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2009 32nd International Spring Seminar on Electronics Technology最新文献

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An improvement on empirical modelling of the batteries 电池经验模型的改进
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207015
D. Cadar, D. Petreus, I. Ciocan, P. Dobra
{"title":"An improvement on empirical modelling of the batteries","authors":"D. Cadar, D. Petreus, I. Ciocan, P. Dobra","doi":"10.1109/ISSE.2009.5207015","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207015","url":null,"abstract":"Batteries are devices that convert chemical energy contained in its active materials into electric energy throughout electrochemical red-ox reactions. Theoretically, the energy provided by a battery depends only on its active substances. Practically, just a part of a battery's capacity can be used, due to the nonreactive substances that add up to the process and which influence the magnitude of the charge-transfer reaction, diffusion rates and energy losses. In this paper five methods for modeling the batteries were presented, and one improved empirical model was implemented. The empirical model was built using Mathcad and was validated through the comparison of the experimental obtained characteristics with the ones given by the producer.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116631629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Investigation of thermal conductivity of PCB PCB热导率的研究
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207019
A. Andonova, Nadezda Kafadarova, V. Videkov, S. Andreev
{"title":"Investigation of thermal conductivity of PCB","authors":"A. Andonova, Nadezda Kafadarova, V. Videkov, S. Andreev","doi":"10.1109/ISSE.2009.5207019","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207019","url":null,"abstract":"The thermal conductivity of PCB structures variations according to the position of the metal layers as a function of the local copper contents and distribution are studied. The value of the parallel and serial thermal conductivity coefficient of PCB have been calculated by usage of the corresponding electrical analogs of parallel and serial resistive systems. Solutions were obtained for two PCB thicknesses. Cases with and without a copper layer on the component side were investigated. Simulated results are verified with infrared thermovision measurements.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114593950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Bipolar ESD power clamp in high voltage CMOS based on TCAD device simulation 基于TCAD器件仿真的高压CMOS双极ESD电源钳
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206981
P. Běťák
{"title":"Bipolar ESD power clamp in high voltage CMOS based on TCAD device simulation","authors":"P. Běťák","doi":"10.1109/ISSE.2009.5206981","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206981","url":null,"abstract":"The paper contributes a specific way to form bipolar ESD power clamp in high voltage CMOS technologies. The CMOS technology cannot use efficient bipolar structures but only the parasitic structures. Here, the functional ESD power clamp is introduced which has higher holding voltage than conventional structures in CMOS. The higher holding voltage is very necessary for power clamps. The structure were formed and simulated in TCAD device simulator and manufactured in high voltage CMOS process.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114902987","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation of cleaning in electronics production process 电子产品生产过程的清洁评价
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207064
M. Bursik, I. Szendiuch, V. Sítko
{"title":"Evaluation of cleaning in electronics production process","authors":"M. Bursik, I. Szendiuch, V. Sítko","doi":"10.1109/ISSE.2009.5207064","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207064","url":null,"abstract":"Cleaning processes used in electronics productions are limited by cleaning efficiency. Those according to physical principle particular cleaning processes limits the area of application of existing system. At the selection of cleaning equipment is very important specification of their efficiency. For this purpose we have developed the quantifiable analyze of contaminated patterns. Evaluating is realized by test pattern on which are applied cleaning processes with different parameters. Next operation is visual controlling of residual contamination. In this way we are capable to determinate the average efficiency of cleaning system, specific efficiency on concrete test pattern and the homogeneity of cleaning efficiency in cleaning chamber. Important for cleaning process is an activity of cleaning medium. The activity of cleaning medium must be over minimum limits. Time intervals are set constant by the parameters of cleaning process especially its activity. For this reason is useful online monitoring of cleaning medium efficiency. This method requires universal sensor of medium activity.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"161 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115173363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Electrodes modified by carbon nanotubes for pressure measuring 碳纳米管修饰的压力测量电极
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206959
J. Pekárek, R. Ficek, R. Vrba, M. Magat
{"title":"Electrodes modified by carbon nanotubes for pressure measuring","authors":"J. Pekárek, R. Ficek, R. Vrba, M. Magat","doi":"10.1109/ISSE.2009.5206959","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206959","url":null,"abstract":"This paper describes a new approach to pressure sensors development using field emission and capacitive principles. Both sensors consist of two high doped silicon electrodes. Usually, for both pressure measurements, one electrode is anisotropic etched to obtain a sensitive membrane and the other one is solid with a carbon nanotubes (CNTs) array. The field emission sensor works on the principle that the field emission current is correlated with the electrical field intensity, i.e. the anode-emitter distance when the applied voltage is fixed. The capacitive sensor takes advantage of CNTs dimensions to increase the surface. This means that the CNTs array in the emission sensors serves as the emitter source of electrons between the cathode and the anode in the electric field and the CNTs arrays in the capacitive sensors increase the surface of the electrodes, which are similar to a plate capacitor.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"s3-4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130174444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Real-time monitoring of electrochemical migration during environmental tests 环境试验过程中电化学迁移的实时监测
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207046
B. Medgyes, R. Berényi, L. Jakab, G. Harsányi
{"title":"Real-time monitoring of electrochemical migration during environmental tests","authors":"B. Medgyes, R. Berényi, L. Jakab, G. Harsányi","doi":"10.1109/ISSE.2009.5207046","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207046","url":null,"abstract":"More and more reliability and quality problems of electrical assemblies have to be solved due to the trend of miniaturization and the even higher level of integration. In some cases these failures can lead to catastrophic failure. The phenomenon of electrochemical migration is one of the most dangerous failure mechanism which usually results in short resistive circuits. In this paper electrochemical migration (ECM) failure phenomena is be investigated which was real-time monitored by the measurements of electrical parameters of conductor patterns with immersion Ag and immersion Ag finish coated with Sn60Pb on Printed Wiring Boards (PWB.) Highly Accelerated Stress Test (HAST) and Thermal Humidity Bias (THB) tests were carried out and Mean Time To Failure (MTTF) comparison was investigated between immersion Ag and immersion Ag coated with Sn60Pb.Only preliminary investigations were presented in order to determine the steps of the full ECM process on different substrates, surface finishes, solder alloys under various climatic conditions. The key findings were that the MTTFs during HAST tests were significantly shorter than in case of THB tests.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130318722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Investigation of metrological characteristics of digital sinewave generator 数字正弦波发生器计量特性研究
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206940
K. Stefanova, B. Koen, I. Petrov
{"title":"Investigation of metrological characteristics of digital sinewave generator","authors":"K. Stefanova, B. Koen, I. Petrov","doi":"10.1109/ISSE.2009.5206940","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206940","url":null,"abstract":"The paper presents the analysis of the amplitude absolute error of a digital sinewave generator with step approximation and step-linear approximation. Further in the paper is presented an investigation of the spectrum of digital sinewave generator signal. Non-linear distortion (NLD) of digital sinewave with step and step-linear approximation is analysed. The non-linear distortion is calculated in order find the approximation with smaller NLD. Up to this paper is made cooperative analysis of the amplitude absolute error of digital sinewive generator with linear approximation and step-linear approximation.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121687989","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Image analysis of solder spread factor on different material types 不同材料类型上焊料扩散系数的图像分析
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207059
K. Dušek, J. Martinek
{"title":"Image analysis of solder spread factor on different material types","authors":"K. Dušek, J. Martinek","doi":"10.1109/ISSE.2009.5207059","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207059","url":null,"abstract":"This article deals with the image analysis of the solder spread factor on the different material types and surface finishes. The spread factor of the solders is one of the tools which should be used to solderability and wetability quantification. Two types of solders (Sn62Pb36Ag2, Sn95,5Ag4Cu0,5) four types of material (lead free H.A.L., passivated copper, immersion tin plating, chemical gold plating) ware used in experiment. Three types of different roughness of the surface finish were used in case of cooper material. The differences between the solder spread factor on the different types of material and surface finishes ware evaluated by image analysis of the spread factor surface.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121388816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Comparative study of GaPO4, langasite, and LiNbO3 properties with application in Surface Acoustic Waves microdevices GaPO4、langasite和LiNbO3在表面声波微器件中的应用比较研究
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207062
P. Schiopu, I. Cristea, N. Grosu, A. Craciun
{"title":"Comparative study of GaPO4, langasite, and LiNbO3 properties with application in Surface Acoustic Waves microdevices","authors":"P. Schiopu, I. Cristea, N. Grosu, A. Craciun","doi":"10.1109/ISSE.2009.5207062","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207062","url":null,"abstract":"The results of research into Surface Acoustic Wave — SAW — devices have been recognized for their efficiency and versatility in the electrical signals processing. Actual progress in the industrial application of piezoelectric materials such as Lithium Niobate (LiNbO3), Langasite (LGS), Lanthanum-Gallium Silicate La3Ga5SiO14 and Gallium Orthophosphate (GaPO4), allows the manufacturing of devices with performances, which overcome the limits obtained with quartz crystals. One of the most important applications of SAW microdevices is passively, wirelessly interrogating systems. Today, GaPO4 with its properties is by far the best suited piezoelectric material to be used in sensor applications for machine monitoring and pressure measurements, at high temperatures. SAW microdevices based on GaPO4 operate at temperatures of up to 800°C. In this paper is presented a short introduction regarding the actual level of SAW microdevices development. We discuss our investigations as a comparative study of GaPO4, Langasite, and LiNbO3, regarding their properties. Each has unique strengths and weaknesses giving advantages in different applications. Conclusions regarding trends in the development of SAW sensor devices with novel materials are presented in the end of the work.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"48 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120822130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Simulating embedded targets for efficient code implementation 模拟嵌入式目标，实现高效的代码
2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206997
M. Muresan, D. Pitica
{"title":"Simulating embedded targets for efficient code implementation","authors":"M. Muresan, D. Pitica","doi":"10.1109/ISSE.2009.5206997","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206997","url":null,"abstract":"Nowadays design of embedded systems for controlling processes requires high complexity software modules. In this way, the automatic code generation approach for designing such embedded systems seems to be the most competitive solution in terms of cost-effectiveness and performance","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"87 9","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120865337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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