{"title":"减少挠性电路和PCB串扰的方法","authors":"G. Ouyang, L. Phan, Kai Xiao","doi":"10.1109/ISEMC.2016.7571572","DOIUrl":null,"url":null,"abstract":"This paper presents a practical method to mitigate crosstalk in flex circuit due to high density routing. The method will maintain the routing density while the signal integrity performance will be improved. Practical flex construction method is also proposed for high speed flex interconnects between two chips. The effectiveness of the method is proved by 2D/3D modeling of the flex transmission lines.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Methods to reduce crosstalk in flex circuit and PCB\",\"authors\":\"G. Ouyang, L. Phan, Kai Xiao\",\"doi\":\"10.1109/ISEMC.2016.7571572\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a practical method to mitigate crosstalk in flex circuit due to high density routing. The method will maintain the routing density while the signal integrity performance will be improved. Practical flex construction method is also proposed for high speed flex interconnects between two chips. The effectiveness of the method is proved by 2D/3D modeling of the flex transmission lines.\",\"PeriodicalId\":326016,\"journal\":{\"name\":\"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2016.7571572\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2016.7571572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Methods to reduce crosstalk in flex circuit and PCB
This paper presents a practical method to mitigate crosstalk in flex circuit due to high density routing. The method will maintain the routing density while the signal integrity performance will be improved. Practical flex construction method is also proposed for high speed flex interconnects between two chips. The effectiveness of the method is proved by 2D/3D modeling of the flex transmission lines.