A novel, lower cost, thermally enhanced exposed silicon plastic package (ESPP)

Abstract

The plastic Quad Flat Package has evolved into a large, high pin count package, however higher reliability and thermal dissipation requirements constitute the boundary conditions it must overcome to evolve as a viable high density package. The present mold compounds used as encapsulants have poor thermal conductivities and represent a large portion of the thermal resistance in the plastic package. Existing thermally enhanced plastic packages are prone to delamination, and higher costs. A new plastic package is proposed herein that achieves a new level of reliability and performance, all at a cost lower than the standard plastic package. The ESPP package integrity is analyzed and compared to other thermally enhanced packages. Thermal performance is measured and compared to other packages.<>