1997 Proceedings 47th Electronic Components and Technology Conference最新文献_第9页

Reliability of aluminum-nitride filled mold compound 氮化铝填充模料的可靠性

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606148

D. Tracy, L. Nguyen, R. Giberti, A. Gallo, C. Bischof, J. Sweet, A.W. Hsia

{"title":"Reliability of aluminum-nitride filled mold compound","authors":"D. Tracy, L. Nguyen, R. Giberti, A. Gallo, C. Bischof, J. Sweet, A.W. Hsia","doi":"10.1109/ECTC.1997.606148","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606148","url":null,"abstract":"There are increasing demands placed on plastic packages to dissipate higher power levels and operate in high temperature conditions. Of concern is the reliability and the functionality of the IC device operating at higher power levels and/or high temperature conditions. One particular concern is the integrity of the aluminum-gold wire bond interface under high operating conditions. Mold compound stability is one of several factors contributing to the stability of the aluminum-gold bond. The Plastic Packaging Consortium (PPC), a Technology Reinvestment Project (TRP) funded by DARPA under SOL 94-27, addresses the needs to build-up and strengthen an onshore infrastructure for thermally-enhanced, ruggedized, and high density packages. An 160-lead (28/spl times/28/spl times/3.4 mm) plastic quad flat pack (PQFP) is used to characterize a thermally-enhanced and high operating temperature stable mold compound. The compound uses silica-coated aluminum nitride (AlN) filler to provide a thermal conductivity 4-6 X compared to fused silica-filled compounds. Thermal measurements show the AlN compound decreases /spl theta//sub JA/ by 8-10/spl deg/C/W compared to the fused silica-filled molded package. The thermal performance of the AlN-molded packages is equal to the embedded heat spreader enhancements. Use of alternate flame retardant synergists (antimony pentoxide-Sb/sub 2/O/sub 5/-or a new non-antimony type) provide a more stable compound as determined by High Temperature Storage Life (HTSL) testing at 200/spl deg/C. The testing confirms that the compounds formulated with the alternate flame retardant synergists (Sb3/sub O5/ or non-antimony type) improve HTSL performance.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124884053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Processing diagrams for polymeric die attach adhesives 聚合物模贴胶的加工图

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606220

J. Hsiung, R. Pearson

{"title":"Processing diagrams for polymeric die attach adhesives","authors":"J. Hsiung, R. Pearson","doi":"10.1109/ECTC.1997.606220","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606220","url":null,"abstract":"With a processing diagram, one can reduce the effort required to customize curing process conditions for polymeric die attach adhesives. Polymeric die attach adhesives are often cured per the manufacturer's recommendations during initial screening evaluations. In most cases, the recommended cure schedules have to be modified so as to fit differences in process equipment. Unfortunately, the modified cure schedule is usually determined by a trial-and-error method. An aim of our experiments is to understand the curing process of a wide range of polymeric die attach adhesives (conventional, fast, and snap cure adhesives) and to construct a processing diagram, i.e. \"Bondability Diagram\", so as to define the processing window. Such diagrams should be helpful in determining both the time and cure temperature required to produce high quality bonds. The bondability diagram can be constructed based on fundamental understandings of the phenomena involved in the curing process using a wide variety of tools. Differential Scanning Calorimetry (DSC) is utilized to study the cure kinetic and extent of reaction. Dynamic Mechanical Analysis (DMA) is used to determine gelation times and melt viscosity under a shear mode. A modified Rheovibron is employed to perform cure characterizations under a tensile mode so that cure stresses could be determined. Thermogravimetric Analysis (TGA) is used to evaluate the outgassing phenomena. Optical Microscopy (OM) is used to detect voids. Results indicate that cure behaviors of conventional, fast, and snap cure adhesives are different in several respects. The combination of DSC, DMA, TGA, OM, and lap shear test leads to a frame work of developing the bondability diagram concept. The bondability diagram concept provides a foundation for an understanding of the recommended cure schedule and allows one to design a suitable cure schedule.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125046357","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

The application of acoustic microscopy to the characterisation of non-standard microelectronic packaging structures 声学显微镜在非标准微电子封装结构表征中的应用

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606298

W. Lawton, J. Barrett

引用次数: 0

Experimental and numerical study of underfill encapsulation of flip-chips using conductive epoxy polymer bumps 用导电环氧聚合物凸包封装倒装芯片的实验与数值研究

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606270

G. Ni, M. Gordon, W. F. Schmidt, A. Muyshondt

{"title":"Experimental and numerical study of underfill encapsulation of flip-chips using conductive epoxy polymer bumps","authors":"G. Ni, M. Gordon, W. F. Schmidt, A. Muyshondt","doi":"10.1109/ECTC.1997.606270","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606270","url":null,"abstract":"The flow of underfill encapsulant for epoxy bonded flip-chips is studied numerically and experimentally and compared to analytical predictions for fully developed 2-D flow. A 2-D VOF (volume of fluid) FLUENT model was used to explore the functional relationships between the gap size, the encapsulant's viscosity and surface tension, and the flow rate. The computational intensiveness of this problem prevented direct comparisons between the numerical and experimental data. However, scaled results indicate that the numerical predictions are in general agreement with analytical predictions-the numerical flow times are proportional to the viscosity and to the square of the distance travelled, and inversely proportional to the gap height and the surface tension. The constant of proportionality, however, differs by up to 60% because the numerical (and experimental) flow is not fully developed near the encapsulant-air interface. Experiments at varying temperatures have allowed the inference of the encapsulant's temperature dependent viscosity and an optimal temperature for the underfill process.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130163448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Next generation of electronic packaging education at Georgia Tech Packaging Research Center 佐治亚理工学院包装研究中心的下一代电子包装教育

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606285

R. Tummala

{"title":"Next generation of electronic packaging education at Georgia Tech Packaging Research Center","authors":"R. Tummala","doi":"10.1109/ECTC.1997.606285","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606285","url":null,"abstract":"The Packaging Research Center (PRC), funded by NSF as one of its engineering centers in the US, views research and education being equally important in addressing the competitiveness need in electronic packaging in the next decade. The strategy to achieve this competitiveness goal involves two critical items: (1) development of next generation of technologies; and (2) development of human resources, by means of globally-competitive education to apply the technologies to the global market. The PRC views that four major education challenges must be addressed in order to meet the above need. These are: (1) system-level education. This is currently missing and includes technologies, manufacturing, business economics and management, global markets and foreign culture; (2) cross-discipline education: current university education is highly discipline-oriented, whereas electronic products are highly cross-disciplinary; (3) industry education: industry engineers are immersed in current, short term technologies and generally are not addressing the next generation needs; and (4) undergrad and pre-college education. To address the above challenge, an education strategy has been developed which consists of educational programs grouped into six strategic major categories: (1) undergraduate, (2) graduate; (3) under-represented outreach; (4) industry engineers; (5) national education; and (6) global education. This paper reviews all of these programs.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129102506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Controlled solder self-alignment sequence for an optoelectronic module without mechanical stops 无机械停止的光电模块控制焊料自对准顺序

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606326

N. Morozova, L. Liew, W. Zhang, R. Irwin, B. Su, Y.C. Lee

引用次数: 3

Fluxless, no clean assembly of optoelectronic devices with PADS 无焊剂，不清洁组装光电器件与PADS

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606255

S. Nangalia, N. Koopman, V. Rogers, M. Beranek, H. Hager, E. Ledbury, V. Loebs, E. Miao, C.-H. Tang, C. Pico, E. Swenson, D. Hatzis, P. Li, C. Luck

引用次数: 15

Stress analysis of a compressed elastomeric connector spring 压缩弹性连接器弹簧的应力分析

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606275

Y. Ling

引用次数: 2

Improvement of solder joint reliability between multilayer ceramic package and printed wiring board by new ceramic material 利用新型陶瓷材料提高多层陶瓷封装与印刷线路板之间焊点可靠性

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606340

K. Yamaguchi, M. Higashi, H. Yonekura, N. Hamada, Y. Kunimatsu

{"title":"Improvement of solder joint reliability between multilayer ceramic package and printed wiring board by new ceramic material","authors":"K. Yamaguchi, M. Higashi, H. Yonekura, N. Hamada, Y. Kunimatsu","doi":"10.1109/ECTC.1997.606340","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606340","url":null,"abstract":"Ball grid array (BGA) packages for MPU semiconductor device are considered as replacements of pin grid array packages. This is driven by the requirements for smaller size, thinner thickness, higher wiring density and higher performance. A thermal coefficient of expansion (TCE) mismatch between an Al/sub 2/O/sub 3/ ceramic BGA and a printed wiring board (PWB) causes a large stress in solder joints during a thermal fatigue test. Stress due to the TCE differences is also large in a leadless chip carrier (LCC) package, since this is the same surface mounting type package as BGA. By a finite element method (FEM) simulation, we found that a minimum stress value was obtained when the target TCE value was 9/spl sim/14ppm./spl deg/C. We developed a new ceramic material. The TCE and the Young's Modulus of this material are 11.5ppm//spl deg/C and 114GPa, respectively. By temperature cycling tests of BGA and LCC, we have confirmed that a relaxation of the thermal stress drastically increased solder joint reliabilities by using the high TCE new ceramic material.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122625787","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Design and qualification of hermetically packaged lithium niobate optical modulator 密封封装铌酸锂光调制器的设计与鉴定

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606205

R. Moyer, R. Grencavich, R.W. Smith, W. Minford

引用次数: 19