2009 32nd International Spring Seminar on Electronics Technology最新文献

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Innovation in microelectronics technology education 创新微电子技术教育
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206951
M. Bursik, E. Hejatkova, M. Reznicek, I. Szendiuch, C. Vasko
{"title":"Innovation in microelectronics technology education","authors":"M. Bursik, E. Hejatkova, M. Reznicek, I. Szendiuch, C. Vasko","doi":"10.1109/ISSE.2009.5206951","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206951","url":null,"abstract":"This paper deals with presentation of some new aspects in study program of Microelectronics Technology on Faculty of Electrical Engineering and Communication Technology at Brno University of Technology. Microelectronics technology education makes a part of new study program that there was introduced in last years. This study program consists from three levels, Bachelor, Master and Doctorate degree. Subjects concerning Microelectronics technology make the fix part of this program and they are more and more popular among students from reasons concerning the practical education process. This fact is based on some new teaching activities that were incorporated in curriculum of both, bachelor and master subjects as shown in this paper.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"455 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116410610","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Behavioral model and a MatLAB simulation interface of vibrating wire transducers 振动导线换能器的行为模型及MatLAB仿真界面
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206996
V. Bande, S. Pop, L. Viman, D. Pitica
{"title":"Behavioral model and a MatLAB simulation interface of vibrating wire transducers","authors":"V. Bande, S. Pop, L. Viman, D. Pitica","doi":"10.1109/ISSE.2009.5206996","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206996","url":null,"abstract":"This article wants to reveal a new method to measure and moderate a vibrating wire transducer. Combining a complex measuring procedure that includes data acquisition and a MatLab application, it is possible to calculate the transducer's impedance. Furthermore, using higher frequencies (as the resonance frequency), respectively lower frequencies signals, the technique above evaluates correctly some parameters that where previously unavailable and also calculates the impedance's real and imaginary parts. The above processes are fully automated under MatLAB platform so the transducer's impedance to be efficiently calculated.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125867278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Notice of Violation of IEEE Publication PrinciplesCost minimization for ASIC hybrid BIST designs 违反IEEE出版原则的通知ASIC混合BIST设计的成本最小化
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206969
I. Popa, A. Zafiu, D. Cazacu
{"title":"Notice of Violation of IEEE Publication PrinciplesCost minimization for ASIC hybrid BIST designs","authors":"I. Popa, A. Zafiu, D. Cazacu","doi":"10.1109/ISSE.2009.5206969","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206969","url":null,"abstract":"In this paper are presented different methods for a hybrid BIST cost optimization for single-core designs. For selecting the optimal switching moment from the pseudorandom test mode to the stored test mode, two algorithms were proposed for calculating the complete cost curve of the different hybrid BIST solutions. The first one is a straightforward method based on using traditional fault simulation and test pattern generation. The second one is based on fault table manipulations and uses test compaction. The experimental simulated results demonstrate the feasibility of the approach and the efficiency of the fault table based cost calculation method.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128215657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Conjunctural adaptive system for nuclear applications 核应用联合自适应系统
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206946
C. Talpalariu, J. Talpalariu, C. Matei, I. Lita
{"title":"Conjunctural adaptive system for nuclear applications","authors":"C. Talpalariu, J. Talpalariu, C. Matei, I. Lita","doi":"10.1109/ISSE.2009.5206946","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206946","url":null,"abstract":"The works show a general processing diagram for a complex, “Conjunctural adaptive” system and a reliability and safety estimation for a concrete nuclear dosimetric network used in Pitesti Triga research reactor.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127372513","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Structural, electrical and surface static charge investigation of TiO2 thin films doped with different amount of vanadium 掺钒量不同的TiO2薄膜的结构、电学和表面静电荷研究
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206968
E. Prociów, J. Domaradzki, K. Sieradzka, D. Kaczmarek, M. Mazur
{"title":"Structural, electrical and surface static charge investigation of TiO2 thin films doped with different amount of vanadium","authors":"E. Prociów, J. Domaradzki, K. Sieradzka, D. Kaczmarek, M. Mazur","doi":"10.1109/ISSE.2009.5206968","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206968","url":null,"abstract":"In this work structural, electrical and antistatic properties of TiO2 thin films doped with different amount of V have been presented. It was shown that the doped thin films are semiconductors in room temperature. The amount of V dopant has a great influence on resistivity of prepared thin films similarly as annealing at 400°C. The time of static charge dissipation from the thin films surface dropped from 1.284 s (for undoped TiO2) to 0.508 s (for doped with V). Although variation in the amount of V dopant in the range from 19 to 23 at. % results in three orders of magnitude change of resistivity, all doped thin films displayed similar antistatic properties.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125519716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Generic visualization of technological process flows 技术流程的通用可视化
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206935
J. Lange, A. Klemmt, G. Weigert
{"title":"Generic visualization of technological process flows","authors":"J. Lange, A. Klemmt, G. Weigert","doi":"10.1109/ISSE.2009.5206935","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206935","url":null,"abstract":"The visualization of production flows is a suitable method to understand high process complexities and often multi-operational dependencies. Those processes are typical of modern semiconductor facilities, but are also of interest for complex equipments, such as cluster tools [2]. As a support for production planning and production control, process sequences are usually illustrated by so-called Gantt charts. There are numerous tools available for Gantt chart visualization. However, these tools often do not generically fit to heterogeneous data environments, which are typical of facility sites. This results in the implementation of new visualization software or at least in the very time-consuming code adaptation of already existing solutions. This paper presents a software approach for an easy, flexible and rapid adaptation to nearly every existing database type and its table structure, which is based on a simple online-configuration functionality.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"22 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114128282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Technologies for wireless data acquisition and monitoring of environmental parameters 环境参数的无线数据采集和监测技术
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206980
I. Lita, I. B. Cioc, D. Visan, I. Dorobantu
{"title":"Technologies for wireless data acquisition and monitoring of environmental parameters","authors":"I. Lita, I. B. Cioc, D. Visan, I. Dorobantu","doi":"10.1109/ISSE.2009.5206980","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206980","url":null,"abstract":"Wireless technologies represent reliable and efficient solutions for remote data acquisition, supervisory and control systems. The correct selection of the proper transmission method from the wide variety of wireless radio transmission methods and standards represents an important issue. For this reason in the firs part of this paper are presented briefly, the newest and most efficient wireless technologies suitable for remote data acquisition and monitoring of environmental parameters. After that, the paper is focus on the GPRS method as solution for implementing such distributed systems. Are presented in detail the GM862 GSM/GPRS modules and the development boards used for tests.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116700281","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Investigation of the pulse load behavior of power wire-wound resistors 电力线绕电阻脉冲负载特性的研究
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207023
J. Nicolics, M. Fasching
{"title":"Investigation of the pulse load behavior of power wire-wound resistors","authors":"J. Nicolics, M. Fasching","doi":"10.1109/ISSE.2009.5207023","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207023","url":null,"abstract":"A long-term resistance drift of wire-wound resistors or even a failure is frequently caused by short but repeated temperature peaks during pulse load operation. In this paper this aspect is investigated by comparison of two types of power wire-wound resistors with identical resistance value, nominal power, and size, but significantly different thermal behavior under pulse load condition. In order to capture the thermal cause as directly as possible a specific measuring circuit was developed to record the temperature as a function of time in the resistor wire during the dynamic cooling phase immediately after a pulse. In this way a peak temperature of e.g. 405°C was observed in one resistor type whereas the peak temperature in the other one at the same pulse load condition exceeded even 1000°C which is undoubtedly detrimental if periodically repeated. The measuring principle is presented in detail. The measuring accuracy is estimated and its meaning for the interpretation of the obtained results is shown. Based on these results the dependence of the pulse load resistivity of a wire-wound resistor on its interior structure is discussed. It is demonstrated that the pulse load performance can be improved significantly by increasing the thermal capacitance of the resistor wire without increasing the resistor size.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122739604","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Design, modelling and testing of mechatronic system controlled with system-on-chip device 用片上系统控制的机电系统的设计、建模和测试
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206987
A. Drumea, A. Vasile, P. Svasta
{"title":"Design, modelling and testing of mechatronic system controlled with system-on-chip device","authors":"A. Drumea, A. Vasile, P. Svasta","doi":"10.1109/ISSE.2009.5206987","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206987","url":null,"abstract":"Mechatronic systems combine fine mechanics, electronics and information technology to achieve better performance with lower cost when compared with a mechanical-only device. Hydraulic systems, using hydraulic cylinders as actuators, are typical mechatronic systems. Efforts were made to develop a universal electronic module for controlling mechatronic devices and a test mechatronic system to validate this module was design and implemented. The paper presents design, simulation, implementation and testing of a mechatronic system controlled by a single chip electronic module based on 16 bit RISC microcontroller with large resources of memory and peripherals. The module was tested and special software was developed for a mechatronic application — an electro hydraulic position control system. The originality aspects of the work come from the unique design of electronic board able to handle a large range of mechatronic systems. The simple implementation of digital PID algorithm makes the module suitable for control of hydraulic applications like railway hydraulic damper test bench or hydraulic presses for recycling materials (chainsaw dust, PETs).","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131102782","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Advanced simulation of load variation in induction heating systems 感应加热系统负载变化的高级模拟
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207004
I. Baciu, A. Taut, O. Pop, S. Lungu
{"title":"Advanced simulation of load variation in induction heating systems","authors":"I. Baciu, A. Taut, O. Pop, S. Lungu","doi":"10.1109/ISSE.2009.5207004","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207004","url":null,"abstract":"All induction heating applied systems are developed using electromagnetic induction. Electromagnetic induction refers to the phenomenon by which electric current is generated in a closed circuit by the fluctuation of current in another circuit placed next to it. The basic principle of induction heating is that AC current flowing through a circuit affects the magnetic movement of a secondary circuit located near it. The fluctuation of current inside the primary circuit provided the answer as to how the mysterious current is generated in the neighboring secondary circuit.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134270570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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