2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems最新文献_第2页

Thermal modelling and optimisation of hot solder dip process 热浸焊工艺的热建模与优化

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191763

S. Stoyanov, C. Bailey, P. Tollafield, R. Crawford, M. Parker, J. Scott, J. Roulston

{"title":"Thermal modelling and optimisation of hot solder dip process","authors":"S. Stoyanov, C. Bailey, P. Tollafield, R. Crawford, M. Parker, J. Scott, J. Roulston","doi":"10.1109/ESIME.2012.6191763","DOIUrl":"https://doi.org/10.1109/ESIME.2012.6191763","url":null,"abstract":"The use of electronic components with coated lead-free solder terminations in high reliability and safety products and equipment has risks for their long-term reliability caused by tin-wicker growth phenomena. A potential solution to this problem is to “re-finish” the package leads by removing the tin coating from terminations and replace with conventional tin-lead solder in a post-manufacturing process known as hot solder dip (HSD). This work presents a simulation driven approach to the characterisation of hot solder dipping, evaluation of process effect on parts' temperature gradients and heating/cooling rates, and addresses the advantages of applying an efficient model based process optimisation. Transient thermal finite element analysis is used to evaluate the temperature distribution in a Quad Flat Package (QFP) during a double-dip hot solder dipping process developed by Micross Components Ltd. A full detailed three-dimensional model of the 208-pin 0.5 mm pitch component is developed using comprehensive characterisation of the package structure and materials based on X-Ray, SEM-EDX, cross-sectional metallurgy and 3D CT scan. Thermo-coupled measurements are compared with model temperature predictions. Model and experimental results have been used to inform the process optimisation strategy. Optimised process settings resulting in temperature ramp rates at die level within recommended manufacture's limit are identified.","PeriodicalId":319207,"journal":{"name":"2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124142380","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

A comparison study of the prognostics approaches to Light Emitting Diodes under accelerated aging 加速老化下发光二极管预测方法的比较研究

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191783

Thamo Sutharssan, C. Bailey, S. Stoyanov

{"title":"A comparison study of the prognostics approaches to Light Emitting Diodes under accelerated aging","authors":"Thamo Sutharssan, C. Bailey, S. Stoyanov","doi":"10.1109/ESIME.2012.6191783","DOIUrl":"https://doi.org/10.1109/ESIME.2012.6191783","url":null,"abstract":"Light Emitting Diode (LED) lighting systems are being implemented as a future light source in many sectors. They have advantages such as power efficiency, higher reliability, small in size, faster switching speed, etc. Previous research has shown that same types of LEDs, from same manufacturer may have significantly different characteristics and behaviour under similar operating condition. These findings indicate the difficulties in assessing and maintaining the LED lighting systems in the field after their deployment, particularly in the case of safety critical, emergency and harsh environment applications. This paper demonstrates two different prognostics and health management (PHM) approach namely data driven and model driven approach to assess the reliability and predict the remaining useful lifetime (RUL) of LED lighting systems in the field. Focus of this paper is to compare the performance of these two different modelling approaches under thermal and electrical overstress conditions. Results indicate the predictions made by model driven and data driven approach are within the reasonable limit and hence they can be used to predict the catastrophic failures caused by the thermal and electrical overstress in the field. Both techniques gain accuracy as time progresses and make better prediction closer to failure. This paper will also propose a fusion based approach to increase the accuracy of the prediction at the early stage of use. This will provide benefits in terms of planning and maintenance for large scale LED deployment especially in the safety critical applications.","PeriodicalId":319207,"journal":{"name":"2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124227686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards 湿度对印刷电路板电磁辐射影响的测量与模拟

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191795

H. Fridhi, G. Duchamp, V. Vigneras, A. Guédon-Gracia, J. Delétage, H. Frémont

引用次数: 0

Simulation-based prediction of reliability and robustness of interconnect systems for semiconductor applications 基于仿真的半导体互连系统可靠性和鲁棒性预测

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191800

M. Ackermann, V. Hein, K. Weide-Zaage

引用次数: 1

Consistent analytical model for single and dual thickness capacitive Micromachined Ultrasound Transducers (cMUT) 单、双厚度电容式微机械超声换能器(cMUT)的一致性分析模型

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191803

X. Rottenberg, A. Erişmiş, P. Czarnecki, P. Hélin, A. Verbist, H. Tilmans

引用次数: 3

Simulation of diffusion controlled intermetallic formation of Au/Al interface 扩散控制Au/Al界面金属间形成的模拟

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191791

Rui Huang, Y. Y. Tan, J. Walter, H. Pape, Xuejun Fan, H. Koerner

引用次数: 4

Assessment of thermo-mechanical stresses in Low Temperature Joining Technology 低温连接工艺中热机械应力的评估

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191762

T. Herboth, C. Fruh, M. Gunther, J. Wilde

引用次数: 27

A simplified and meaningful crack propagation model in silicon for microelectronic power devices 一种简化且有意义的微电子功率器件硅裂纹扩展模型

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191721

D. Calvez, F. Roqueta, S. Jacques, S. Ducret, L. Béchou, Y. Ousten

引用次数: 1

Experimental and numerical assessment of adhesion in real-life MEMS 实际MEMS中黏附的实验与数值评估

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191767

R. Ardito, L. Baldasarre, A. Corigliano, B. de Masi, A. Frangi, L. Magagnin

引用次数: 1

Thermal performance evaluation of SiC power devices packaging SiC功率器件封装热性能评价

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI: 10.1109/ESIME.2012.6191731

A. Gracia, S. Azzopardi, E. Woirgard

引用次数: 6