1997 Proceedings 47th Electronic Components and Technology Conference最新文献_第2页

Non halogen/antimony flame retardant system for high end IC package 用于高端IC封装的无卤/锑阻燃系统

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606335

M. Yamaguchi, H. Shigyo, Y. Yamamoto, S. Sudo, S. Ito

引用次数: 7

A new encapsulating method for semiconductor devices using resin sheets 一种用树脂片封装半导体器件的新方法

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606145

H. Ota, S. Fujieda, T. Okuyama

引用次数: 0

Molding compounds for high breakdown voltage applications on power IC semiconductors 高击穿电压应用于功率IC半导体的成型化合物

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606151

A. S. Chen, A. Shafi, R. W. Busse, R. Orr, R. Lo

{"title":"Molding compounds for high breakdown voltage applications on power IC semiconductors","authors":"A. S. Chen, A. Shafi, R. W. Busse, R. Orr, R. Lo","doi":"10.1109/ECTC.1997.606151","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606151","url":null,"abstract":"Power integrated circuits (IC) semiconductor devices are sensitive to any sort of process variations, device and package materials effects, and environmental changes and stresses that will affect their ability to withstand the maximum applied voltage during operation. For example, contact between the epoxy molding compound and the die surface can radically alter the electrical performance, especially after environmental stressing. Some of this could be mechanical, caused by thermal mismatch. Other reasons could be chemical interactions between the molding compound and the charges within the device passivation, which would also be greatly influenced by type. Unfortunately, there is a lack of literature available on electronic package effects on high voltage device behavior. In this study, the effect of molding compound on the breakdown voltage stability of a high voltage metal oxide semiconductor-field effect transistor (MOSFET), utilizing the RESURF (Reduced SURFace electric field) technique, was examined. Breakdown stability was tested by High Temperature Reverse Bias (HTRB) testing. Both compound and post-mold cure processes were found to affect the breakdown voltage, however, it also became clear that the compounds were not acting alone and it would be necessary to evaluate the chip passivation as well, and its interaction with the molding compound.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133525347","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15

Vertical cavity surface emitting laser packaging with auto power control 垂直腔面发射激光封装，功率自动控制

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606195

W. Jiang, P. Claisse, C. Gaw, P. Kiely, B. Lawrence, M. Lebby, M. Roll

引用次数: 1

Bimetallic heatsinks for temperature compensation of diode lasers: prospects for microfabrication 用于二极管激光器温度补偿的双金属散热器:微加工的前景

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606257

D. Cohen, L. Coldren

引用次数: 0

Gigabit parallel fiber optic link based on edge emitting lasers 基于边缘发射激光器的千兆并行光纤链路

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606174

R. Nagarajan, W. Sha, B. Li, P. Braid, Robert J. Furmanak, J. Marchegiano, B. Booth

引用次数: 3

Evaluation of interface delamination in IC packages by considering swelling of the molding compound due to moisture absorption 考虑成型化合物因吸湿而膨胀的IC封装界面分层评价

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606150

N. Tanaka, M. Kitano, T. Kumazawa, A. Nishimura

{"title":"Evaluation of interface delamination in IC packages by considering swelling of the molding compound due to moisture absorption","authors":"N. Tanaka, M. Kitano, T. Kumazawa, A. Nishimura","doi":"10.1109/ECTC.1997.606150","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606150","url":null,"abstract":"Adhesion strength evaluation of molding compounds is a critical issue in both structural design and material selection of plastic IC packages. We previously proposed a new adhesion test method that can separate residual stress from adhesion strength, and we confirmed that the measured true adhesion strength can be applied to the quantitative prediction of interface delamination in a dry package. This paper describes the influence of moisture absorbing conditions on true adhesion strength determined by this method. The drop of true adhesion strength of a specimen that has absorbed moisture at 50/spl deg/C is about 40 percent of that of a specimen at 85/spl deg/C. This suggests that the general moisture condition (85/spl deg/C/85%) accelerates the damage to plastic IC packages when compared to the case of moisture absorption at room temperature. We also evaluated interface delamination in a moisture-absorbed package by considering the swelling of the molding compound due to moisture absorption. The predicted results agree well with the experimental data for moisture-absorbed packages.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114814541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Fluxless die bonding of high power laser bars using the AuSn-metallurgy 高功率激光棒的ausn -冶金无钎焊

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606259

S. Weiss, V. Bader, G. Azdasht, P. Kasulke, E. Zakel, H. Reichl

引用次数: 19

High temperature deformation of area array packages by moire interferometry/FEM hybrid method 区域阵列封装高温变形的云纹干涉/有限元混合方法

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606208

J. Zhu, D. Zou, S. Liu

引用次数: 12

Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC's 预热和焊流曲线最高温度对湿敏集成电路的影响

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI: 10.1109/ECTC.1997.606299

R. L. Shook, V. Sastry

{"title":"Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC's","authors":"R. L. Shook, V. Sastry","doi":"10.1109/ECTC.1997.606299","DOIUrl":"https://doi.org/10.1109/ECTC.1997.606299","url":null,"abstract":"The purpose of this work was to determine the influence of preheat and maximum solder reflow temperature on the level of moisture induced damage in plastic surface mount integrated circuits. Both an analytical moisture diffusion model and Finite Element Modeling were applied to the analysis of absorption/desorption behavior of plastic molding compounds. The models were used to analyze the moisture ingress kinetics during controlled environmental exposures and for the prediction of moisture desorption characteristics during solder reflow conditions. Moisture/reflow experiments were conducted on an 80-pin PQFP, 225-pin PBGAs, and two TSOPs (a 56-pin and a 40-pin). Devices were evaluated using C-mode Scanning Acoustic Microscopy. Effects of maximum reflow temperature on measured damage response were determined showing that as a rule the JEDEC/IPC moisture resistance drops by one level for every 20/spl deg/C increase in maximum reflow temperature. The overall benefit of extended preheat is shown to be beneficial for only thin packages that are not saturated. Details of the method used for predicting the beneficial effects of preheating are described.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124800555","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17