotive underhood. A slope parameter is developed to categorize and rank the performance of the different underfills under cyclic bend loading.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115374553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS 用ECA和LTS制备带元件连接的铜增材多层电路的工艺开发

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899536

P. Lall, Jinesh Narangaparambil, Kyle Schulze, C. Hill

{"title":"Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS","authors":"P. Lall, Jinesh Narangaparambil, Kyle Schulze, C. Hill","doi":"10.1109/iTherm54085.2022.9899536","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899536","url":null,"abstract":"The increased versatility in the design and production of low-volume components, as well as the shorter time between design and prototype, has intensified interest in the subject of additively printed electronics. The continuous attempts to miniaturize traditional forms in terms of both size and weight are a reason why flexible electronics will emerge as a modern alternative in the technical industry. Direct printing on a range of substrates, whether rigid, flexible, or conformable, offers numerous advantages over traditional electronics production processes. Furthermore, the increasing complexity of flexible electronics demands the creation of multilayered circuits comparable to classic PCBs in order to reduce the volumetric and gravimetric influence of the underlying electronics. The majority of commercial PCBs have many component attachments using solder and multilayer functionality. There is a paucity of information on component attachment for flexible electronics applications that integrate multilayer functional qualities employing electrically conductive adhesive (ECA) and low-temperature solder (LTS). In this paper, we used OrCAD software to design and analyze an LED flashing circuit in order to imitate the applications of the Rigid PCBs. We investigated the influence of photonic curing over multiple passes on the mechanical and electrical properties of printed electronics utilizing a microdispensing unit during the multilayer development process. Capacitors, resistors, inductors, diodes, and Op-Amps are examples of components attached utilizing electrically conductive adhesive (ECA) and low-temperature solder (LTS). We will also examine the circuit performance for the two binding materials in order to make a solid application-based material decision.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"236 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115629776","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Sharp Interface Simulation of IMC Growth and Void Evolution in Solder Microbumps 焊料微凸点中IMC生长和空洞演化的锐界面模拟

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI: 10.1109/iTherm54085.2022.9899617

H. Liao, Chetan Jois, S. Prasad, G. Subbarayan

{"title":"Sharp Interface Simulation of IMC Growth and Void Evolution in Solder Microbumps","authors":"H. Liao, Chetan Jois, S. Prasad, G. Subbarayan","doi":"10.1109/iTherm54085.2022.9899617","DOIUrl":"https://doi.org/10.1109/iTherm54085.2022.9899617","url":null,"abstract":"A reliability challenge that arises in 2.5D/3D packages is the voiding of the solder microbump accompanied by the growth of Cu-Sn IMCs in the Cu pillar under electro/thermomigration effects. A reaction-diffusion model governing the multi-physics phenomenon is needed to capture the behavior. In addition, as the size of the microbump decreases, surface diffusion effect also becomes significant. In this work, a solid-state reaction-diffusion model accounting for surface diffusion in addition to bulk diffusion is first proposed, and the governing equations are derived from first principles using continuum thermodynamics. To perform sharp interface simulation, an explicit interface tracking method termed Enriched Isogeomentric Analysis (EIGA) is used. EIGA has the advantage of exactly obtaining the geometric quantities such as the interface normal and curvature that is required to evolve the interface during analysis. However, these geometric properties can only be approximated in the limit of mesh refinement in the commonly used implicit methods such as phase-field and level-set methods. Additionally, EIGA avoids remeshing of the domain when the interface moves. Full joint simulation is carried out considering both intermetallic compound growth and void evolution in solder microbumps. Influence of electrical current stressing is also studied.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"296 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124241775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0