DEM技术:一种新的非硅材料三维微加工技术

Di Chen, Dacheng Zhang, G. Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, B. Cai
{"title":"DEM技术:一种新的非硅材料三维微加工技术","authors":"Di Chen, Dacheng Zhang, G. Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, B. Cai","doi":"10.1117/12.341181","DOIUrl":null,"url":null,"abstract":"DEM technique developed by present authors is a new 3D micro fabrication technique for non-silicon materials such as metals, plastics and ceramics. In comparison with LIGA technique, it does not need expensive synchrotron radiation source and x-ray masks. DEM technique has both advantages of bulk silicon micro fabrication technique and LIGA technique. In the present research, we obtained metallic mold insert with structure depth of 180 micrometers and aspect ratio more than 20. A successful development of DEm technique opens a new way for 3D micro fabrication of non-silicon materials.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials\",\"authors\":\"Di Chen, Dacheng Zhang, G. Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, B. Cai\",\"doi\":\"10.1117/12.341181\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"DEM technique developed by present authors is a new 3D micro fabrication technique for non-silicon materials such as metals, plastics and ceramics. In comparison with LIGA technique, it does not need expensive synchrotron radiation source and x-ray masks. DEM technique has both advantages of bulk silicon micro fabrication technique and LIGA technique. In the present research, we obtained metallic mold insert with structure depth of 180 micrometers and aspect ratio more than 20. A successful development of DEm technique opens a new way for 3D micro fabrication of non-silicon materials.\",\"PeriodicalId\":318748,\"journal\":{\"name\":\"Design, Test, Integration, and Packaging of MEMS/MOEMS\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-03-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Design, Test, Integration, and Packaging of MEMS/MOEMS\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.341181\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Design, Test, Integration, and Packaging of MEMS/MOEMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.341181","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文提出的DEM技术是一种新型的金属、塑料、陶瓷等非硅材料的三维微加工技术。与LIGA技术相比,它不需要昂贵的同步加速器辐射源和x射线掩模。DEM技术具有体硅微加工技术和LIGA技术的优点。在本研究中,我们获得了结构深度为180微米,长径比大于20的金属模具镶件。DEm技术的成功发展为非硅材料的三维微加工开辟了新的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials
DEM technique developed by present authors is a new 3D micro fabrication technique for non-silicon materials such as metals, plastics and ceramics. In comparison with LIGA technique, it does not need expensive synchrotron radiation source and x-ray masks. DEM technique has both advantages of bulk silicon micro fabrication technique and LIGA technique. In the present research, we obtained metallic mold insert with structure depth of 180 micrometers and aspect ratio more than 20. A successful development of DEm technique opens a new way for 3D micro fabrication of non-silicon materials.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信