Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Abstract

A direct hybrid bonding of PEEK-Pt is feasible at low temperature of 150 °C through surface treatment technologies of vacuum ultraviolet (VUV) and fast atom bombardment (FAB). The X-ray photoelectron spectroscopy showed the VUV treatment was capable of creating hydrate bridge layers on both PEEK and Pt surfaces, which were considered to form a robust bond through dehydration reactions. Shear strength test showed that the VUV-treated samples were stronger than the FAB-treated ones, and the highest strength reached 0.91 MPa, which was comparable with conventional PEEK-based direct bondings. This technology is expected to be applied in future body implantable medical micro electromechanical system devices.