Design, Test, Integration, and Packaging of MEMS/MOEMS最新文献_第9页

Measurement of surface profile of microstructure 显微组织表面轮廓的测量

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341284

M. Zhou, Linbo Bai, Zhanzhan Li, Hanmin Yao

引用次数: 2

Characteristics of residual products in HF gas-phase etching of sacrificial oxides for silicon micromachining 硅微加工牺牲氧化物HF气相刻蚀残余产物特性

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341163

W. Jang, C. Choi, C. S. Lee, Yoonshik Hong, Jong-Hyun Lee

引用次数: 2

Advanced integrated solution for MEMS design 先进的MEMS设计集成解决方案

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341194

K. Liateni, D. Moulinier, B. Affour, H. Boutamine, J. Karam, D. Veychard, B. Courtois, A. Cao

引用次数: 2

DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials DEM技术:一种新的非硅材料三维微加工技术

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341181

Di Chen, Dacheng Zhang, G. Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, B. Cai

引用次数: 1

Design of spatial light modulator microdevices: microslit arrays 空间光调制器微器件的设计:微缝阵列

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341227

R. Riesenberg, T. Seifert

{"title":"Design of spatial light modulator microdevices: microslit arrays","authors":"R. Riesenberg, T. Seifert","doi":"10.1117/12.341227","DOIUrl":"https://doi.org/10.1117/12.341227","url":null,"abstract":"Spatial light modulators are the well known digital mirror devices (DMD), micromechanical switching arrays and arrays of micro Fabry-Perots. As a new design micro slit arrays are presented. A micromachining technology was developed for microfabrication. Slits with dimensions of 3 micrometers ...1 mm were prepared on a membrane with a thickness of 1 micrometers . The aspect ratio is excellent. Dimensions down to optical aberration corrected limitation of microdevices and nearly down to light wavelength can be realized. Designs are addressable micro slit arrays in two membrane technology and coded micro slit arrays in one and two membrane architecture with more than 100 elements. Their principles, the design and their optical performance are discussed. The future application of these spatial light modulator microdevices is the digital light processing. The performance for example of a microspectrometer with the micro slit array is the increase of spectral resolution up to the factor of 2.6 based on generation of additional subpixels and simultaneously the increase of signal to noise ratio up to the factor of 10 and the parallelization by more than 100 modulator elements or light sources and its multiplexing. The application of micro slit arrays for realization of the HADAMARD principle is presented.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126633466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

MEMS for space applications MEMS用于空间应用

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341193

L. Miller

引用次数: 28

Integrated simulator for MEMS using FEM implementation in AHDL and frontal solver for large sparse systems of equations 基于AHDL的微机电系统集成仿真器，采用FEM实现，采用正面求解器求解大型稀疏方程组

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341214

Z. Mrcarica, V. Risojevic, M. Lenczner, M. Jakovljević, V. Litovski

{"title":"Integrated simulator for MEMS using FEM implementation in AHDL and frontal solver for large sparse systems of equations","authors":"Z. Mrcarica, V. Risojevic, M. Lenczner, M. Jakovljević, V. Litovski","doi":"10.1117/12.341214","DOIUrl":"https://doi.org/10.1117/12.341214","url":null,"abstract":"MEMS that exhibit strong coupling between electronics and mechanics need to be described and simulated in a united simulation environment, in order to achieve more flexibility from the description point of view, and to avoid convergence problems. Behavioral simulators and analogue hardware description languages enable modeling of MEMS. Even space- continuous mechanical problems can be described in the hardware description language. That description should and can be automated. Space-discretization commonly leads to very large system of equations. For solving such systems, mechanical FEM simulators usually exploit iterative algorithms that have very low memory demands. However, if the problem at hand contains electronics, as in the case of intelligent materials, iterative methods might be not applicable, since the convergence is not guaranteed anymore. In our behavioral simulator we have implemented a frontal solver, enabling solution of very large sparse matrices with modest main memory resources by storing only part of the matrix at the time. Thermal problems with more than 20000 nodes have been simulated.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"117 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124906246","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Preliminary results on the use of mirrors for LIGA process LIGA工艺用反射镜的初步结果

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341158

S. Megtert, Franz J. Pantenburg, S. Achenbach, R. Kupka, J. Mohr, M. Roulliay

{"title":"Preliminary results on the use of mirrors for LIGA process","authors":"S. Megtert, Franz J. Pantenburg, S. Achenbach, R. Kupka, J. Mohr, M. Roulliay","doi":"10.1117/12.341158","DOIUrl":"https://doi.org/10.1117/12.341158","url":null,"abstract":"A double mirror system has been studied and realized for purposes of Deep x-ray Lithography/LIGA. Because structuring high aspect ratio resist ask for high photon flux to maintain exposure time compatible with industrial process, hard x-ray synchrotron radiation is necessary and its broadband spectrum is normally used. However one would need to shape this spectrum on both low and high-energy parts. The former may lead to resist surface overdoes and is treated by means of appropriate filters. The later is prejudicial at resist-metallic substrate interface where high-energy photons are preferentially absorbed giving rise to extra-dose even behind absorber patterns. This may result in microstructures adhesion break down for positive resist and incomplete dissolution for negative tone ones. A mirror set up in the upstream beam-line is a correct answer to prevent these effects. The association of filters and mirror gives an adjustable band-pass filter to fit almost exposure requirements in deep x-ray lithography. Preliminary result of such a system are presented concerning its band-pass filter character, flux performances and first comparative effects on resist microstructures.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"297 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122482762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Design of MEMS and microsystems MEMS与微系统设计

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341196

D. Nagel

引用次数: 5

Manufacturing of microstructures using ultraprecision machine tools 使用超精密机床制造微结构

Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341232

M. Weck, S. Fischer

{"title":"Manufacturing of microstructures using ultraprecision machine tools","authors":"M. Weck, S. Fischer","doi":"10.1117/12.341232","DOIUrl":"https://doi.org/10.1117/12.341232","url":null,"abstract":"The fabrication of microstructured workpieces with conventional manufacturing methods, such as turning, milling, shaping or drilling--imposes high demands on the machine behavior and the tool properties. The requirements in terms of machine characteristics are currently met by only few machine tools. An ultra precision milling machine which permits microstructures to be manufactured with optical quality has been designed and built at the IPT in Aachen. Using natural diamond cutting tools, a broad range of materials like, for example non-ferrous metals or plastics, can be machined, producing real 3D-structures with a surface roughness of below 5 nm Ra. Only the diamond can be sharped to the required level of accuracy. Cutting edge sharpness and rounded are crucial to the manufacturing quality of the work piece. Minimum structure sizes in the submicron range and aspect ratios of more than hundred have been achieved by diamond matching at the IPT. Even small series or prototypes can be manufactured flexible and cost- effectively when mechanical cutting techniques are applied. Parts can be mass-produced cheaply when reproduction techniques, such as galvanic forming, injection molding or stamping are applied.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133211121","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9