The application of acoustic microscopy to the characterisation of non-standard microelectronic packaging structures

Abstract

The constant progress of the microelectronics packaging industry towards smaller, cheaper, faster and more reliable products has led to the development of many new advanced and direct IC attach packaging technologies, i.e. Chip-on-Board, Flip Chip and Ball Grid Arrays. The quality and reliability of these technologies is a very important consideration in determining the success of such products. This paper will report on the benefits and limitations found in employing the acoustic microscopy analysis technique to the characterisation, from a reliability perspective, of these advanced microelectronic packaging technologies.