1994 Proceedings. 44th Electronic Components and Technology Conference最新文献_第10页

Mechanical and electrical evaluation of a bumped-substrate die-level burn-in carrier 凹凸基板模级烧蚀载体的机械和电气评价

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367594

P. Thompson, M. Begay, S. Lindsey, D. Vanoverloop, B. Vasquez, S. Walker, B. Williams

{"title":"Mechanical and electrical evaluation of a bumped-substrate die-level burn-in carrier","authors":"P. Thompson, M. Begay, S. Lindsey, D. Vanoverloop, B. Vasquez, S. Walker, B. Williams","doi":"10.1109/ECTC.1994.367594","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367594","url":null,"abstract":"A high-yield die supply has been identified as a key requirement for the viability of commercial multichip modules (MCM). The result of die or wafer level test and burn-in, (beyond the level of historical wafer probe), to provide dice with performance and reliability levels equivalent to single chip packaged dice is commonly called known good die (KGD). There are many proposed methods to obtain KGD, at varying levels of maturity, and with varying levels of cost, complexity, and potential impact on device performance and reliability. In this paper, we describe the mechanical and electrical evaluation of a temporary die-level burn-in carrier designed for use in providing known good dice. Three device types are used in this evaluation to explore the limitations of the carrier system under evaluation: a 1 M DRAM, a 128 k/spl times/8 SRAM, and a 56 k gate ASIC. Die size, and bond pad count, size and pitch all impact the applicability of the carrier system under evaluation. Mechanical evaluations performed to date include measurements of critical carrier features such as bump height, die alignment structure placement and bond pad damage caused by the carrier contacts. Electrical evaluations include continuity and electrical test performance at multiple temperatures.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125560093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

High reliability MCM packaging using low stress liquid type epoxy resin by printing encapsulation systems (PES) 采用低应力液体型环氧树脂印刷封装系统(PES)的高可靠性MCM封装

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367638

A. Okuno, K. Nagai, N. Fujita, Y. Tsukasaki, N. Oyama, K. Nakahira, T. Hashimoto

{"title":"High reliability MCM packaging using low stress liquid type epoxy resin by printing encapsulation systems (PES)","authors":"A. Okuno, K. Nagai, N. Fujita, Y. Tsukasaki, N. Oyama, K. Nakahira, T. Hashimoto","doi":"10.1109/ECTC.1994.367638","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367638","url":null,"abstract":"MCM/sup L/ can expect to be the main current of semiconductor packaging technology in near future. BGA, PLCC and PGA packaging methods will expect much of this application. But the most pressing problem is warp after the packaging process. The warp after packaging needs to be below 150 /spl mu/m at BGA and 100 /spl mu/m at PLCC. We have already developed the Printing Encapsulation Systems (PES). PES is able to make low cost and mass produced semiconductor packaging. This paper describes the use of PES to make MCM/sup L/ semiconductor packaging. We have developed a low warp packaging epoxy resin using elastomer modified epoxy resin to fit BGA, PLCC and PGA. We verified the low stress epoxy resin using dynamic mechanical properties and internal stress measurements. We packaged BGA, PLCC and BGA with this low stress epoxy resin using PES, and measured the warp of each packaging. We obtained good results for the warp, demonstrating that using this low stress epoxy resin and PES, low cost and high reliability packaging of BGA, PLCC and PGA could be achieved.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128372367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

The impact of driver impedance upon transmission line impedance 驱动器阻抗对传输线阻抗的影响

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367599

R. E. Canright

引用次数: 1

Application of CFD Technology to electronic thermal management CFD技术在电子热管理中的应用

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367557

T. Lee, B. Chambers, M. Mahalingam

引用次数: 49

Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics 开发一种塑料封装的多芯片技术，用于大批量、低成本的商用电子产品

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367578

R. Fillion, R. Wojnarowski, T. B. Gorcyzca, E. Wildi, H. Cole

{"title":"Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics","authors":"R. Fillion, R. Wojnarowski, T. B. Gorcyzca, E. Wildi, H. Cole","doi":"10.1109/ECTC.1994.367578","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367578","url":null,"abstract":"Non-military/non-computer electronics industry segments such as PCs, workstations, portable electronics, automotive, medical, automated test equipment and high end consumer, are evolving to higher complexity and higher performance circuits and components. At the same time, many of these industry segments are being driven to shrink size, weigh and power dissipation. Standard low cost packaging approaches such as thru-hole PCB and chip and wire hybrids, can no longer efficiently interconnect these more complex circuits. These industry segments are being forced to turn to new higher performance packaging approaches such as SMT, MCM and COB. This paper describes the development of an innovative embedded chip MCM technology that eliminates high cost structures, materials and processes in current thin film MCM technologies. A plastic encapsulated multichip technology has been developed in which an epoxy encapsulant is molded around bare die to form the MCM substrate. This new MCM process readily scales-up to high volume production and is inherently high yielding, while maintaining all of the performance advantages of the GE developed overlay HDI process. This paper describes the thermal, mechanical and chemical stability issues that drove this development, the process used to fabricate the modules and the cost and yield advantages associated with this structure.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126975865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 32

Electrical failure of multilayer ceramic capacitors caused by high temperature and high humidity environment 高温高湿环境下多层陶瓷电容器的电气故障

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367529

F. Yeung, Y. Chan

引用次数: 13

An interface for numerical analysis of convective heat transfer from printed circuit boards 印刷电路板对流换热的数值分析界面

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367602

Y. Ma

引用次数: 1

LDH (laser/detector/hologram) unit for thin optical pick-up head of CD player 用于CD播放机薄光学拾取头的LDH(激光/探测器/全息图)装置

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367566

A. Yoshikawa, H. Nakanishi, K. Itoh, T. Yamazaki, T. Komino, T. Musha

引用次数: 11

Intra-system interconnects for digital communications 用于数字通信的系统内互连

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367532

A. Deutsch, G. Arjavalingam, C. Surovic, A. P. Lanzetta, K. Fogel, F. Doany, M. Ritter

引用次数: 1

Simultaneous switching noise: influence of plane-plane and plane-signal trace coupling 同时开关噪声:平面-平面及平面-信号走线耦合的影响

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367513

A. Vaidyanath, B. Thoroddsen, J. Prince, A. Cangellaris

引用次数: 31