1994 Proceedings. 44th Electronic Components and Technology Conference最新文献_第4页

Fine line circuit manufacturing technology with electroless copper plating 化学镀铜微细线电路制造技术

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367562

H. Akahoshi, M. Kawamoto, T. Itabashi, O. Miura, A. Takahashi, S. Kobayashi, M. Miyazaki, T. Mutho, M. Wajima, T. Ishimaru

引用次数: 19

Thermal characterization of a tape carrier package 胶带载体封装的热特性

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367542

D. E. Pope, H. Do

引用次数: 7

A photosensitive-BCB on laminate technology (MCM-LD) 一种光敏- bcb层压技术(MCM-LD)

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367561

A. Strandjord, R. H. Heistand, J. Bremmer, P. Garrou, T. Tessier

{"title":"A photosensitive-BCB on laminate technology (MCM-LD)","authors":"A. Strandjord, R. H. Heistand, J. Bremmer, P. Garrou, T. Tessier","doi":"10.1109/ECTC.1994.367561","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367561","url":null,"abstract":"As Multichip Module (MCM) technology has evolved from research to commercial production, cost has become the important issue for implementation. Manufacturing schemes are incorporating those processes and materials which take advantage of the most cost effective technologies to meet the specific performance requirements for a given application. The work described in this paper demonstrates how laminate based MCM technology (MCM-L) and deposited dielectric technology (MCM-D) can be combined to form a low cost solution for systems requiring high density interconnections. The use of laminate board technology to fabricate the relatively low density interconnect portion of the multilayer structure, allows one to take advantage of the well established and highly cost competitive printed wiring board (PWB) industry. Deposited dielectric technology takes advantage of the high density capabilities, normally associated with MCM-D packaging, to increase performance. Benzocyclobutene (BCB) is a well suited dielectric material for a laminate/deposited dielectric application (MCM-LD) since it can be cured at relatively low temperatures (220-275/spl deg/C). Additionally, the use of BCB as the interlayer dielectric provides a stable copper/BCB interface, excellent planarization over rough topographies, and exhibits very low moisture absorption. Several low cost processing techniques were demonstrated as part of this MCM-LD program. These include an inherently photosensitive BCB formulation as the thin film dielectrics, meniscus coating as the large area deposition process for the photosensitive-BCB, and an in-line belt furnace for Rapid Thermal Curing (RTC). A two layer module was fabricated to demonstrate the feasibility of this MCM-LD process flow. This paper describes the processing issues and techniques associated with such a hybridized interconnection technology.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114064650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

Nonparametric estimation of reliability function using the kernel density estimation method 基于核密度估计方法的可靠性函数非参数估计

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367584

Oh-Gone Chun, S. Ahn, Myung-Yung Jeong, T. Choy, K. Kang, B. Park, Jae-Joo Kim

{"title":"Nonparametric estimation of reliability function using the kernel density estimation method","authors":"Oh-Gone Chun, S. Ahn, Myung-Yung Jeong, T. Choy, K. Kang, B. Park, Jae-Joo Kim","doi":"10.1109/ECTC.1994.367584","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367584","url":null,"abstract":"Analysis of data from an accelerated life test employs a model. Such a statistical model for an accelerated life test consists of a life distribution that represents the scatter in product life and a relationship between life and stress. In this study, the Coffin-Manson relationship is used to model fatigue failure of metals subject to thermal cycling. Generally there are two statistical methods for estimating reliability of objects (life distribution). One is a parametric approach and the other is a nonparametric one. The parametric method assumes that the underlying distribution function belongs to a fixed distribution family indexed by a finite number of parameters. The unknown parameters are then estimated from the data. On the other hand, the nonparametric method does not specify a particular family of distributions. The major difficulty of the parametric approach arises at the stage of model specification. Correct specification of the underlying model is crucial for successful application of the parametric approach. Incorrect specification yields severe model bias and this cannot be compensated in any degree by accurate parameter estimation. In this paper, we provide a nonparametric method to estimate the life distribution under normal usage from accelerated life test data.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128039132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A hi-density C4/CBGA interconnect technology for a CMOS microprocessor CMOS微处理器的高密度C4/CBGA互连技术

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367657

G. Kromann, D. Gerke, W. Huang

引用次数: 33

Surface conductance measurements of adsorbed gases 吸附气体的表面电导测量

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367589

C. Bargeron, T. E. Phillips, R. Benson

引用次数: 0

A method for the optimization of a CMOS driven, center tap terminated (CTT) network in a shared bus design 一种在共享总线设计中优化CMOS驱动、中心抽头端接(CTT)网络的方法

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367598

F.J. Cericola, B. K. Bhattacharyya

引用次数: 4

A novel, lower cost, thermally enhanced exposed silicon plastic package (ESPP) 一种新型、低成本、热增强外露硅塑封装(ESPP)

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367649

F. Djennas, Wilhelm Sterlin

引用次数: 0

Fine line thin dielectric circuit board characterization 细线薄介质线路板表征

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367537

C. S. Chang, A. Agrawal

引用次数: 11

A method of designing a group of bumps for C4 packages to maximize the number of bumps and minimize the number of package layers 一种为C4包装设计一组凸点的方法，使凸点数量最大化，包装层数最少

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367595

N. Gasparini, B. Bhattacharyya

引用次数: 13