2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition最新文献

{"title":"Time window based features extraction from temperature modulated gas sensors for prediction of ammonia concentration","authors":"P. Kalinowski, L. Wozniak, G. Jasinski, P. Jasiński","doi":"10.23919/EMPC.2017.8346892","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346892","url":null,"abstract":"Electronic gas recognition systems, in literature commonly referred as electronic noses, enable the recognition of a type and a concentration of various volatile compounds. Typical electronic gas-analyzing device consists of four main elements, namely, gas delivery subsystem, an array of gas sensors, data acquisition and power supply circuits and data analysis software. The commercially available metal-oxide TGS sensors are widely used in such instruments. They are inexpensive and considered to be reliable. However, such sensors also have limitations. One of the most important problems of utilization of TGS sensors is the drift of their responses. It can lead to incorrect interpretation of the results of measurements. This can be a serious problem in the systems, which are designed to detect e.g. harmful gases. Drift can be caused by poisoning or aging of sensor as well as by the influence of temperature, humidity and gas flow rate. There are approaches to mitigate of this effect. One of them is based on the design of the proper data analysis procedures and algorithms. In this work the method of features extraction from continuous measurements of temperature modulated TGS sensor is presented. Namely, the voltage applied to the sensor heater is switched between two values, while the gas flow rate of the measurement cell is maintained constant. The presented method enables the extraction of the features at any time of measurements using time window with the fixed width. The calibration using LS-SVM regression is utilized for the purpose of prediction of ammonia concentration in humidified atmosphere. The validation measurements were conducted two weeks after the calibration procedure.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123989519","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A novel experimental approach to calibrating cohesive zone elements for advanced risk analysis of interface delamination in semiconductor packages","authors":"G. M. Reuther, N. Pflügler, Dominik Udiljak, R. Pufall, B. Wunderle","doi":"10.23919/EMPC.2017.8346877","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346877","url":null,"abstract":"Interface delamination in moulded semiconductor packages, being caused by thermo-mechanical load, constitutes a major reliability risk. Delaminated units that are exposed to humidity in automotive environments are prone to moisture absorption via opened interfaces. This increases the risk of metal corrosion, which eventually leads to product failure. In order to identify the failure mechanisms behind delamination, Finite Element Modelling (FEM) based on Cohesive Zone Modelling is an indispensable tool. FEM allows one to assess the robustness of interfaces in moulded packages, e.g. between moulding compound and lead frame. On the contrary, conducting standalone stress tests is not sufficient to identify the root cause of the observed failure mode. Selecting appropriate parameters for the cohesive zone elements is a demanding task, because the set of parameters has significant effect on the failure mechanism that one observes in FE simulation. Experiments that are normally used to quantify adhesion can support calibration of cohesive elements in order to accurately predict potential reliability risks. In this article we present a novel idea that enables determining the interface stiffness and critical fracture energy in shear mode by means of the Advanced Button Shear Test Setup. To this end we sheared buttons of moulding compound off a lead frame stripe. Starting from load-displacement curves we determine the temperature dependence of measured shear forces at crack opening and calculated critical fracture energies. The respective quantities for tensile mode are then derived using phenomenological models. As a result, we obtain all parameters that are required to calibrate cohesive zone element models for FEM.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130143343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of the influence of voids on the reliability of LED solder joints by computer tomography and forward voltage measurements","authors":"Christian Schwarzer, K. Lang, Dennis Fuchs, M. Rauer, M. Kaloudis, Andreas Krügelstein, J. Franke","doi":"10.23919/EMPC.2017.8346840","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346840","url":null,"abstract":"Our contribution focuses on the effect of voids on the reliability of solder joints for high-power LED applications. We investigate the reliability of the solder joints with computer tomography (CT) and additional forward voltage measurements to gain a better understanding of the fatigue behavior of solder joints with different void distributions. We characterize low-and high-void solder joints before and after reliability tests, such as thermal shock, by using CT to monitor crack initiation and propagation. In parallel, the forward voltages of the LED are measured and are discussed as an additional indicator for solder fatigue. We compare the results of the CT investigations with results from the forward voltage measurements, and they are contrasted with respect to failure modes, such as the position of cracks.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127972496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"3D printed ceramic structures based on LTCC: Materials, processes and characterizations","authors":"A. Schulz, T. Welker, N. Gutzeit, Jens Müller, O. Goudouri, Dieter Nikolay, Niklas Kemmling, W. Kollenberg","doi":"10.23919/EMPC.2017.8346861","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346861","url":null,"abstract":"3D Multi Material (3Dmm) printing of LTCC materials in combination with functional metallic inks based on powder bed structuring is a new and innovative technology which enables the fabrication of electronic components and upcoming circuits, cost efficiently in small series, offer rapid prototyping capabilities as well as will feature less geometrical restrictions during design process compared to other common technologies soon. Recent material compositions of the ceramic powder mixture, binder and functional ink were developed and utilized successfully using an experimental 3D printer. Characterizations of 3D printed ceramic compounds and functional inks exhibit adequate physical and electrical properties. Furthermore, the material powder composition facilitates compatibility to SMT (surface mounting technology) and to common packaging technologies applying a screen printing step which enhance additional functionality of 3D printed electronic devices.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131662133","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"3D printed flexible substrate with pneumatic driven electrodes for health monitoring","authors":"M. Schubert, Sabine Friedrich, K. Bock, D. Wedekind, S. Zaunseder, H. Malberg","doi":"10.23919/EMPC.2017.8346846","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346846","url":null,"abstract":"Telemedical methods enable remote patient monitoring and healthcare at a distance. Besides, fitness tracker and sport watches are currently trending electronic products to generate awareness of health parameters in daily life. Especially, the long-term and continuous measurement of electrophysiological signals such as electrocardiogramm (ECG) becomes increasingly attractive for telemedical applications. Typically used disposable Ag/AgCl wet electrodes for good skin-electrode contact can potentially cause skin irritation and rashes. This paper presents a low cost, individual and flexible substrate for skin electrodes to be applied in future consumer electronic or professional applications. It enables an alternative contact method of the electrode to the skin by applying a pressure during the measurement and hence good contact. If no measurement is needed pressure can be released and the electrode loses skin contact. The 3D printed polymer module is 4 mm thick and comprises a pressure chamber, silver electrodes and insulation layer. The airtight printed membrane of flexible filament, which expands when inflating the chamber, may be printed in different thicknesses and shapes, much thinner than the present 4mm. This enables a high individuality for various applications. Pressure up to 150 kPa was applied and leads to dilatation of 1400 μm. First tests on skin when measuring electrodermal activity (EDA) show promising results for future applications.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123799410","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development of PEB face-down interconnection process for ultra thin flexible package","authors":"Jae Hak Lee, C. Lee, Y. J. Kim, S. Kim, J. Song","doi":"10.23919/EMPC.2017.8346830","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346830","url":null,"abstract":"System in Foil (SiF) package could realize flexible, multi-functional and higher performance package using flexible substrate and ultra-thin heterogeneous chip integration. In this study, PEB(polymer elastic bump) bonding process is suggested newly, which could reduce stress concentration remarkably near bump and chip face by soft polymer bump material with electro-conductive metal line pattern and usage of NCF(non-conductive adhesive film) and also lower bonding temperature during face-down interconnect process between flexible substrate and ultra-thin chip. Compared to conventional bonding process by metal bumps, it improves flexibility of package because PEB is softer than metal bump and NCF adhesive film keeps mechanical contact between PEB and pad. Elastic deformation and restoration behavior of PEB bump during bonding process are investigated using FEM analysis to calculate bump-to-pad contact area related to electrical contact resistance. Through experiments PEB fabrication process of 50 pm diameter is developed using thermal reflow process and we find optimal bonding conditions and effect of bonding parameters.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131230674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design, fabrication and experimental characterization of mixed thick-/thin film thermoelectric microgenerators based on constantan/silver","authors":"M. Gierczak, Joanna Prażmowska-Czajka, A. Dziedzic","doi":"10.23919/EMPC.2017.8346900","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346900","url":null,"abstract":"Small and cost-effective thermoelectric microgenerators, based on Seebeck effect in semiconductors or metals, usually convert waste thermal energy directly into useable electrical energy. They are potential energy sources for low-power autonomous microsystems. The most commonly investigated thermoelectric microgenerators are based on metals, semimetals and various semiconductors. Thick-film technology is cheaper than thin-film one but so far the largest Seebeck coefficient for screen-printed metallic films was equal to 24 μν/Κ (Ag/Ni system [1,2]). On the other hand hybrid (thick/thin) film microgenerators fabricated and investigated at the Wrocław University of Science and Technology had larger effective Seebeck coefficient but simultaneously even much larger internal resistance and this caused their lower output power compared to thick-film metallic microgenerators [3]. This paper describes design, manufacturing and characterization of newly developed mixed thick-/thin film thermoelectric microgenerators based on magnetron sputtered constantan (copper-nickel alloy) and screen-printed silver layers. Thermoelectric microgenerator consists on sixteen thermocouples made on 27.5×34.2×0.25 mm3 alumina substrate. One of thermocouples arms was made of magnetron sputtered constantan (Cu-Ni alloy), second was Ag-based screen-printed films. The length of every thermocouple arms was equal to 27 mm whereas their width −0.3 mm. The distance between arms was equal to 0.3 mm. In the first step a pattern mask with thermocouples was designed and fabricated. Then, constantan layer was magnetron sputtered on the whole substrate and photolithography process was used to prepare the first thermocouple arms. The second arms were screen-printed on the substrate using a low temperature silver paste (Heraeus C8829A or ElectroScience Laboratories ESL 599-E). To avoid oxidation of constantan they were fired in a belt furnace in nitrogen atmosphere at 550/450 °C peak firing temperature. Thermoelectric and electrical measurements were performed using the self-made measuring system [4]. Two pyrometers included into the system were used for temperature measurement of hot and cold junctions. The estimated Seebeck coefficient was from the range 35÷41 μV/Κ whereas the total internal resistances were between 250 and 3200 ohms, depending on magnetron sputtering time and kind of silver ink (the resistance of single thermocouple was between 15.5 and 200 ohms, respectively).","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114797861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development of low-temperature sintering nano-silver die attach materials for bare Cu application","authors":"K. Sasaki, N. Mizumura, A. Tsuno, Sedat Yagci, Gerhard Kopp","doi":"10.23919/EMPC.2017.8346875","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346875","url":null,"abstract":"This paper will discuss the fundamental study on nano-silver die attach pastes newly developed with a unique approach using MO (Metallo-organic) technology. MO technology provides a low-temperature sintering capability. The nano-silver pastes show high thermal performance and strong adhesion to the metalized die and substrate without pressure during cure process. In addition, resin reinforcing technology and lowering modulus technology have been developed to improve the mechanical properties. By adding special epoxy resins to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Additionally, the reliability can be more improved by thermoplastic resin particles. By adding the resin particles to the pastes, the modulus can be lowered and the resin reduces the stress caused by the CTE mismatch between the die and substrate. However, the pastes can only be applied on substrates with Ag or Au plating because the metallic bonding forms without difficulty between the nano-silver particles and the Ag or Au plating. To meet the demand for applications without Ag or Au plating, nano-silver die attach pastes for bare Cu application have newly been developed. Addition of a special additive is effective to form metallic bonding between the nano-silver particles and bare Cu substrates because the additive removes the oxide layer on the surface of Cu substrates. By adjusting the amount of epoxy and thermoplastic resin, adhesion strength on the bare Cu substrate can be more improved. The fundamental investigation for the mechanism and the reliability test results will also be discussed in this study.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"194 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116146543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reliability evaluation of solder joints in electronics assemblies","authors":"E. Galbiati","doi":"10.23919/EMPC.2017.8346843","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346843","url":null,"abstract":"This study treats the reliability of solder joints of electronic assemblies, in terms of methodology of evaluation, applicable stress tests and analyses. This study is focused on lead-free solder alloys and describes the solder joint microstructure and its changes caused by thermal stresses, ATC (Accelerated Thermal Cycling) and thermal shock, which cause thermomechanical stresses to the solder joints. In particular, this study compares the different stresses caused by the fast and slow thermal swings. Another topic is a revision of the criteria to evaluate the solder joints on the base of the link between the stress tests and the conditions of the product life. Finally, a proposal for the stress tests and the evaluation criteria is described.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115428295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Resistance development on embedded heating layers during climatic test","authors":"D. Seehase, A. Novikov, M. Nowottnick","doi":"10.23919/EMPC.2017.8346909","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346909","url":null,"abstract":"The influence of environmental conditions on the resistance development of full-faced heating layers, embedded in the substrate material of printed circuit boards (PCB) is studied in this paper. Therefore suitable test boards are manufactured and subjected to temperature and humidity cycling inside a climate chamber, while measuring the electrical parameters. Different material types, suitable for forming the heating layers, are studied here.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129735619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}