掺钒量不同的TiO2薄膜的结构、电学和表面静电荷研究

E. Prociów, J. Domaradzki, K. Sieradzka, D. Kaczmarek, M. Mazur
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引用次数: 1

摘要

本文研究了掺杂不同V量的TiO2薄膜的结构、电学和抗静电性能。结果表明,掺杂薄膜在室温下是半导体。V掺杂量对制备薄膜的电阻率影响很大,类似于400℃退火。薄膜表面静电荷耗散时间从未掺杂TiO2的1.284 s下降到掺杂V的0.508 s。V掺杂量的变化范围为19 ~ 23 at。%导致电阻率变化3个数量级,所有掺杂薄膜表现出相似的抗静电性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Structural, electrical and surface static charge investigation of TiO2 thin films doped with different amount of vanadium
In this work structural, electrical and antistatic properties of TiO2 thin films doped with different amount of V have been presented. It was shown that the doped thin films are semiconductors in room temperature. The amount of V dopant has a great influence on resistivity of prepared thin films similarly as annealing at 400°C. The time of static charge dissipation from the thin films surface dropped from 1.284 s (for undoped TiO2) to 0.508 s (for doped with V). Although variation in the amount of V dopant in the range from 19 to 23 at. % results in three orders of magnitude change of resistivity, all doped thin films displayed similar antistatic properties.
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