{"title":"在线检验与晶圆测试的相关性","authors":"W. Tomlinson, F. Jackson, M. St. Lawrence","doi":"10.1109/ASMC.1996.557980","DOIUrl":null,"url":null,"abstract":"A method for correlating optical in-line defects to electrically tested defects has been developed. Using this method, the validity of in-line defect categories and the possibility that they will cause a defect has been adjusted. This work was performed in one of two semiconductor fabricators at the IBM Microelectronics Division manufacturing facility in Essex Junction, Vermont.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"In-line inspection to wafer test correlation\",\"authors\":\"W. Tomlinson, F. Jackson, M. St. Lawrence\",\"doi\":\"10.1109/ASMC.1996.557980\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method for correlating optical in-line defects to electrically tested defects has been developed. Using this method, the validity of in-line defect categories and the possibility that they will cause a defect has been adjusted. This work was performed in one of two semiconductor fabricators at the IBM Microelectronics Division manufacturing facility in Essex Junction, Vermont.\",\"PeriodicalId\":325204,\"journal\":{\"name\":\"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings\",\"volume\":\"103 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1996.557980\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1996.557980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A method for correlating optical in-line defects to electrically tested defects has been developed. Using this method, the validity of in-line defect categories and the possibility that they will cause a defect has been adjusted. This work was performed in one of two semiconductor fabricators at the IBM Microelectronics Division manufacturing facility in Essex Junction, Vermont.
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