1994 Proceedings. 44th Electronic Components and Technology Conference最新文献_第3页

Manufacturability of capacitively coupled multichip modules 电容耦合多芯片模块的可制造性

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367613

T. Knight, D. Salzman

引用次数: 7

C-4/BGA comparison with other MLC single chip package alternatives C-4/BGA与其他MLC单芯片封装方案的比较

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367658

K. Puttlitz, W. Shutler

引用次数: 9

Compact planar optical devices (CPODs) by CVD technology 基于CVD技术的紧凑平面光学器件(CPODs)

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367504

V. Bhagavatula, B. Boller, R.J. Hagerty, P. A. Sachenik

引用次数: 0

Preencapsulation cleaning methods and control for microelectronics packaging 微电子封装的预封装清洗方法及控制

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367641

C. Wong, R. McBride

引用次数: 38

Moisture sensitivity and reliability of plastic thermally enhanced QFP packages 塑料热增强QFP封装的湿气敏感性和可靠性

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367526

L. Yip

引用次数: 5

A 3D electromagnetic simulator for microwave and RF circuit boards 用于微波和射频电路板的三维电磁模拟器

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367539

J. Zheng

引用次数: 0

Active mini-MCM daughterboard for optical interconnect insertion into microelectronic systems 用于光学互连插入微电子系统的有源mini-MCM子板

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367571

L. Hornak, S. Tewksbury, V.K. Konkimalla

引用次数: 0

Metal capping of MCM thin film features using a laser 用激光对MCM薄膜进行金属封盖

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367565

R. Patel, T. Wassick, C.Y. Ralston

引用次数: 2

Handling of mutual inductance in simulation of simultaneous switching noise 同时开关噪声仿真中互感的处理

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367600

A. Nakamura, J. Mano, T. Nagata, H. Shimizu, M. Yagyu, K. Nishi, K. Otsuka

{"title":"Handling of mutual inductance in simulation of simultaneous switching noise","authors":"A. Nakamura, J. Mano, T. Nagata, H. Shimizu, M. Yagyu, K. Nishi, K. Otsuka","doi":"10.1109/ECTC.1994.367600","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367600","url":null,"abstract":"Accuracy of a circuit simulation for the simultaneous switching noise associated with a conventional plastic package was significantly improved by taking into account mutual inductances among leads. The effective inductance of a lead on a plastic package was suspected to be influenced by many other leads in the package. We have thus formulated a three dimensional conductor model for bonding wires, leads, and socket conductors to take into account their three dimensional structure. We calculated the mutual inductances and simulated the simultaneous switching noise by either including elements in the mutual inductance matrix or not. We clarified the contribution by the elements in the matrix, and a modeling technique for accurately simulating the simultaneous switching noise was proposed. This technique was developed for predicting characteristics of a assembled high-speed and multiple-bit device accurately during the circuit design stage. This would allow us to tailor the output circuit for maximum performance of devices under assembled condition. The design of the output circuit affects the simultaneous switching noise through the effective inductance of the ground line.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130270706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Low cost molded packaging for optical data links 用于光学数据链路的低成本模制封装

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI: 10.1109/ECTC.1994.367572

S. Robinson, M. S. Acarlar, Y.C. Chen, L. Manzione, G. Shevchuk, D. Stefanik

{"title":"Low cost molded packaging for optical data links","authors":"S. Robinson, M. S. Acarlar, Y.C. Chen, L. Manzione, G. Shevchuk, D. Stefanik","doi":"10.1109/ECTC.1994.367572","DOIUrl":"https://doi.org/10.1109/ECTC.1994.367572","url":null,"abstract":"In order to lower the cost of optical data link packaging, a new technology has been developed which integrates optical and electrical components in a single, sealed, transfer molded package. This technology utilizes leadframes for low cost and mass handling. Overmolding is used for package sealing and optical port alignment. A unique process, two step transfer molding, allows for internal shielding, intermediate IC testing, ease of assembly and IC package sealing. An injection molded outer housing is used for connector insertion and external shielding (through the use of conductive plastics). The first application of this technology is a high performance optical transceiver package for the growing FDDI market (125 MB/s). With a duplex MIC connector, this package conforms to an industry standard outline and pinout. The optical transceiver easily meets full FDDI specifications. The design integrates an LED, PIN, transmitter IC, receiver IC and two capacitors in a single, overmolded package. The final assembly sequence was conceived using the latest Design For Simplicity (DFS) principles. This paper describes the design concept and prototype model performance results.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121429667","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6