2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition最新文献_第2页

Influence of operation temperature instability on gas sensor performance 工作温度不稳定性对气体传感器性能的影响

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346896

G. Jasinski

{"title":"Influence of operation temperature instability on gas sensor performance","authors":"G. Jasinski","doi":"10.23919/EMPC.2017.8346896","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346896","url":null,"abstract":"Gas sensors based on the semiconducting metal-oxides, such as SnO2, have been found to be very useful for detecting a wide range of gases. The reversible interactions of the gas with the surface of the sensing layer made of semiconducting metal-oxides are responsible for changes of sensor resistance which is usually used as a measure of sensor response. Semiconductor gas sensors are commercially available and applied in numerous gas detection systems. They are reliable, small, rugged and inexpensive. However, there are a few problems limiting the wider use of such sensors. Semiconductor gas sensor usually exhibits a low selectivity, a drift and low repeatability of the response, strong influence of temperature and moisture on sensor properties. Instability of operating temperature is one of the factors that influence sensors response and should be taken into consideration during real life measurements. In this work some experimental results demonstrating how ambient temperature affects sensor operating temperature are presented. An approach to stabilize sensor temperature by controlling sensor heater voltage have been proposed. All measurement are performed with dedicated measurement stand consisting of few bench measuring instruments.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126828693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Gaze controlled prosthetic arm with EMG and EEG input interface 具有肌电和脑电图输入接口的注视控制义肢

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346906

Tomasz Kocejko

{"title":"Gaze controlled prosthetic arm with EMG and EEG input interface","authors":"Tomasz Kocejko","doi":"10.23919/EMPC.2017.8346906","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346906","url":null,"abstract":"In this paper the hybrid interface for controlling the prosthetic arm by means of eye tracking and EEG/EMG analysis is shown. The presented interface was designed for people with quadriplegia (caused by neurodegenerative disease or spinal cord injure) who completely lost their mobility. The general purpose of this interface is to partially restore their ability of moving the objects in the surrounding area. The interaction design assumes that such a user looks at a specific item in the environment and thinks about the movement he wants to perform and the prosthetic arm performs certain action. The portable eye tracker was used to determine users point of regards in 3D space while EEG/EMG analysis allowed to send a reach, grab or reach'n'grab command to the processing unit. The data from the eye tracker allowed to position the arm with an accuracy up to 10 cm. The EEG was proved only to confirm certain action while the data acquired by the EMG module allowed for classification of different gestures (up to three gestures) by means of neural networks with an 84% accuracy. The overall interface allow navigation of the prosthetic arm in unobstructed 3D environment.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"182 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114959079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Non-linear thermal model of planar transformers 平面变压器非线性热模型

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346913

K. Górecki, K. Górski

引用次数: 6

The materials and technology parameters influenced on the mechanical properties of low temperature sintered silver joints 低温烧结银接头的力学性能受材料和工艺参数的影响

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346924

K. Stojek, J. Felba, T. Falat, Milena Kiliszkiewicz, A. Moscicki

引用次数: 4

Time evolution of strain distribution during ultrasonic bonding of Cu wire: Impact of bonding temperature 铜丝超声键合过程应变分布的时间演化:键合温度的影响

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346852

M. Sakamoto, Kenichi Nakadozono, K. Iwanabe, T. Asano

引用次数: 1

Distribution of relaxation times as a method of separation and identification of complex processes measured by impedance spectroscopy 弛豫时间的分布作为一种方法的分离和识别的复杂过程测量阻抗谱

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346901

J. Bartoszek, Yixin Liu, J. Karczewski, Sea-Fue Wang, A. Mroziński, P. Jasiński

{"title":"Distribution of relaxation times as a method of separation and identification of complex processes measured by impedance spectroscopy","authors":"J. Bartoszek, Yixin Liu, J. Karczewski, Sea-Fue Wang, A. Mroziński, P. Jasiński","doi":"10.23919/EMPC.2017.8346901","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346901","url":null,"abstract":"Impedance spectroscopy is one of the most commonly performed measurements to characterize electronic and electrochemical systems. Impedance spectra have limited resolution and many different processes may overlap what could be the reason of obstructions in its proper later analysis. Up to date, there are three approaches to solve this problem: examining impedance spectra itself, fitting spectra with equivalent circuits, and calculating the distribution of relaxation times (DRT). The latter method does not require any model or further knowledge about the system. As a result of DRT calculation, a plot containing relatively narrow peaks related to relaxation process of measured system is obtained. Namely, the position of the peak is related to time constant of the process, while the area under the peak to relaxation resistance. The aim of this work is to test available fitting functions to calculate area under a peak for previously prepared model containing different equivalent circuit elements. Obtained results are validated using exact formulas describing distribution of relaxation times for mentioned elements.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130181463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Application of RFID technology in navigation of mobile robot RFID技术在移动机器人导航中的应用

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346907

M. Konieczny, Bartosz Pawłowicz, J. Potencki, M. Skoczylas

引用次数: 10

High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density 高电接触密度硅片组装高精度皮秒激光LTCC结构

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346866

N. Gutzeit, A. Schulz, T. Welker, C. Wagner, Eric Schäfer, Jens Müller

{"title":"High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density","authors":"N. Gutzeit, A. Schulz, T. Welker, C. Wagner, Eric Schäfer, Jens Müller","doi":"10.23919/EMPC.2017.8346866","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346866","url":null,"abstract":"The paper presents a novel manufacturing process which offers a high structure resolution and a high density of electrical contacts on Low Temperature Co-Fried Ceramic (LTCC) for silicon chip assembly. To provide of the small pitch of contacts screen printed gold thick films are laser structured with a picosecond laser ablation machine. Laser structured thick film contact pads have dimensions of 59 μm by 59 μm and laser drilled 50 μm vias are used to provide vertical electrical contacts to laser structured thick film lines on the inner layers. The internal structures are laser structured to provide a high line density. To demonstrate the usability of the laser structured contact pads for the chip assembly a silicon test chip is manufactured in thin film technology having gold pads with dimension of 60 microns by 60 microns. Gold stud bumps were placed on the chip pads using a thermosonic ball-wedge bonder and a 25 μm gold wire. The test chip is mounted on the laser structured surface of the LTCC by means of thermo-compression flip chip bonding. A daisy chain structure was realized on the surface of the test chip and on the LTCC to measure the electrical interconnections between the test chip and the LTCC package. The geometrical shape is measured by laser scanning microscopy (LSM). To ensure the functionality and to exclude internal failures (e.g. shorts) the samples are scanned with X-ray inspection.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127713609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Evaluation of piezoelectric parameters of several commercial thick film capacitor dielectrics 几种商用厚膜电容器电介质的压电参数评价

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346845

A. Ivanov

引用次数: 0

Benchmark study of screen printable silver inks on a PPE based substrate 在PPE基基材上丝网印刷银油墨的基准研究

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346894

Riikka Mikkonen, M. Mäntysalo

引用次数: 2