IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings最新文献

{"title":"Production use of an integrated automatic defect classification (ADC) system operating in a laser confocal/white light imaging defect review station","authors":"J. Li, M. McIntyre, K. Lee, B. Worster","doi":"10.1109/ASMC.1996.557982","DOIUrl":"https://doi.org/10.1109/ASMC.1996.557982","url":null,"abstract":"This paper reports results obtained using a fully automatic defect classification package integrated in the system processor of a Laser Confocal/White Light Defect Review Tool. This system classifies defects utilizing algorithms which automatically load a cassette of wafers previously scanned by an Automatic Defect Inspection tool (ADI), aligns the wafers, and image processes to re-detect the defect. The defect region image is then analyzed for its characterization content, and the results matched with a data base of previously stored examples. System calibration is performed by presenting the system with a series of examples of each type of defect, and is edited with on-line tools provided for that purpose. We report results using the system in a production environment on a series of process levels. This effort is primarily with wafers containing logic circuitry (nonrepeating pattern). Accuracy obtained with white light only imaging is reported, as are improvements when laser confocal imaging (3-D, enhanced resolution) is added. We report also studies of optical and mechanical components of the microscope system which are critical to automatic guidelines for implementation of ADC in the production environment.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114653910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The development and optimization of the photoresist module qualification procedure","authors":"J. Thornton, R. Goodner, Ping Wang","doi":"10.1109/ASMC.1996.558024","DOIUrl":"https://doi.org/10.1109/ASMC.1996.558024","url":null,"abstract":"A new technique for qualifying and monitoring the photoresist module was optimized. Test wafers with an etched SRAM pattern were inspected before and after photoresist processing. Inspections were performed using an OSI IQ-165 patterned wafer inspection system that employs optical pattern filtering. This system is capable of increasing sensitivity without increasing inspection time. Defect source analysis (KLA 2551) was used to identify and map the defects added by the photoresist module. This technique was compared to the traditional photoresist qualification procedure that evaluates resist patterned on bare silicon wafers.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132365030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Using queueing curve approximations in a fab to determine productivity improvements","authors":"L. Sattler","doi":"10.1109/ASMC.1996.557985","DOIUrl":"https://doi.org/10.1109/ASMC.1996.557985","url":null,"abstract":"Fabs are under great pressure to produce more output with the same equipment set. However, if throughput is increased without productivity improvements, cycle time will naturally rise. Texas Instruments Incorporated is using a queueing curve approximation in order to determine a particular machine set's productivity improvements over time regardless of fab loadings. By measuring the machine set's monthly average throughput and cycle time, a fab can determine if true improvements have been made and also determine how much cycle time would increase or decrease with loadings. In order to have widespread use in fabs, a particular formula should be relatively simple and easy to use. We will discuss a queueing curve approximation and how it can be used in the fabs. We will also discuss its accuracy both under ideal conditions and conditions of data that are insufficient and/or rough approximations. Other formulation problems such as machine or lot dedication (one queue per machine versus one queue to all machines), various arrival/service time distributions and percentage improvement determination are also addressed.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134484811","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Overall equipment effectiveness in resist processing equipment","authors":"Pete Steege","doi":"10.1109/ASMC.1996.557975","DOIUrl":"https://doi.org/10.1109/ASMC.1996.557975","url":null,"abstract":"As fab equipment costs increase, semiconductor manufacturers are attempting to improve equipment utilization as a way to reduce overall cost per wafer. Photolithography equipment represents the highest percentage cost in construction of a typical fab. Flexibility in resist processing can improve the utilization of photolithography equipment. This study uses the Overall Equipment Effectiveness (OEE) model by SEMATECH to quantify the effect of flexibility on equipment utilization in a manufacturing environment. The OEE model measures three components of equipment utilization: rate of quality, availability and performance efficiency. Rate of quality can be approximated with yield data and availability is currently well measured. Performance efficiency is the least characterized component and provides the best opportunity for increasing OEE. This study focuses on the impact of flexibility in resist processing equipment on OEE. Improvements in performance efficiency and equipment utilization depend on the product being manufactured and the scale of production. Data collected at a medium-volume logic fab is presented. The effects of equipment configuration, material flow and operation efficiency are discussed.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123314610","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An advanced endpoint solution for <1% open area applications; contact and via","authors":"P. Biolsi, L. Drachnik, S. Ellinger, D. Morvay","doi":"10.1109/ASMC.1996.558094","DOIUrl":"https://doi.org/10.1109/ASMC.1996.558094","url":null,"abstract":"An advanced endpoint detection system, the EndPoint Plus/sup TM/ (EPP/sup TM/) from Lam Research Corporation, has recently been optimized and proven in production on Rainbow/sup TM/ 4520 oxide etchers at IBM Microelectronics in Essex Junction, Vermont. This paper discusses the endpoint detection and control system used on wafers with exposed etch areas ranging from 0.5% to 15%. The system correctly identified endpoint despite modern semiconductor fabrication requirements that make detection difficult. Evaluation showed that using automated endpoint detection and control increased throughput and reduced rework across a wide range of etch applications in volume manufacturing.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"211 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115584165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Single-minute exchange of die","authors":"R. Agustin, F. Santiago","doi":"10.1109/ASMC.1996.558001","DOIUrl":"https://doi.org/10.1109/ASMC.1996.558001","url":null,"abstract":"In a high volume manufacturing, fast equipment setups play an important part in maximizing the capability of our equipment. With the increasing product demands and shifting from weekly to daily scheduling sales order, its is expected that production line will be \"jerked\" to meet the needs of our customers. This is where Single-Minute Exchange of Die (SMED) application is necessary. To implement SMED in Manila, a core team was formed to drive this program. The team was composed of industrial and equipment engineers from different manufacturing operations with support from Technical Training. Focus was initially set on critical stations that have long setup times, With the application of SMED, improvements were substantial with initial data showing reduction of setup time ranging from 25% to as high as 85%. With the reduced setup time, production flexibility expanded as it was able to afford more Frequent product mix changes. In addition, machine utilization and equipment capacity went up with the reduced setup time.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115316768","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Automated metrology qualification strategy [IC measurement]","authors":"E. E. Chain","doi":"10.1109/ASMC.1996.558034","DOIUrl":"https://doi.org/10.1109/ASMC.1996.558034","url":null,"abstract":"This paper presents the methodology used to perform qualification of critical dimension (CD) SEM (Scanning Electron Microscope) tools for sub-0.5 /spl mu/m process control. A submicron pitch standard has been characterized and incorporated into an automated tool calibration and qualification procedure. After first matching individual tools to the standard, daily tool qualification is performed on a CD qualification wafer. SPC (Statistical Process Control) charts are set up to subtract line broadening effects encountered in repeated SEM measurement. The automated calibration and qualification procedures described here permit accurate measurements to be provided as is required for effective metrology support of the modern factory.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131597040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Equipment characterization and integration building a foundation for quality","authors":"G. Davis, T. Symula","doi":"10.1109/ASMC.1996.557976","DOIUrl":"https://doi.org/10.1109/ASMC.1996.557976","url":null,"abstract":"Summary form only given. Productive and cost effective use of semiconductor manufacturing equipment is a primary concern in semiconductor fabs today. As equipment costs continue to escalate, semiconductor manufacturers are focusing their efforts on Computer Integrated Manufacturing (CIM) to bolster productivity, improve yields, and reduce the cost of ownership. Equipment Integration can play a key role in these sophisticated CIM systems by bridging the gap between factory computer systems and process equipment. To implement efficient and effective equipment integration, the semiconductor manufacturer must overcome the following obstacles: high implementation costs; difficult technical implementation; long development cycles; finite resources; limited operational functionality. Specifically, the equipment's communication interface (CI) contributes to those obstacles through: Limited communication interface functionality; Unique equipment communication interfaces; Unpredictable equipment communication interfaces; Poor reuse of integration practices and software from factory to factory. Motorola is addressing these obstacles by implementing a program to improve equipment communication interface consistency, predictability, and functionality. To improve equipment communication predictability, Motorola utilizes improved CI characterization tools techniques that thoroughly exercise the equipment's CI. To improve interface consistency and functionality, Motorola is establishing partnerships with equipment vendors and characterization software suppliers. These partnerships provide the foundation for improved CI quality and adherence to SEMI standards before a product is shipped to Motorola. Mr. Guy Davis will share his perspective on how standards, procedures, and software tools can improve the quality and reduce the cost and cycletime involved in equipment integration. He will discuss the benefits realized when software suppliers, system integrators, equipment providers, and semiconductor manufacturers are working together.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125360928","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The make-or-buy problem: a multidimensional perspective of foundry decisions","authors":"J. M. Padillo, D. Meyersdorf","doi":"10.1109/ASMC.1996.557998","DOIUrl":"https://doi.org/10.1109/ASMC.1996.557998","url":null,"abstract":"This paper discusses the widely known make-or-buy problem. In the semiconductor industry this problem is generally known as the \"foundry decision\". This industry has experienced an increased level of wafer fabrication outsourcing in recent years and it is expected that manufacturers will continue to make extended use of foundries in the future. This paper advances the notion that foundry decisions should be assessed along four principal dimensions or objectives: (1) maximization of strategic competitive performance, (2) maximization of managerial performance, (3) minimization of sourcing risks, and (4) maximization of financial performance. This multiple criteria approach avoids the common pitfall of relying exclusively on financial factors when weighing the pros and cons of each sourcing alternative.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126684034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"In-line inspection to wafer test correlation","authors":"W. Tomlinson, F. Jackson, M. St. Lawrence","doi":"10.1109/ASMC.1996.557980","DOIUrl":"https://doi.org/10.1109/ASMC.1996.557980","url":null,"abstract":"A method for correlating optical in-line defects to electrically tested defects has been developed. Using this method, the validity of in-line defect categories and the possibility that they will cause a defect has been adjusted. This work was performed in one of two semiconductor fabricators at the IBM Microelectronics Division manufacturing facility in Essex Junction, Vermont.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124211286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}