2016 International Conference on Electronics Packaging (ICEP)最新文献_第6页

Effect of process parameters on hard coating film characteristics in roll-to-roll printing process system 卷对卷印刷工艺系统中工艺参数对硬涂膜特性的影响

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486799

Dongseok Shin, Sang Myung Lee, I. Yun

引用次数: 1

Basic Study on reduction of measurement time for evaluating thermophysical properties of insulation heat dissipation sheet based on quasi-steady state measurement 基于准稳态测量减少隔热散热片热物性评估测量时间的基础研究

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486813

J. Hatakeyama, K. Hirose, M. Uchidate, T. Fukue

{"title":"Basic Study on reduction of measurement time for evaluating thermophysical properties of insulation heat dissipation sheet based on quasi-steady state measurement","authors":"J. Hatakeyama, K. Hirose, M. Uchidate, T. Fukue","doi":"10.1109/ICEP.2016.7486813","DOIUrl":"https://doi.org/10.1109/ICEP.2016.7486813","url":null,"abstract":"This paper describes an improved measurement method for fast evaluation of thermophysical properties of an insulation sheet. The sheet is used to insulate inverter and water cooling jacket in an electric or hybrid electric vehicles. A large number of iterations of steady state measurement is required to perform parameter study for various composition of the sheet. However, steady state measurement generally needs very long time even only once. From the above reasons, it is necessary to reduce measurement time while keeping accuracy. Here, quasisteady state method is one of the methods of reducing measurement time by performing a prediction while keeping accuracy. Transient temperature response and steady temperature can be obtained by prediction faster than steady state method. Accuracy of prediction and measurement time will be changed by controlling application range. In this report, the availability of quasi-steady state method was investigated by comparing prediction results with steady state results of 3D thermal analysis and experiment. Especially, thermal conductivity was evaluated as a criterion. Then, the predicted thermal conductivity was derived from the predicted steady temperature. Through the investigation, in terms of accuracy, the quasi-steady state method was available when surrounding condition was perfectly insulated. On the other hand, in terms of the reduction of measurement time, a thinner thickness of metal block required a shorter measurement time because of the decrease in the heat capacity.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121837889","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Influence of pretreatment on copper direct bonding 预处理对铜直接键合的影响

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486875

Po-Hao Chiang, Jenn-Ming Song

引用次数: 0

Self-healing stretchable wiring using conductive magnetic powder 使用导电磁粉的自修复可拉伸导线

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486840

S. Toda, K. Kanda, T. Fujita, K. Maenaka

引用次数: 0

Effect of substrate dimensions and boundary conditions on the heat spreading of LED package 衬底尺寸和边界条件对LED封装散热的影响

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486781

S. Lee, Zhenhuan Tian, Minshu Zhang, An Xie

引用次数: 3

A comparison study of electromigration in In-48Sn solder interconnects with Cu and Au/Ni/Cu pads in - 48sn焊料与Cu和Au/Ni/Cu焊盘互连电迁移的比较研究

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486920

Yi Li, Y. Chan, Fengshun Wu

引用次数: 0

Interaction between micro Cu bumps and substrate with thin ni/thick au SF in TCNCP FC packaging TCNCP FC封装中微Cu凸点与薄ni/厚au SF衬底的相互作用

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486817

W. Zhang, L. Ji, Z. Liu, T. Zhang

{"title":"Interaction between micro Cu bumps and substrate with thin ni/thick au SF in TCNCP FC packaging","authors":"W. Zhang, L. Ji, Z. Liu, T. Zhang","doi":"10.1109/ICEP.2016.7486817","DOIUrl":"https://doi.org/10.1109/ICEP.2016.7486817","url":null,"abstract":"For high demand of large bump density, fine pitch micro Cu bumps are usually connected to trace on the substrate with flip chip technology. In this study, TCNCP (Thermal Compression with Non-Conductive Paste) method was used to attach die onto substrate trace with surface finish (SF) of thin Ni (0.1um) and thick Au (0.4um) in a flip chip (FC) package. The micro Cu bump used in the device under test has a dome shaped Sn-based solder cap of 13um in height. The ratio of Au layer plated on the substrate trace to Sn cap on the Cu bump is about 10 wt%. However, it has been proved that the micro joint obtained with TCNCP can pass TCT 1000 cycles, HTS 1000hours and uHAST 192hrs without failure. SEM/EDX study on HTS samples (0hr, 500hr, 1000hr) shows that the joint has a large amount of IMC mainly consisting of (CuxAu1-x)6Sn5 phase after reflow but after 1000hr independent Cu3Sn phase appeared near to die bumps. Phase segregation appears near to the die bump when HTS time goes up to 1000hrs. From this study, we found that Cu element in the IMC formation may come from Cu bumps on the die at initial stages and then come from Cu trace on the substrate at later stages. Though Ni could not be detected, its presence is displayed by retarding Cu3Sn formation near to the substrate side. Cu-rich IMC (Intermetallic Compound) phase formed at this location after HTS 1000hr suggests Ni disappearance after long time aging. The phenomenon that voided microstructure after HTS 500hr appeared dense after HTS 1000hr can be explained by Cu diffusion from the trace on the substrate.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130489241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments 通过VUV/FAB表面处理实现PEEK和Pt的低温直接结合

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486834

Weixin Fu, A. Shigetou, S. Shoji, J. Mizuno

引用次数: 0

Double-sided joining IGBT devices by pressureless sintering of nanosilver paste 无压烧结纳米银浆双面连接IGBT器件

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486853

Haidong Yan, Shancan Fu, Y. Mei

引用次数: 4

Investigation of thermal cycling maximum temperature effect on fatigue life of WLCSP 热循环最高温度对WLCSP疲劳寿命影响的研究

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-04-20 DOI: 10.1109/ICEP.2016.7486771

M. Hsu, K. Chiang

{"title":"Investigation of thermal cycling maximum temperature effect on fatigue life of WLCSP","authors":"M. Hsu, K. Chiang","doi":"10.1109/ICEP.2016.7486771","DOIUrl":"https://doi.org/10.1109/ICEP.2016.7486771","url":null,"abstract":"The accelerated thermal cycling test is a standard method which is currently used to characterize the reliability performance of electronic packaging. The test vehicles are placed in a condition which is harsher than the actual usage condition in order to reduce the testing and development time. Recently, in order to further reduce the testing time, the ramping rate of thermal cycling test is increased, and the acceleration factor empirical model could be used to predict the fatigue life under different loading conditions. The original acceleration factor model was proposed by Norris and Landzberg which includes temperature range, temperature-cycling frequency and the maximum temperature. In this research, the term maximum temperature effect will be studied, discussed and compared with simulation results. Because the temperature under accelerated thermal cycling test always exceeds one third of the melting point (in Kelvin) of the solders, the creep effect becomes obvious and needs to be considered. To reveal this mechanics behavior, a simulation model of wafer level chip scaling package (WLCSP) is constructed in this research, which is with 14mm × 14mm die size, 0.4mm ball pitch, and 0.32mm ball size in 2D model and the Garofalo Hyperbolic Sine Model is used to simulate the creep behavior of the lead-free SnAg solder alloy. To investigate the maximum temperature effect of reliability of WLCSP on thermal cycling test, two life prediction models are used. One is Coffin-Manson strain based model and another one is Darveaux energy based model. The simulation results show that the increment of creep strain energy density has changed insignificantly, so the fatigue life does not coincide with the experimental results when Darveaux model is applied. However, the increment of creep strain increases with the increase of maximum temperature which is same as the experimental result.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"53 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133432447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5