The oxidation control of copper leadframe package for prevention of popcorn cracking

1997 Proceedings 47th Electronic Components and Technology Conference Pub Date : 1997-05-18 DOI:10.1109/ECTC.1997.606149

E. Takano, T. Mino, K. Takahashi, K. Sawada, S. Shimizu, H. Yoo

{"title":"The oxidation control of copper leadframe package for prevention of popcorn cracking","authors":"E. Takano, T. Mino, K. Takahashi, K. Sawada, S. Shimizu, H. Yoo","doi":"10.1109/ECTC.1997.606149","DOIUrl":null,"url":null,"abstract":"Copper alloy leadframe has good thermal, electrical, mechanical and cost performance. It, however, is susceptible to package cracking during reflow soldering due to poor adhesion of the molding compound to the leadframe. In this paper we investigated the oxide film properties of copper leadframe and the effect of the film on the reliability performance of semiconductor packages. According to our experiment, oxide film growth was expressed as a function of time and temperature and the growth of the oxide film was surpressed when oxygen concentration was less than 5%. An adhesion strength test of epoxy molding compound to the oxidized copper surface showed drastic degradation of strength if the film thickness exceeded about 20 nm accompanied with delaminating surface alternation. Finally, we conducted a reflow cracking test with samples whose oxide film thickness was controlled. The results showed good correlation with the adhesion strength test. It was found that the oxide film thickness should be less than 40 nm to enhance reflow crack performance.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"45","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606149","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 45

Abstract

Copper alloy leadframe has good thermal, electrical, mechanical and cost performance. It, however, is susceptible to package cracking during reflow soldering due to poor adhesion of the molding compound to the leadframe. In this paper we investigated the oxide film properties of copper leadframe and the effect of the film on the reliability performance of semiconductor packages. According to our experiment, oxide film growth was expressed as a function of time and temperature and the growth of the oxide film was surpressed when oxygen concentration was less than 5%. An adhesion strength test of epoxy molding compound to the oxidized copper surface showed drastic degradation of strength if the film thickness exceeded about 20 nm accompanied with delaminating surface alternation. Finally, we conducted a reflow cracking test with samples whose oxide film thickness was controlled. The results showed good correlation with the adhesion strength test. It was found that the oxide film thickness should be less than 40 nm to enhance reflow crack performance.

查看原文本刊更多论文

铜引线框包的氧化控制，防止爆米花开裂

铜合金引线架具有良好的热学、电气、机械性能和性价比。然而，在回流焊接期间，由于成型化合物与引线框架的附着力差，它很容易受到封装开裂的影响。本文研究了铜引线框架的氧化膜特性及其对半导体封装可靠性性能的影响。根据我们的实验，氧化膜的生长是时间和温度的函数，当氧浓度低于5%时，氧化膜的生长受到抑制。环氧模塑复合材料与氧化铜表面的粘接强度测试表明，当膜厚超过20 nm左右时，环氧模塑复合材料的强度急剧下降，并伴有脱层表面交替。最后，对控制氧化膜厚度的样品进行了回流开裂试验。结果与粘接强度试验具有良好的相关性。结果表明，为了提高再流裂纹性能，氧化膜厚度应小于40 nm。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

1997 Proceedings 47th Electronic Components and Technology Conference

自引率

0.00%

发文量