Controlled solder self-alignment sequence for an optoelectronic module without mechanical stops

A new flip-chip solder technology has been developed for the precision self-alignment of an optoelectronic module without using mechanical stops. A main feature of the technology is the controlled self-alignment sequence: the laser is aligned to a polymer waveguide in the lateral and vertical directions, then it slowly makes a contact with the waveguide in the axial direction. The elimination of the use of mechanical stops significantly simplifies the process. The axial distance between the laser and the waveguide is very small; it is determined by the edges and a tilt angle of 12/spl deg/. The lateral accuracy is less than 2 /spl mu/m.