电容耦合多芯片模块的可制造性

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI:10.1109/ECTC.1994.367613

T. Knight, D. Salzman

{"title":"电容耦合多芯片模块的可制造性","authors":"T. Knight, D. Salzman","doi":"10.1109/ECTC.1994.367613","DOIUrl":null,"url":null,"abstract":"Capacitive coupling of off-chip interconnects offers a number of advantages, including low manufacturing and repair costs, dense form factors, low power, high speed, extremely high junction pitch, and easy testing. In this paper, we review and compare the practicalities of conductive and capacitive coupling, and discuss novel issues of manufacturability and materials optimization for capacitively coupled electronic packages.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Manufacturability of capacitively coupled multichip modules\",\"authors\":\"T. Knight, D. Salzman\",\"doi\":\"10.1109/ECTC.1994.367613\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Capacitive coupling of off-chip interconnects offers a number of advantages, including low manufacturing and repair costs, dense form factors, low power, high speed, extremely high junction pitch, and easy testing. In this paper, we review and compare the practicalities of conductive and capacitive coupling, and discuss novel issues of manufacturability and materials optimization for capacitively coupled electronic packages.<<ETX>>\",\"PeriodicalId\":344532,\"journal\":{\"name\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1994.367613\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367613","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

摘要

片外互连的电容耦合具有许多优点，包括低制造和维修成本、紧凑的外形、低功耗、高速度、极高的结间距和易于测试。在本文中，我们回顾和比较了导电耦合和电容耦合的实用性，并讨论了电容耦合电子封装的可制造性和材料优化的新问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Manufacturability of capacitively coupled multichip modules

Capacitive coupling of off-chip interconnects offers a number of advantages, including low manufacturing and repair costs, dense form factors, low power, high speed, extremely high junction pitch, and easy testing. In this paper, we review and compare the practicalities of conductive and capacitive coupling, and discuss novel issues of manufacturability and materials optimization for capacitively coupled electronic packages.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

1994 Proceedings. 44th Electronic Components and Technology Conference

自引率

0.00%

发文量