{"title":"Data acquisition and control unit for electro hydraulic applications","authors":"M. Blejan, I. Dutu, B. Lupu, C. Cristescu","doi":"10.1109/ISSE.2009.5206984","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206984","url":null,"abstract":"The paper describes a systematic approach regarding the development of the electro hydraulic applications. The constantly increased number of sensors used into this type of systems and the need of a control equipment able to implement local regulation loops, contribute to the design of a compact, multifunctional electronic module capable on one way to interface with the electro hydraulic system to measure it's functional parameters and to drive it's electro hydraulic constituent elements, and on the other, to interface with other control systems via a communication protocol implemented on a serial bus. The proposed module offers a high degree of flexibility both at the hardware level as an analogical input can be easily adapted to support voltage signals instead of current signals; and at the software level where it can be implemented various regulation algorithms depending on the electro hydraulic application. The microcontroller present into the module assures the usage of a reduced number of electronic components. This fact increases the robustness of the solution which is needed for the system to properly operate under heavy working environment conditions.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-08-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121381969","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Development of reflow soldering processes using heaters' operation control","authors":"P. Mashkov, T. Pencheva, B. Gyoch","doi":"10.1109/ISSE.2009.5207022","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207022","url":null,"abstract":"Investigation deals with development of reflow soldering processes for some kinds of electronics components, difficult for soldering to PCBs, such as BGA (ball grid array) packages and LEDs mounted on metal substrates. Soldering processes for such kind of objects are complicated and failures are more probable. To solve these problems new kind of soldering equipment is proposed to be used. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at the same place without conveyor belt. Experiments show that by proper control of the operation of the heaters, of gas flow circulation and by some small changes in the heating camera desirable temperature profiles can be realized and problems with soldering can be solved successfully.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115225899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Technological possibilities of LTCC ceramic for field of sensors","authors":"I. Vehec, P. Cabúk, S. Slosarcik, M. Dovica","doi":"10.1109/ISSE.2009.5207054","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207054","url":null,"abstract":"This paper is focused on shaping technology of LTCC (Low Temperature Cofired Ceramics) and their marginal possibilities in 3D shaped modules. The first part of paper deals with analysis of marginal possibilities of LTCC ceramic shaping. There were realized samples with various bending angles and various number of layers with embedded thick-film conductive paths. Applicability of obtained results was attested on development of 3D shaped module with thick-film pressure sensor.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123761918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Influence of carbon nanotubes added to a commercial adhesive","authors":"D. Bušek, P. Mach","doi":"10.1109/ISSE.2009.5206966","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206966","url":null,"abstract":"This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within electrically conductive adhesive and possible advantages of non-spherical particles distributed within the adhesive matrix. Two different commercial conductive adhesives were used in this experiment and different amounts of carbon nanotubes were mixed using different methods (ultrasound/rotation/spatula mixing) into the matrix. The positive effect in terms of mechanical properties can be expected according to previous research in the material field. The goal of this work is to describe the influence of this additional filler onto electrical parameters and generally to improve the adhesive properties.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114519426","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Synergetic model of engineering education in instrumentation engineering","authors":"N. L. Taranukha, Yury Demakov, V. P. Taranukha","doi":"10.1109/ISSE.2009.5206945","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206945","url":null,"abstract":"The existing system of education has to be transformed appropriate to the conditions of increased intensity of training and modern quality of providing educational services. The paper focuses on the organizational model of additional education producing synergetic effect from the realization of joint educational activity on the additional and basic programs, connected to the additional programs on the basis of a rotation principle according to the economic priority","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114596509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electrical and optical properties of InGaAsSb/GaSb","authors":"B. Podor, Z. Horváth, V. Rakovics","doi":"10.1109/ISSE.2009.5206952","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206952","url":null,"abstract":"InGaAsSb layers were grown on GaSb substrates by liquid phase epitaxy. The variation of the bandgap with composition was determined and a new value for the bandgap bowing parameter is proposed. Mechanisms of the current conduction process in Au/InGaAsSb Schottky barrier structures were determined as well as the value of the Schottky barrier heights.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126688371","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Co-simulation and validation of valves for electro-pneumatic automotive systems","authors":"A. Géczy, H. Németh, T. Kandár","doi":"10.1109/ISSE.2009.5206988","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206988","url":null,"abstract":"In this paper a new co-simulation approach is presented for modelling and simulating both mechanical and electrical components together at the same time for X-by-wire automotive applications. The system to be simulated contains electronically controlled magnet valves. The optimal electronic control of the magnet can be easily adjusted by this co-simulation approach during the designing phase. The idea, the model, the results of the co-simulation, and the realized electronic control unit are presented. The identification of the magnet valve model and the validation of the electronic unit are finalized by measurements on the realized system.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115928441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Detection of gases and vapours concentration from resonance curve of interdigital system","authors":"T. Blecha","doi":"10.1109/ISSE.2009.5207060","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207060","url":null,"abstract":"Interdigital structure with thin film sensitive organic layer is the base of many sensors for gases and vapours detection. This structure with sensitive layer has capacitive character where the influence of gas and vapour causes the change of its capacitance and dissipation factor. Resonance circuit, created by interdigital structure and an inductor, is then suitable for gas and vapour concentration detection. This article describes methods of relative humidity detection from the resonance circuit curve and presents many experimental results as well.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133905992","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Decision support systems in controlling and optimizing of diagnostic processes","authors":"Tomáš Hujer, F. Steiner","doi":"10.1109/ISSE.2009.5206993","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5206993","url":null,"abstract":"Nowadays the Business Process Management and its tools are integral part of process controlling. Decision support systems (DSSs) are used in a wide field of application, from medicine to maintenance. In the scope of development and diagnostic of new materials, DSSs can be used for optimizing of diagnostic processes and reduction of development time following the anterior data, knowledge and experience. DSSs provide new possibilities in discovery of materials and combination of materials with exactly defined properties. In addition, they can reduce related costs. This paper deals with DDS types suitable for controlling and optimizing of diagnostic processes and describes methodology of DSS development — Prototyping. Prototyping is a kind of Rapid Application Development (RAD).","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"201 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132839060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"X-ray and scanning acoustic microscopy analysis on lead-free automotive electronic module","authors":"A. Manukova, D. Stephanov, T. Pencheva","doi":"10.1109/ISSE.2009.5207021","DOIUrl":"https://doi.org/10.1109/ISSE.2009.5207021","url":null,"abstract":"Investigation deals with development of lead-free technology for production of electronic devices for automotive industry. The purpose of this article is to present the results concerning solder joints quality evaluated by X-ray and Scanning Acoustic Microscopy (SAM). Strong requirements for reliability in automotive industry demands high quality of solder joints of the devices. Experiments are devoted to development of lead free technology for electronic controllers. Soldering processes for the devices are realized using Sn96.5Ag3.0Cu0.5 solder paste. Tests are based on requirements of ISO/TS 16949 — Quality management system and IPC A610-D — Acceptability of Electronic Assemblies. The results are suitable for validation of products and production processes before starting mass production.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114686075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}