Processing diagrams for polymeric die attach adhesives

Abstract

With a processing diagram, one can reduce the effort required to customize curing process conditions for polymeric die attach adhesives. Polymeric die attach adhesives are often cured per the manufacturer's recommendations during initial screening evaluations. In most cases, the recommended cure schedules have to be modified so as to fit differences in process equipment. Unfortunately, the modified cure schedule is usually determined by a trial-and-error method. An aim of our experiments is to understand the curing process of a wide range of polymeric die attach adhesives (conventional, fast, and snap cure adhesives) and to construct a processing diagram, i.e. "Bondability Diagram", so as to define the processing window. Such diagrams should be helpful in determining both the time and cure temperature required to produce high quality bonds. The bondability diagram can be constructed based on fundamental understandings of the phenomena involved in the curing process using a wide variety of tools. Differential Scanning Calorimetry (DSC) is utilized to study the cure kinetic and extent of reaction. Dynamic Mechanical Analysis (DMA) is used to determine gelation times and melt viscosity under a shear mode. A modified Rheovibron is employed to perform cure characterizations under a tensile mode so that cure stresses could be determined. Thermogravimetric Analysis (TGA) is used to evaluate the outgassing phenomena. Optical Microscopy (OM) is used to detect voids. Results indicate that cure behaviors of conventional, fast, and snap cure adhesives are different in several respects. The combination of DSC, DMA, TGA, OM, and lap shear test leads to a frame work of developing the bondability diagram concept. The bondability diagram concept provides a foundation for an understanding of the recommended cure schedule and allows one to design a suitable cure schedule.