{"title":"无铅汽车电子模块的x射线和扫描声显微镜分析","authors":"A. Manukova, D. Stephanov, T. Pencheva","doi":"10.1109/ISSE.2009.5207021","DOIUrl":null,"url":null,"abstract":"Investigation deals with development of lead-free technology for production of electronic devices for automotive industry. The purpose of this article is to present the results concerning solder joints quality evaluated by X-ray and Scanning Acoustic Microscopy (SAM). Strong requirements for reliability in automotive industry demands high quality of solder joints of the devices. Experiments are devoted to development of lead free technology for electronic controllers. Soldering processes for the devices are realized using Sn96.5Ag3.0Cu0.5 solder paste. Tests are based on requirements of ISO/TS 16949 — Quality management system and IPC A610-D — Acceptability of Electronic Assemblies. The results are suitable for validation of products and production processes before starting mass production.","PeriodicalId":337429,"journal":{"name":"2009 32nd International Spring Seminar on Electronics Technology","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"X-ray and scanning acoustic microscopy analysis on lead-free automotive electronic module\",\"authors\":\"A. Manukova, D. Stephanov, T. Pencheva\",\"doi\":\"10.1109/ISSE.2009.5207021\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Investigation deals with development of lead-free technology for production of electronic devices for automotive industry. The purpose of this article is to present the results concerning solder joints quality evaluated by X-ray and Scanning Acoustic Microscopy (SAM). Strong requirements for reliability in automotive industry demands high quality of solder joints of the devices. Experiments are devoted to development of lead free technology for electronic controllers. Soldering processes for the devices are realized using Sn96.5Ag3.0Cu0.5 solder paste. Tests are based on requirements of ISO/TS 16949 — Quality management system and IPC A610-D — Acceptability of Electronic Assemblies. The results are suitable for validation of products and production processes before starting mass production.\",\"PeriodicalId\":337429,\"journal\":{\"name\":\"2009 32nd International Spring Seminar on Electronics Technology\",\"volume\":\"44 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 32nd International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2009.5207021\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 32nd International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2009.5207021","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
X-ray and scanning acoustic microscopy analysis on lead-free automotive electronic module
Investigation deals with development of lead-free technology for production of electronic devices for automotive industry. The purpose of this article is to present the results concerning solder joints quality evaluated by X-ray and Scanning Acoustic Microscopy (SAM). Strong requirements for reliability in automotive industry demands high quality of solder joints of the devices. Experiments are devoted to development of lead free technology for electronic controllers. Soldering processes for the devices are realized using Sn96.5Ag3.0Cu0.5 solder paste. Tests are based on requirements of ISO/TS 16949 — Quality management system and IPC A610-D — Acceptability of Electronic Assemblies. The results are suitable for validation of products and production processes before starting mass production.
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