改进管道和机箱重新设计对数据中心风冷服务器的影响

Himanshu Modi, Uschas Chowdhury, D. Agonafer
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引用次数: 2

摘要

近年来,在云计算、网络、虚拟化和存储方面有了显著的增长,导致对数据中心的需求增加。需要最新的计算节点来满足这种需求,这导致了功耗的增加。冷却系统几乎占总能耗的30%-40%。根据ASHRAE TC 9.9, IT设备需要在基于冷却等级(A1-A4)的推荐和允许温度(18-27°C)和湿度区域内运行。进风口温度升高,风扇功耗增大。每台服务器内部的cpu (Central Processing unit)和发热部件必须在各自可靠的工作温度下工作。在大多数情况下,数据中心使用空气冷却,并且随着热设计功率(TDP)的增加,很难在较低气流速率下保持较低的组件温度。对风冷服务器的机箱结构进行机箱设计优化,为主要部件提供更好的散热气流。在服务器的侧面提供了通风口,以绕过前面放置的硬盘驱动器,并提供额外的气流路径。在考虑电磁干扰(EMI)最佳实践的同时,对风扇的孔径、穿孔面积和运行速度进行了参数化,并遵循避免应力集中在机架上的安装导轨和底盘上的指导方针。在1U服务器(Cisco C220 M3)内部提出并实现了一种改进的管道,以在服务器上压降的增加和组件结温之间找到一个平衡点。总体而言,该研究通过展示模拟结果来评估新管道和重新设计的带有侧通风口的底盘,结果显示风扇速度降低了38%,从而增加了风扇功耗节约72%,组件温度最高降低了16%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of Improved Ducting and Chassis Re-design for Air-Cooled Servers in a Data Center
In recent years, there has been a phenomenal increase in cloud computing, networking, virtualization, and storage, leading to the rise in demand for data centers. There is a need for the latest computing nodes to meet this demand, which causes an increase in power consumption. The cooling system occupies almost 30%-40% portion of the total energy consumption. Per ASHRAE TC 9.9, IT equipment needs to operate within recommended and allowable temperatures (18-27°C) and humidity zone based on the cooling classes (A1-A4). As the inlet air temperature increases, fan power consumption increases. The Central Processing Units (CPUs) and high heat-generating components inside each server must operate at their respective reliable operating temperatures. In most cases, air cooling is used in a data center, and it becomes difficult to maintain lower component temperatures at lower airflow rates with increase in Thermal Design Power (TDP). A chassis design optimization is performed over the chassis structure of the air-cooled server to provide better airflow for the cooling of the main components. Vent openings are provided on the sides of the server to bypass the front placed hard drives and provide additional airflow paths. Parametrization was performed for the hole diameters, area of perforation, and operating speed for fans while considering Electromagnetic Interference (EMI) best practices and following guidelines to avoid stress concentration on mounting rail and chassis situated in a rack. An improved duct is proposed and implemented inside a 1U server (Cisco C220 M3) to find a sweet spot between the trade-off of an increase in pressure drop across the server and junction temperature of components. Overall, the study evaluates the new duct and the redesigned chassis with side vents by showcasing the simulated results showing the reduction in the fan speeds by 38% and thus increasing the savings of fan power consumption by 72%, achieving a maximum of 16% drop in component temperatures.
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