2009 32nd International Spring Seminar on Electronics Technology最新文献_第3页

Defect level prediction for newly designed Printed Circuit Board Assemblies 新设计印刷电路板组件的缺陷等级预测

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207033

R. Soukup

引用次数: 1

Modeling bipolar junction effects for high entropy generators 模拟高熵发生器的双极结效应

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207003

G. Chindris, M. Muresan, A. Suciu

引用次数: 0

The evaluation of the dynamic performances for high speed A/D converters using mathematical models and simulations 采用数学模型和仿真方法对高速A/D转换器的动态性能进行了评价

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206995

L. Viman, S. Lungu, M. Dabacan, V. Bande

引用次数: 0

Investigation of Zinc Oxide nanorods growth on Indium Tin Oxide coated glass substrates 氧化铟锡镀膜玻璃基板上氧化锌纳米棒生长的研究

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206933

M. Byrczek, Paramaswar Hari, J. Donaldson, H. Teterycz

引用次数: 2

Reconfigurable platform for versatile generation of communication signals 可重构的通用通信信号生成平台

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207041

D. Visan, M. Jurian, I. Lita, I. B. Cioc

引用次数: 2

Synthesis of zinc oxide nanotiles by wet chemical route assisted by microwave heating 微波加热辅助湿化法制备氧化锌纳米瓦

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206934

M. Malewicz, M. Byrczek, H. Teterycz

引用次数: 6

Verification measurements in a “Linn” type high-temperature soldering oven 在“Linn”型高温焊接炉中验证测量结果

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207032

B. Illés, L. Jakab, J. Kõmives, Eszter Devecser, A. Szabó

{"title":"Verification measurements in a “Linn” type high-temperature soldering oven","authors":"B. Illés, L. Jakab, J. Kõmives, Eszter Devecser, A. Szabó","doi":"10.1109/ISSE.2009.5207032","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207032","url":null,"abstract":"In this paper the technology of the “Linn” type high-temperature soldering oven [1] and the verification measuring methods of the oven are discussed. This oven is mainly used for fixing silicon chips on metal substrates by high temperature soldering process. The solder (manly 96Pb/4Sn) is placed between the Si chip and the metal substrate in a foil form before the soldering process. The soldering foil does not contain any flux, therefore reducing agent has to be applied to avoid the oxidation of the joints during the process. In this case the reducing agent is the Forming gas which is a mixture of 10 vol% H2 and 90 vol% N2. Forming gas is used as an atmosphere for processes that need the properties of hydrogen gas without the explosion hazard. The key factors of this soldering process are the suitable temperature (350–370 °C until 13–15 minutes) and the suitable H2 concentration (8–10 vol%) during this. Therefore we have created accurate methods to measure the H2 concentration and the dynamic heating parameters of the oven (time coefficients of the heating and the heating temperatures). The H2 concentration was measured with an ABB EL3020 H2 analyzer and the dynamic heating parameters was calculated from the temperature changes in the oven which were measured with K-type (NiCr-Ni) thermo-couples.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122423223","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Electrical and microstructure evolution of thick film lead-free resistors after various temperature treatments 不同温度处理后厚膜无铅电阻器的电学和微观结构演变

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207071

K. Kielbasinski, M. Jakubowska, A. Mlozniak, M. Hrovat, J. Holc, D. Belavic

引用次数: 0

Vocational training and further education in electronic technology as feasible TQM tool 电子技术的职业培训和继续教育是可行的TQM工具

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5206950

J. Urbančík, A. Pietrikova

{"title":"Vocational training and further education in electronic technology as feasible TQM tool","authors":"J. Urbančík, A. Pietrikova","doi":"10.1109/ISSE.2009.5206950","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206950","url":null,"abstract":"Really quick development in electronics and their assembling technologies are accompanied by the continuous and significant necessity for upgrade of the knowledge required from people employed in this branch. This fact concerns all persons with no exception — from the management, through other technical personnel including engineers and technicians, to all skilled or even unskilled workers alike. Workforce with excellent professional skills and superior technical background represent basic assumption for continuous electronic production with adequate quality level in final outcomes. This paper tries to show possible approach to the training system in Electronic Technology area as to an alternative feasible tool for Total Quality Management (TQM). It includes proposal problem solving for general tasks connected with exploration of industrial background, demands to primal and further vocational training and/or employee retraining. This contribution also describes some rules and assumptions for training application, basic division from proposed chapters to specific modules overview, their applications and valorization in praxis. Each of training modules should represent self-contained unit which solves particular problem from selected chapter, is in direct connection with other modules and is prepared for both ways training - face to face and self/e-learning.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114896082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

FPAA implementation of signal processing circuits for radiation sensors 辐射传感器信号处理电路的FPAA实现

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI: 10.1109/ISSE.2009.5207001

I. B. Cioc, I. Lita, D. Visan, I. Bostan

引用次数: 5