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2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献

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Conducted EMI simulation for a high power Ultra-precision PMSM driven by PWM converter 对PWM变换器驱动的大功率超精密永磁同步电机进行了电磁干扰仿真
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571724
Youpeng Huangfu, Shuhong Wang, Juanning Yang, Hongxu Wang, L. Di Rienzo, D. Hamza
{"title":"Conducted EMI simulation for a high power Ultra-precision PMSM driven by PWM converter","authors":"Youpeng Huangfu, Shuhong Wang, Juanning Yang, Hongxu Wang, L. Di Rienzo, D. Hamza","doi":"10.1109/ISEMC.2016.7571724","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571724","url":null,"abstract":"The conducted electromagnetic interference (EMI) and overvoltage characteristics for a spindle permanent magnet synchronous motor (PMSM) driven by pulse width modulation (PWM) converter are comprehensively presented. The high power, ultra-precision PMSM is applied to a computer numerical control (CNC) grinding machine. The conducted EMI prediction model mainly includes multi-core shielded cable, high frequency (HF) converter and PMSM models. The multi-transmission line (MTL) theory is employed to establish the multi-core shielded cable considering their coupling effect caused by the control pairs. The parasitic capacitance for the PWM converter is calculated by using the analytical formula. The HF equivalent circuit model of the PMSM is obtained combining the methods of impedance measurement and vector fitting method. The influence of the rotor position on the PMSM impedance measurement is considered. The common mode (CM) and differential mode (DM) interference voltage and current both for the output of inverter and the input of PMSM terminals are conducted by using the prediction model. The parametric influence of the long multi-core shielded cables on the overvoltage for the PMSM terminal is discussed.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124131041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Design methodology for behavioral surface roughness model 行为表面粗糙度模型的设计方法
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571775
Xinyao Guo, Han Gao, G. Shen, Qian Liu, V. Khilkevich, J. Drewniak, S. De, S. Hinaga, Douglas Yanagawa
{"title":"Design methodology for behavioral surface roughness model","authors":"Xinyao Guo, Han Gao, G. Shen, Qian Liu, V. Khilkevich, J. Drewniak, S. De, S. Hinaga, Douglas Yanagawa","doi":"10.1109/ISEMC.2016.7571775","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571775","url":null,"abstract":"The surface roughness of copper foils has a considerable impact on the signal integrity performance of transmission lines at high data rates and long propagation distances. Existing surface roughness models for low-loss transmission lines are inadequate for accurate characterization. A new behavioral model for analyzing the surface roughness effects has been developed. The model is applied in the design process by adding a dispersive term to the bulk dielectric to represent the loss due to the foil surface roughness. By adding a broadband dielectric model into the original transmission model, time- and frequency-domain performance improvements are achieved.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129344659","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
A method to overcome the load connection restrictions in the combined MoM/MTL approach 一种克服MoM/MTL联合方法中负载连接限制的方法
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571710
Morgan Vincent, M. Klingler, Z. Riah, Y. Azzouz
{"title":"A method to overcome the load connection restrictions in the combined MoM/MTL approach","authors":"Morgan Vincent, M. Klingler, Z. Riah, Y. Azzouz","doi":"10.1109/ISEMC.2016.7571710","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571710","url":null,"abstract":"This work proposes a mathematical transformation for the sources and the linear loads to overcome the cable-load connection restrictions applied to a braided shielded cable in the combined MoM/MTL approach. When the assumptions of the transmission line theory are nonvalid because of a non-direct current flowing below the shielded cable, numerical techniques for solving EMC problems have to be deployed. The proposed model is based on an association of voltage sources and current-controlled voltage sources to reproduce the behavior of the real sources and loads at the terminations of a shielded cable. In order to validate this approach, a measurement setup has been proposed to take into account the influence of a non-direct current flowing through a ground plane with a large aperture. The measurement results obtained between 10 kHz and 300 MHz, where the main radio reception EMC issues exist, have been compared to the combined MoM/MTL modified approach. The excellent comparison results prove that combining full-wave numerical techniques and the proposed mathematical transformation can overcome the cable-load conditions in complex electromagnetic environments.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128246093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effectiveness of PCB perimeter Via fencing: Radially propagating EMC emissions reduction technique PCB周界通过围栏的有效性:径向传播的电磁兼容减排技术
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571721
Waylon Lindseth
{"title":"Effectiveness of PCB perimeter Via fencing: Radially propagating EMC emissions reduction technique","authors":"Waylon Lindseth","doi":"10.1109/ISEMC.2016.7571721","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571721","url":null,"abstract":"Via fencing around the periphery of a printed circuit board is a practice to attempt to eliminate radially propagated energy from the edge of a board. This study comparatively analyzed via fenced boards against unfenced boards as well as investigated other emission related design variables including trace distance from the PCB edge, termination loads, and via fence spacing. The S2i measurements were taken with a network analyzer and a horn antenna with the PCB trace as the source. Frequency sweeps from 1-8.5GHz showed that via fencing attenuated as much as 21dB at some frequencies, concluding that via fencing was definitively beneficial. Trace distances to the edge of the board showed mixed results at lower frequencies, but gave higher emissions with smaller distances to the edge at higher frequencies. Varying loads yielded results showing emissions for given loads were highly dependent on frequency with the exception of the dominant short-circuit load. Via fence spacing was shown to be significant, but only loosely followed the 1/8th wavelength rule of thumb. This study proved to be very important for the electronics industry as EMC regulations are increasingly harder to meet with shrinking die process technologies and rising clock frequencies.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121931286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
EMI coupling paths in silicon optical sub-assembly package 硅光学子组件封装中的电磁干扰耦合路径
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571768
Jing Li, Xiao Li, Xiangyang Jiao, Sukhjinder Toor, Ling Zhang, A. Bhobe, J. Drewniak, D. Pommerenke
{"title":"EMI coupling paths in silicon optical sub-assembly package","authors":"Jing Li, Xiao Li, Xiangyang Jiao, Sukhjinder Toor, Ling Zhang, A. Bhobe, J. Drewniak, D. Pommerenke","doi":"10.1109/ISEMC.2016.7571768","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571768","url":null,"abstract":"Optical transceiver modules are commonly used in telecommunication and data communications systems. These modules, which are located in the optical I/O ports at the front-end of switches and routers, are a dominating source of electromagnetic interference (EMI) problems at their operation frequency and/or harmonics. In this study, a simulation model is used to investigate the EMI coupling physics and performance of the silicon optical sub-assembly (OSA) module. Total radiation power (TRP) measurement has also been performed in a mode-stirred reverberation chamber (RC) to support the radiation mechanism analysis. The connector between the module circuit board to flex cable has been identified as the major EMI source above 15 GHz in the OSA module. This conclusion can help provide insight to EMC design engineers about the potential EMI problems in the OSA package.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"197 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122148825","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Analytical bit-error-rate analysis for multi-tone sinusoidal jitter from power supply noise 电源噪声下多音正弦抖动的分析误码率分析
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571656
Yunhui Chu, R. Chakraborty, R. Friar, Zibing Yang
{"title":"Analytical bit-error-rate analysis for multi-tone sinusoidal jitter from power supply noise","authors":"Yunhui Chu, R. Chakraborty, R. Friar, Zibing Yang","doi":"10.1109/ISEMC.2016.7571656","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571656","url":null,"abstract":"The transmitter (TX) jitter is critical to the performance of both differential and single-ended signal interfaces. The multi-tone sinusoidal jitter due to the power supply noise accounts for a major portion of the TX jitter. An analytical bit-error-rate method is proposed for accurately evaluating the impact from the multi-tone sinusoidal jitter to the channel performance, which is important for channel design and optimization. The proposed method can accurately capture the channel amplification effect and be seamlessly incorporated into the existing formulation that handles random jitter, deterministic jitter, and duty cycle distortion, etc.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120947043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Signaling margin oriented LPDDR PDN design with SIPI synthesis methodology 基于SIPI综合方法的LPDDR PDN设计
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571602
K. Cai, S. Ji, Marwan Dakroub, R. Chakraborty
{"title":"Signaling margin oriented LPDDR PDN design with SIPI synthesis methodology","authors":"K. Cai, S. Ji, Marwan Dakroub, R. Chakraborty","doi":"10.1109/ISEMC.2016.7571602","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571602","url":null,"abstract":"Signal margin oriented SIPI analytical synthesis methodology is developed for PI design with concurrence of SI design based upon PDA for LPDDR interfaces. The SIPI analytical synthesis results are well correlated with empirical Spice simulation results with circuit netlist for current and voltage waveforms, and also with lab measurements for singling margins on a particular platform with LPDDR3. Consequently, global cost competitive PDNs and optimal SI channel are achievable simultaneously with SIPI synthesis methodology for all LPDDR technologies with increasing data rate.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122245855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
EMI filter design for switching voltage regulator with improved thermal stability 改进热稳定性的开关稳压器电磁干扰滤波器设计
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571659
Jaejin Lee, Hao-han Hsu, T. Schiff
{"title":"EMI filter design for switching voltage regulator with improved thermal stability","authors":"Jaejin Lee, Hao-han Hsu, T. Schiff","doi":"10.1109/ISEMC.2016.7571659","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571659","url":null,"abstract":"An EMI filter for the switching voltage regulator is presented not only to mitigate EMI noise, but also to improve thermal stability. This filter is composed of a resistor, ferrite bead, and also Zener diodes in parallel. Simulations, circuit probing, and far-field measurements are carefully carried out to demonstrate that voltage ringing is suppressed by 13 dB and EMI noise is reduced up to 10 dB. Infrared-red (IR) images are captured to show that this solution lowers the component temperature from 94 to 82 oC, bringing the circuit from critical temperature back to safe operation temperature.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126841766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Effective, small, and inexpensive common-mode EMI reduction using inverse secondary current cancellation 有效的，小的，廉价的共模电磁干扰减少使用逆二次电流抵消
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571706
R. Elliott
{"title":"Effective, small, and inexpensive common-mode EMI reduction using inverse secondary current cancellation","authors":"R. Elliott","doi":"10.1109/ISEMC.2016.7571706","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571706","url":null,"abstract":"This paper describes implementation of a small, cheap and highly effective (10-20dB) EMI reduction method attacking the 150kHz to 3MHz range of Conducted EMI from the most notorious source. It is particularly effective where 2-wire AC input (no AC ground) is used, if 50-60Hz output leakage current is an issue, or improvement to space, cost and efficiency is desired. It reduces or eliminates traditional brute-force filtering, transformer shielding and other “conventional” methods.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127234737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Methods to reduce crosstalk in flex circuit and PCB 减少挠性电路和PCB串扰的方法
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2016-07-25 DOI: 10.1109/ISEMC.2016.7571572
G. Ouyang, L. Phan, Kai Xiao
{"title":"Methods to reduce crosstalk in flex circuit and PCB","authors":"G. Ouyang, L. Phan, Kai Xiao","doi":"10.1109/ISEMC.2016.7571572","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571572","url":null,"abstract":"This paper presents a practical method to mitigate crosstalk in flex circuit due to high density routing. The method will maintain the routing density while the signal integrity performance will be improved. Practical flex construction method is also proposed for high speed flex interconnects between two chips. The effectiveness of the method is proved by 2D/3D modeling of the flex transmission lines.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124094415","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
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