{"title":"设备特性和集成是质量的基础","authors":"G. Davis, T. Symula","doi":"10.1109/ASMC.1996.557976","DOIUrl":null,"url":null,"abstract":"Summary form only given. Productive and cost effective use of semiconductor manufacturing equipment is a primary concern in semiconductor fabs today. As equipment costs continue to escalate, semiconductor manufacturers are focusing their efforts on Computer Integrated Manufacturing (CIM) to bolster productivity, improve yields, and reduce the cost of ownership. Equipment Integration can play a key role in these sophisticated CIM systems by bridging the gap between factory computer systems and process equipment. To implement efficient and effective equipment integration, the semiconductor manufacturer must overcome the following obstacles: high implementation costs; difficult technical implementation; long development cycles; finite resources; limited operational functionality. Specifically, the equipment's communication interface (CI) contributes to those obstacles through: Limited communication interface functionality; Unique equipment communication interfaces; Unpredictable equipment communication interfaces; Poor reuse of integration practices and software from factory to factory. Motorola is addressing these obstacles by implementing a program to improve equipment communication interface consistency, predictability, and functionality. To improve equipment communication predictability, Motorola utilizes improved CI characterization tools techniques that thoroughly exercise the equipment's CI. To improve interface consistency and functionality, Motorola is establishing partnerships with equipment vendors and characterization software suppliers. These partnerships provide the foundation for improved CI quality and adherence to SEMI standards before a product is shipped to Motorola. Mr. Guy Davis will share his perspective on how standards, procedures, and software tools can improve the quality and reduce the cost and cycletime involved in equipment integration. He will discuss the benefits realized when software suppliers, system integrators, equipment providers, and semiconductor manufacturers are working together.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Equipment characterization and integration building a foundation for quality\",\"authors\":\"G. Davis, T. Symula\",\"doi\":\"10.1109/ASMC.1996.557976\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. Productive and cost effective use of semiconductor manufacturing equipment is a primary concern in semiconductor fabs today. As equipment costs continue to escalate, semiconductor manufacturers are focusing their efforts on Computer Integrated Manufacturing (CIM) to bolster productivity, improve yields, and reduce the cost of ownership. Equipment Integration can play a key role in these sophisticated CIM systems by bridging the gap between factory computer systems and process equipment. To implement efficient and effective equipment integration, the semiconductor manufacturer must overcome the following obstacles: high implementation costs; difficult technical implementation; long development cycles; finite resources; limited operational functionality. Specifically, the equipment's communication interface (CI) contributes to those obstacles through: Limited communication interface functionality; Unique equipment communication interfaces; Unpredictable equipment communication interfaces; Poor reuse of integration practices and software from factory to factory. Motorola is addressing these obstacles by implementing a program to improve equipment communication interface consistency, predictability, and functionality. To improve equipment communication predictability, Motorola utilizes improved CI characterization tools techniques that thoroughly exercise the equipment's CI. To improve interface consistency and functionality, Motorola is establishing partnerships with equipment vendors and characterization software suppliers. These partnerships provide the foundation for improved CI quality and adherence to SEMI standards before a product is shipped to Motorola. Mr. Guy Davis will share his perspective on how standards, procedures, and software tools can improve the quality and reduce the cost and cycletime involved in equipment integration. He will discuss the benefits realized when software suppliers, system integrators, equipment providers, and semiconductor manufacturers are working together.\",\"PeriodicalId\":325204,\"journal\":{\"name\":\"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1996.557976\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1996.557976","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Equipment characterization and integration building a foundation for quality
Summary form only given. Productive and cost effective use of semiconductor manufacturing equipment is a primary concern in semiconductor fabs today. As equipment costs continue to escalate, semiconductor manufacturers are focusing their efforts on Computer Integrated Manufacturing (CIM) to bolster productivity, improve yields, and reduce the cost of ownership. Equipment Integration can play a key role in these sophisticated CIM systems by bridging the gap between factory computer systems and process equipment. To implement efficient and effective equipment integration, the semiconductor manufacturer must overcome the following obstacles: high implementation costs; difficult technical implementation; long development cycles; finite resources; limited operational functionality. Specifically, the equipment's communication interface (CI) contributes to those obstacles through: Limited communication interface functionality; Unique equipment communication interfaces; Unpredictable equipment communication interfaces; Poor reuse of integration practices and software from factory to factory. Motorola is addressing these obstacles by implementing a program to improve equipment communication interface consistency, predictability, and functionality. To improve equipment communication predictability, Motorola utilizes improved CI characterization tools techniques that thoroughly exercise the equipment's CI. To improve interface consistency and functionality, Motorola is establishing partnerships with equipment vendors and characterization software suppliers. These partnerships provide the foundation for improved CI quality and adherence to SEMI standards before a product is shipped to Motorola. Mr. Guy Davis will share his perspective on how standards, procedures, and software tools can improve the quality and reduce the cost and cycletime involved in equipment integration. He will discuss the benefits realized when software suppliers, system integrators, equipment providers, and semiconductor manufacturers are working together.