A new encapsulating method for semiconductor devices using resin sheets

Abstract

This paper describes a new encapsulating method using resin sheets. There are three important points to develop this method. 1. New molding process and encapsulating molds. 2. Resin suitable for this method. 3. Measuring method for resin state. This method is suitable for fabricating thin packages. These thin model packages showed the high reliability of pressure cooker test and thermal cycle test.