Technological possibilities of LTCC ceramic for field of sensors

Abstract

This paper is focused on shaping technology of LTCC (Low Temperature Cofired Ceramics) and their marginal possibilities in 3D shaped modules. The first part of paper deals with analysis of marginal possibilities of LTCC ceramic shaping. There were realized samples with various bending angles and various number of layers with embedded thick-film conductive paths. Applicability of obtained results was attested on development of 3D shaped module with thick-film pressure sensor.