1997 Proceedings 47th Electronic Components and Technology Conference最新文献

The oxidation control of copper leadframe package for prevention of popcorn cracking 铜引线框包的氧化控制，防止爆米花开裂

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606149

E. Takano, T. Mino, K. Takahashi, K. Sawada, S. Shimizu, H. Yoo

引用次数: 45

Thermosonic flip-chip bonding using longitudinal ultrasonic vibration 利用纵向超声振动的热超声倒装芯片键合

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606313

Q. Tan, Wenge Zhang, B. Schaible, L. Bond, T. Ju, Y.C. Lee

引用次数: 53

Distance learning paradigms in electronics packaging: a national course on thermal design of electronic products 电子封装的远程学习范例:电子产品热设计的全国性课程

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606228

Y. Joshi, A. Bar-Cohen, S. Bhavnani

{"title":"Distance learning paradigms in electronics packaging: a national course on thermal design of electronic products","authors":"Y. Joshi, A. Bar-Cohen, S. Bhavnani","doi":"10.1109/ECTC.1997.606228","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606228","url":null,"abstract":"Electronics packaging education requires a multidisciplinary approach, integrating concepts in electrical engineering, materials, structural analysis, heat transfer, reliability and computational methods. The availability of advanced instructional technologies is allowing an unprecedented opportunity to incorporate several desirable attributes to courseware development in such areas. This paper describes an ongoing multi-university effort undertaken to develop a national course on thermal design of electronic products. The participating institutions provide a combination of faculty with expertise in various aspects of thermal design. Examples of course materials developed so far include: (i) videotaped lecture segments on specialized topics, (ii) case studies, and (iii) multi-media computational design simulations. At each institution, the modules are integrated with traditional classroom lectures. These materials will form a central online resource base, accessible through the world wide web (WWW). In addition to their possible use in courses dealing specifically with electronics cooling, it is anticipated that instructors of more comprehensive packaging courses, as well as more general heat transfer and thermal design courses, will find it possible to incorporate these modules in their syllabi and thus dramatically expand the number of engineering students exposed to these critical issues.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114147721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Reliable, compact, CMOS interface, 200-Mbit/s a 12-channel optical interconnects using single-mode fiber arrays 可靠，紧凑，CMOS接口，200 mbit /s的12通道光互连使用单模光纤阵列

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606173

A. Miura, K. Tonehira, A. Takai, S. Aoki, S. Kaneko, H. Irie, S. Hanatani

引用次数: 7

Electrical modeling of an IC package chip paddle as an integral ground bus 集成电路封装芯片桨作为集成接地总线的电气建模

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606266

M. Lamson

引用次数: 0

Development of reflowable Sn-Pb alloy bump for Al pad 铝垫用可回流锡铅合金凸块的研制

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606242

T. Ogashiwa, T. Arikawa, A. Inoue

引用次数: 2

Efficient design using fuzzy logic based regression models 利用基于模糊逻辑的回归模型进行高效设计

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606209

B. Schaible, Y.C. Lee, H. Xie

{"title":"Efficient design using fuzzy logic based regression models","authors":"B. Schaible, Y.C. Lee, H. Xie","doi":"10.1109/ECTC.1997.606209","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606209","url":null,"abstract":"With ever decreasing design cycles, it is important for designers to have techniques they can use to quickly and efficiently model new designs. From these models, package performance can be estimated and electrical, thermal, and mechanical considerations can be balanced. In this paper, we present a method of quickly investigating new design concepts based on knowledge of previously studied designs and knowledge of the differences between the new and old designs. This approach is useful when the difference between designs is simple and can be accurately modeled with fewer data. The use of less data equates to a savings of time and money. In the case studies presented, we establish two \"base\" models using 40 data each, then we establish two additional models of similar processes using only five and seven data each. Here, the initial (base) design and the design differences are modeled with fuzzy logic based regression models. Such fuzzy logic regression models can be based on numerically or empirically obtained data or physical knowledge of the system to be modeled. Once established, these models have the advantage of offering very fast response times uncharacteristic of experimentation, prototyping, and numerical methods such as finite element, finite difference, or boundary element modeling.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116467206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Comparison of electrical performance of enhanced BGAs 增强型BGAs电性能比较

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606245

R. Kaw, B. Hanna, N. Devnani

{"title":"Comparison of electrical performance of enhanced BGAs","authors":"R. Kaw, B. Hanna, N. Devnani","doi":"10.1109/ECTC.1997.606245","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606245","url":null,"abstract":"The exclusive domain of modeling and design for CPU packaging is beginning to find its way into the ASIC world as well. As the feature sizes decrease from 0.5 to 0.35 to 0.25 micron, the drivers become faster with sub-nsec transitions. Most of these ASICs service the ever widening word width, that has changed from 32 to 64 bits, and on to the wide word. Thus, in general, we have a gradual shift towards pad-limited designs that demand an ever-decreasing pitch, with very fast drivers switching simultaneously in large numbers. An increasing number of these ASICs dissipate more than the capability of ordinary plastic packages. This is a crowded, hot, and noisy environment that can be managed only by concurrent design of chip padout and package layout from an electrical perspective, and the system board/box design from a thermo-mechanical perspective. At the very least, it demands package selection based on electrical modeling of noise, generated by the chip and its package. This paper presents a study of three package styles for an ASIC with 270 signals. The design space for this chip type is expected to handle heat dissipation of 2 to 15 watts. That rules out most ordinary plastic packages, unless they are thermally enhanced. The packages selected for comparison, in this study, are of the enhanced BGA type. All of them use a heat spreader to which the chip is attached for thermal management. The study consists of: (a) an evaluation of how best to design the chip padout concurrently with the possibilities offered by the layout rules of these packages; (b) electrical models of these designs are used to calculate the various kinds of noise for each package type. The results are summarized for easy comparison, along with the assumptions made, to enable reasonable projections from these results.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124074469","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

An empirical reliability prediction method for 1.55 /spl mu/m InGaAs/InP MQW-DFB laser diodes 1.55 /spl mu/m InGaAs/InP MQW-DFB激光二极管可靠性的经验预测方法

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606338

N. Hwang, S. Kang, H. Lee, Seong-Su Park, Min-Kyu Song, K. Pyun

引用次数: 1

Educating under-represented minority students in electronics packaging for the 21st century 为21世纪的电子封装教育少数族裔学生

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606226

G. S. May

{"title":"Educating under-represented minority students in electronics packaging for the 21st century","authors":"G. S. May","doi":"10.1109/ECTC.1997.606226","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606226","url":null,"abstract":"In response to the changing ethnicity of the U.S. work force and the dearth of individuals from under-represented groups pursuing careers in technical fields, the Georgia Tech Summer Undergraduate Packaging Research and Engineering Experience for Minorities (GT-SUPREEM) has been developed to attract qualified minority students to pursue graduate degrees in electronics packaging-related disciplines. The program is conducted under the auspices of the Georgia Tech Engineering Research Center in Low-Cost Electronic Packaging, which is sponsored by the National Science Foundation. In the GT-SUPREEM program, junior and senior level undergraduate students are selected on a nationwide basis and paired with a faculty advisor to undertake research projects in the Packaging Research Center. The students are housed on campus and provided with a $3,000 stipend and a travel allowance. At the conclusion of the program, the students present both oral and written project summaries. It has been shown that this experience is extremely successful in motivating these students to attend graduate school, with 89% of the participants opting to do so. This paper will provide an overview of the GT-SUPREEM program, including student research activities, success stories, lessons learned, and overall program outlook.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131143825","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1