利用计算机断层扫描和正向电压测量研究空隙对LED焊点可靠性的影响

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI:10.23919/EMPC.2017.8346840

Christian Schwarzer, K. Lang, Dennis Fuchs, M. Rauer, M. Kaloudis, Andreas Krügelstein, J. Franke

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引用次数: 1

摘要

我们的贡献主要集中在空隙对大功率LED应用中焊点可靠性的影响。我们利用计算机断层扫描(CT)和额外的正向电压测量来研究焊点的可靠性，以更好地了解不同空洞分布的焊点的疲劳行为。在可靠性测试(如热冲击)之前和之后，通过CT监测裂纹的萌生和扩展，我们对低空隙和高空隙焊点进行了表征。同时，测量LED的正向电压，并作为焊料疲劳的附加指标进行讨论。我们将CT调查的结果与正向电压测量的结果进行比较，并将它们与失效模式(如裂纹的位置)进行对比。

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Investigation of the influence of voids on the reliability of LED solder joints by computer tomography and forward voltage measurements

Our contribution focuses on the effect of voids on the reliability of solder joints for high-power LED applications. We investigate the reliability of the solder joints with computer tomography (CT) and additional forward voltage measurements to gain a better understanding of the fatigue behavior of solder joints with different void distributions. We characterize low-and high-void solder joints before and after reliability tests, such as thermal shock, by using CT to monitor crack initiation and propagation. In parallel, the forward voltages of the LED are measured and are discussed as an additional indicator for solder fatigue. We compare the results of the CT investigations with results from the forward voltage measurements, and they are contrasted with respect to failure modes, such as the position of cracks.

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2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

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